| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/20/1993 | EP0523800A1 An overvoltage protected semiconductor switch |
| 01/20/1993 | EP0523791A2 Method of providing a copper pattern on a dielectric substrate |
| 01/20/1993 | EP0523730A1 Coaxial wire for bonding semiconductors |
| 01/20/1993 | EP0523598A1 Ceramics circuit board |
| 01/20/1993 | EP0523515A1 Heat sink, method of manufacturing the same, and device of manufacturing the same |
| 01/20/1993 | EP0523479A2 Method for fabricating metal core layers for a multi-layer circuit board |
| 01/20/1993 | EP0523450A1 Inductance element |
| 01/20/1993 | EP0523387A2 Semiconductor chip module and method for manufacturing the same |
| 01/20/1993 | EP0414852A4 Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
| 01/19/1993 | US5181167 Stacking heatpipe for three dimensional electronic packaging |
| 01/19/1993 | US5181097 Phenolic and epoxy resins |
| 01/19/1993 | US5181096 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer |
| 01/19/1993 | US5181087 Filed effect transistor, recessed gate electrode |
| 01/19/1993 | US5180691 Silicone ladder polymer |
| 01/19/1993 | US5180688 Silicon nitride |
| 01/19/1993 | US5180687 Electroconductive |
| 01/19/1993 | US5180625 Ceramic aluminum laminate and thermally conductive adhesive therefor |
| 01/19/1993 | US5180468 Doping a silicon substrate and heat treatment |
| 01/19/1993 | US5180311 Resilient interconnection bridge |
| 01/19/1993 | US5180001 Heat transfer member |
| 01/19/1993 | CA2008953C Connector for integrated circuit packages |
| 01/19/1993 | CA1312843C Fabrication of electronic devices utilizing lithographic techniques |
| 01/17/1993 | CA2073155A1 Dual curing composition and use thereof |
| 01/16/1993 | CA2073787A1 Electronic packages and smart structures formed by thermal spray deposition and method of making same |
| 01/14/1993 | DE4122362A1 Anordnung und verfahren zum kontaktieren von leitenden schichten Arrangement and process for any contact with conductive layers |
| 01/14/1993 | DE4120766A1 Structured superconducting conductor strips - formed by epitaxial growth on suitable substrate |
| 01/13/1993 | EP0522799A2 Dielectric deposition |
| 01/13/1993 | EP0522593A1 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon |
| 01/13/1993 | EP0522563A2 Semiconductor chip module and method of manufacturing the same |
| 01/13/1993 | EP0522518A2 Stacked chip assembly and manufacturing method therefor |
| 01/13/1993 | EP0522461A1 Sealed flip chip semiconductor device |
| 01/13/1993 | EP0522333A1 Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions |
| 01/13/1993 | EP0366744B1 Improved retention means for chip carrier sockets |
| 01/13/1993 | CN1068007A Making method fo multi-layer electronic circuit |
| 01/13/1993 | CA2072385A1 Heat sink, method of manufacturing the same, and device of manufacturing the same |
| 01/13/1993 | CA2072377A1 Semiconductor chip module and method of manufacturing the same |
| 01/12/1993 | US5179506 Securing component arrangement |
| 01/12/1993 | US5179500 Vapor chamber cooled electronic circuit card |
| 01/12/1993 | US5179435 Resin sealed semiconductor integrated circuit device |
| 01/12/1993 | US5179434 Semiconductor device and manufacturing method thereof |
| 01/12/1993 | US5179188 Crosslinkable fluorinated aromatic ether composition |
| 01/12/1993 | US5179185 High purity hydroxy-terminated phenyl ladder polysiloxane and method for producing the same |
| 01/12/1993 | US5179043 Vapor deposited micro heat pipes |
| 01/12/1993 | US5179041 Lamination, annealing |
| 01/12/1993 | US5179039 Injection molding |
| 01/12/1993 | US5178934 Multilayer ceramic made by applying metal layer to ceramic substrate, applying over metal /1/green ceramic tape, layer of organic plasticizer-glass ceramic particle mixture, ceramic or glass/ceramic composite and /2/layer of hollow microspheres |
| 01/12/1993 | US5178050 Die for use in fine press working |
| 01/12/1993 | US5177863 Method of forming integrated leadouts for a chip carrier |
| 01/11/1993 | CA2072734A1 Semiconductor device |
| 01/10/1993 | CA2073363A1 Stacked chip assembly and manufacturing method therefor |
| 01/07/1993 | WO1993000785A1 Integrated-circuit design with reduced number of power/ground pins and improved power distribution |
| 01/07/1993 | WO1993000708A1 Structured conductor tracks and process for making them |
| 01/07/1993 | WO1993000707A1 Electronic package and method for lead forming |
| 01/07/1993 | WO1993000706A1 Semiconductor package and method for packaging same |
| 01/07/1993 | WO1993000705A1 Package structure of semiconductor device and manufacturing method therefor |
| 01/07/1993 | WO1993000704A1 Method of blasting ic frame and apparatus therefor |
| 01/07/1993 | WO1993000703A1 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 01/07/1993 | EP0521735A1 Semiconductor memory control device and method of mounting same in high density |
| 01/07/1993 | EP0521720A1 Heat-dissipating multi-layer circuit board |
| 01/07/1993 | EP0521672A1 Integrated circuit interconnection technique |
| 01/07/1993 | EP0521483A2 Printed circuit board and semiconductor chip carrier sheet |
| 01/07/1993 | EP0521441A1 Insulated support for semiconductor device and method for manufacturing the same |
| 01/07/1993 | EP0521405A1 Heat radiating component and semiconductor device provided with the same |
| 01/07/1993 | EP0521338A1 Method and arrangement for soldering surface mounted components on printed circuit boards |
| 01/07/1993 | EP0521335A1 Surface-mounting type semiconductor package having an improved efficiency for heat dissipation |
| 01/07/1993 | EP0521163A1 Aluminum alloy wiring layer, manufacturing thereof, and aluminum alloy sputtering target |
| 01/07/1993 | EP0521144A1 Manufacturing multilayer ceramic substrate |
| 01/07/1993 | DE4122297A1 Electronic or optical appts. esp. semiconductor appts. - having junctions in the form of metallised bonding pads |
| 01/05/1993 | US5177670 Capacitor-carrying semiconductor module |
| 01/05/1993 | US5177669 Molded ring integrated circuit package |
| 01/05/1993 | US5177668 Arrangement of an integrated circuit on a circuit board |
| 01/05/1993 | US5177667 Thermal conduction module with integral impingement cooling |
| 01/05/1993 | US5177660 Biodegradable and recyclable electrostatically shielded packaging for electronic devices and media |
| 01/05/1993 | US5177596 Electronic component mounting structures for fpc tape carrier and methods of separation and application |
| 01/05/1993 | US5177595 Microchip with electrical element in sealed cavity |
| 01/05/1993 | US5177594 Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
| 01/05/1993 | US5177593 Display device with LEDs having a reduction of the thermal expansion coefficients among the associated components |
| 01/05/1993 | US5177590 Semiconductor device having bonding wires |
| 01/05/1993 | US5177588 Coating flattens uneven surface; no poisoned via |
| 01/05/1993 | US5177502 Arrangement for detachably fastening modules to a module carrier |
| 01/05/1993 | US5177498 Heat-resistant insulating substrate, thermal printing head, and thermographic apparatus |
| 01/05/1993 | US5177352 Integrated optical tamper sensor with planar waveguide |
| 01/05/1993 | US5177326 Lead wire array for a leadless chip carrier |
| 01/05/1993 | US5177032 Heating to soften, cooling to bond |
| 01/05/1993 | US5176811 Electrodeposition, ammonium ion to reduce adhesion loss |
| 01/05/1993 | US5176366 Resin-encapsulated semiconductor device package with nonconductive tape embedded between outer lead portions |
| 01/05/1993 | US5176310 Method and apparatus for wire bond |
| 01/05/1993 | US5176255 Lead frame for integrated circuits or the like and method of manufacture |
| 01/04/1993 | CA2072277A1 Inductance element |
| 01/03/1993 | CA2072817A1 Multi-layer circuit board |
| 12/30/1992 | EP0520841A1 Composite flip chip semi-conductor device and method for making and burning-in the same |
| 12/30/1992 | EP0520740A1 Electrically connectable module |
| 12/30/1992 | EP0520702A2 Interconnect for integrated circuits |
| 12/30/1992 | EP0520681A1 Electronic device interconnection technique |
| 12/30/1992 | EP0520679A2 Method of forming a premolded package assembly |
| 12/30/1992 | EP0520638A1 IC socket |
| 12/30/1992 | EP0520490A1 Integrated circuit device having improved post for surface-mount package |
| 12/30/1992 | EP0520434A1 Integrated socket-type package for flip chip semiconductor devices and circuits |
| 12/30/1992 | EP0520295A1 Method and device for forming external connections in surface mounted components |
| 12/30/1992 | EP0520294A1 Semiconductor device and method of manufacturing the same |