| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/10/1993 | EP0526468A1 Diamond-on-a-substrate for electronic applications |
| 02/10/1993 | EP0526456A1 A multi-layer package incorporating a recessed cavity for a semiconductor chip. |
| 02/10/1993 | EP0526450A1 Multilayer thin film wiring process featuring self-alignment of vias |
| 02/10/1993 | EP0511218A4 Fabricating eletronic circuitry unit containing stacked ic layers having lead rerouting |
| 02/09/1993 | US5185690 High dielectric constant sheet material |
| 02/09/1993 | US5185654 Electrostatic RF absorbant circuit carrier assembly and method for making the same |
| 02/09/1993 | US5185653 O-ring package |
| 02/09/1993 | US5185652 Electrical connection between buses on a semiconductor integrated circuit |
| 02/09/1993 | US5185651 Integrated circuit with current detection |
| 02/09/1993 | US5185650 High-speed signal transmission line path structure for semiconductor integrated circuit devices |
| 02/09/1993 | US5185502 High power, high density interconnect apparatus for integrated circuits |
| 02/09/1993 | US5185294 Boron out-diffused surface strap process |
| 02/09/1993 | US5185291 Method of making severable conductive path in an integrated-circuit device |
| 02/09/1993 | US5185283 Method of making master slice type integrated circuit device |
| 02/09/1993 | CA2075593A1 Semiconductor chip module and method for manufacturing the same |
| 02/09/1993 | CA2021285C Ceramic multilayer wiring substrate |
| 02/09/1993 | CA1313569C Electrical switching device |
| 02/04/1993 | WO1993002540A1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits |
| 02/04/1993 | WO1993002539A1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits |
| 02/04/1993 | WO1993002473A1 Voltage programmable links for integrated circuits |
| 02/04/1993 | DE4222791A1 Coil with metallic core integrated in semiconductor device - uses 3 metallisation layers which are selectively interconnected |
| 02/04/1993 | DE4203114A1 Tape carrier for semiconductor appts. - involves tape body transport perforations, window accommodating semiconductor components, inner feeds and test electrodes |
| 02/04/1993 | DE4125420A1 Electrically high grade binder for printed circuit board - contg. bisphenol=A di:cyanate, bisphenol=A epoxide] resin and opt. brominated bisphenol=A |
| 02/03/1993 | EP0526272A1 Glasses for electronic substrates and products thereof |
| 02/03/1993 | EP0526243A1 Via hole structure and process |
| 02/03/1993 | EP0526147A2 Film-carrier type semiconductor device and process for fabricating the same |
| 02/03/1993 | EP0526133A2 Polyimide multilayer wiring substrate and method for manufacturing the same |
| 02/03/1993 | EP0526107A1 Stepped multilayer interconnection apparatus and method of making the same |
| 02/03/1993 | EP0526063A1 Integrated circuit package with laminated backup cell and interconnect media therefor |
| 02/03/1993 | EP0525934A1 Pinch clip lid for non-hermetic packages |
| 02/03/1993 | EP0525824A2 A semiconductor device having metal wiring layers and method of manufacturing such a device |
| 02/03/1993 | EP0525810A1 A constant impedance transition between transmission structures of different dimensions |
| 02/03/1993 | EP0525651A1 Package structure for one or more IC chips |
| 02/03/1993 | EP0525644A1 Circuit substrate for mounting a semiconductor element |
| 02/03/1993 | EP0525637A1 Method for the formation of tin barrier layer with preferential (111) crystallographic orientation |
| 02/03/1993 | EP0525587A1 Field effect controllable semi-conductor device |
| 02/03/1993 | EP0525517A1 Method of filling at least one contact hole in an insulating layer |
| 02/03/1993 | EP0525087A1 Crosslinkable fluorinated aromatic ether compositions |
| 02/03/1993 | EP0524930A1 Fluorinated poly(arylene ethers). |
| 02/03/1993 | CN1068681A Method for manufacturing semiconductor device |
| 02/02/1993 | US5184285 Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor |
| 02/02/1993 | US5184284 Method and apparatus for implementing engineering changes for integrated circuit module |
| 02/02/1993 | US5184235 Active matrix liquid crystal display panel with an electrostatic protection circuit |
| 02/02/1993 | US5184211 Apparatus for packaging and cooling integrated circuit chips |
| 02/02/1993 | US5184210 Structure for controlling impedance and cross-talk in a printed circuit substrate |
| 02/02/1993 | US5184209 Ic card and manufacturing method therefor |
| 02/02/1993 | US5184208 Semiconductor device |
| 02/02/1993 | US5184207 Semiconductor die packages having lead support frame |
| 02/02/1993 | US5184206 Direct thermocompression bonding for thin electronic power chips |
| 02/02/1993 | US5184205 Semiconductor device having multi-layered wiring, and method of manufacturing the same |
| 02/02/1993 | US5184095 Constant impedance transition between transmission structures of different dimensions |
| 02/02/1993 | US5183972 Matching thermal coefficients of expansion of substrate and dielectric layer; high density, high performance circuits |
| 02/02/1993 | US5183969 Epoxy resin which changes color on curing; opeining to visualize change |
| 02/02/1993 | US5183800 Interconnection method for semiconductor device comprising a high-temperature superconductive material |
| 02/02/1993 | US5183784 Bonding semiconductor |
| 02/02/1993 | US5183724 Method of producing a strip of lead frames for integrated circuit dies in a continuous system |
| 02/02/1993 | US5183711 Metallic ground layer on insulative film; electrically conductive filler in holes; prevents crosstalk |
| 02/02/1993 | US5183104 Closed-cycle expansion-valve impingement cooling system |
| 02/02/1993 | US5182853 Method for encapsulting IC chip |
| 02/02/1993 | US5182851 Method for holding a strip of conductive lead frames |
| 02/02/1993 | CA1313427C Hermetic package for integrated circuit chips |
| 02/02/1993 | CA1313425C Automatic routing method using prioritized routability indices |
| 01/28/1993 | DE4224567A1 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin |
| 01/28/1993 | DE4124289A1 Electric circuit cooling by waste heat convection - converting at least part of developed heat via contact terminals immersed in coolant |
| 01/27/1993 | EP0524818A1 Multi-layer wiring structure in a semiconductor device and method of manufacturing the same |
| 01/27/1993 | EP0524763A2 RF device package |
| 01/27/1993 | EP0524761A1 Plastic pin grid array package |
| 01/27/1993 | EP0524757A1 Liquid coolant circulating system |
| 01/27/1993 | EP0524754A2 A film wiring and a method of its fabrication |
| 01/27/1993 | EP0524724A2 Protection of integrated circuit devices |
| 01/27/1993 | EP0524189A1 Optically compensated bipolar transistor |
| 01/27/1993 | CN1068444A Semiconductor device and manufacturing method thereof |
| 01/26/1993 | US5182632 High density multichip package with interconnect structure and heatsink |
| 01/26/1993 | US5182631 Film carrier for RF IC |
| 01/26/1993 | US5182630 Semiconductor device having a particular shaped die pad and coated lower surface |
| 01/26/1993 | US5182629 Integrated circuit die having a power distribution system for at least ten-thousand bipolar logic cells |
| 01/26/1993 | US5182628 Semiconductor device having particular solder interconnection arrangement |
| 01/26/1993 | US5182627 Interconnect and resistor for integrated circuits |
| 01/26/1993 | US5182424 Module encapsulation by induction heating |
| 01/26/1993 | US5182420 Method of fabricating metallized chip carriers from wafer-shaped substrates |
| 01/26/1993 | US5182235 Manufacturing method for a semiconductor device having a bias sputtered insulating film |
| 01/26/1993 | US5182231 Method for modifying wiring of semiconductor device |
| 01/26/1993 | US5182071 Method of molding a carrier ring to leads |
| 01/26/1993 | US5181859 Electrical connector circuit wafer |
| 01/25/1993 | CA2074575A1 Packaging structure for one or more ic chips |
| 01/21/1993 | WO1993001701A1 Circuit card assembly conduction converter and method |
| 01/21/1993 | WO1993001648A1 Low impedance bus for power electronics |
| 01/21/1993 | WO1993001619A1 Moisture relief for chip carriers |
| 01/21/1993 | WO1993001618A1 Arrangement and process for contacting conductive layers |
| 01/21/1993 | WO1993001617A1 Method for the manufacture of a semiconductor component |
| 01/21/1993 | WO1993001013A1 Assembly apparatus |
| 01/21/1993 | DE4223280A1 Switching circuit carrier component - comprising appts. arranged between electrodes of two carriers |
| 01/21/1993 | DE4222785A1 Improvement of high frequency operation of discrete MOSFET - by removal of an external parasitic capacitance between drain and gate, by mounting the external gate contact above the source contact |
| 01/21/1993 | DE4123900A1 Protective coating for wafers - is of lacquer contg. polymer soluble in water or alcohol e.g. acrylate] or acrylamide] |
| 01/21/1993 | DE4123633A1 Electronic module with metal housing - contains circuit board with semiconductor components and metal strips |
| 01/21/1993 | DE4123512A1 Werkzeugmaschine mit kurvengetriebe, insbesondere zum stanzen und formen der anschlussbeinchen von integrierten schaltkreisen Machine tool with winding gear, especially to the punch and shaping the lead of integrated switching circuits |
| 01/21/1993 | CA2113172A1 Low impedance bus for power electronics |
| 01/20/1993 | EP0524038A1 Method of wiring the external leads of a housing and the hybrid elements |
| 01/20/1993 | EP0524015A2 Socket |
| 01/20/1993 | EP0523981A1 Method of making electronic packages and smart structures formed by thermal spray deposition |