| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/10/1993 | EP0531128A1 Semiconductor device with fuse |
| 03/10/1993 | EP0530758A2 Semiconductor package for flip-chip mounting process |
| 03/10/1993 | EP0530377A1 Semiconductor sealing resin tablet and its manufacture |
| 03/10/1993 | EP0333803B1 Oxide removal from metallic contact bumps formed on semiconductor devices to improve hybridization cold-welds |
| 03/10/1993 | EP0290501B1 Method and apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
| 03/09/1993 | US5193053 Plastic packaged semiconductor device |
| 03/09/1993 | US5192995 Electric device utilizing antioxidation film between base pad for semiconductor chip and organic encapsulating material |
| 03/09/1993 | US5192835 Bonding of solid state device to terminal board |
| 03/09/1993 | US5192716 Packaging |
| 03/09/1993 | US5192715 Process for avoiding spin-on-glass cracking in high aspect ratio cavities |
| 03/09/1993 | US5192713 Method of manufacturing semiconductor devices having multi-layered structure |
| 03/09/1993 | US5192682 Manufacturing method for thin semiconductor device assemblies |
| 03/09/1993 | US5192622 Electronics |
| 03/09/1993 | CA1314354C Encapsulating compositions |
| 03/09/1993 | CA1314304C Electrostatic discharge protection for electronic packages |
| 03/04/1993 | WO1993004502A1 Metal heat sink attach system |
| 03/04/1993 | WO1993004501A1 High performance passivation for semiconductor devices |
| 03/04/1993 | WO1993004500A1 Distributed clock tree scheme in semiconductor packages |
| 03/04/1993 | WO1993004499A1 An improved antifuse and method of manufacture thereof |
| 03/04/1993 | WO1993004498A1 Lead-on-chip integrated circuit fabrication method and apparatus |
| 03/04/1993 | WO1993003871A1 Improved ceramic package |
| 03/04/1993 | DE4228529A1 Passivation of semiconductor wafers to minimise stress and thin film cracking - using 1st layer which after planarisation encloses the metallisation pattern and further layers to provide specific protection |
| 03/04/1993 | DE4128936A1 Sprung holder for electronic component cooler - has integral plastics body with coaxial guide for holder and cooler displacement |
| 03/03/1993 | EP0530051A2 A semiconductor device and a method for producing the same |
| 03/03/1993 | EP0529837A1 Method and apparatus for cooling multi-chip modules using integral heatpipe technology |
| 03/03/1993 | EP0529820A1 Elevated metal-to-metal antifuse structures and fabrication processes |
| 03/03/1993 | EP0529752A2 Via metallization for A1N ceramic electronic package |
| 03/03/1993 | EP0529717A2 Method of manufacturing a semiconductor device having overlapping contacts |
| 03/03/1993 | EP0529656A2 Interconnection forming method |
| 03/03/1993 | EP0529503A1 Flexible attachment flip-chip assembly |
| 03/03/1993 | EP0529392A1 A high-vacuum substrate enclosure |
| 03/03/1993 | EP0529298A2 Method for making thick film/solder joints |
| 03/03/1993 | CN1020029C 半导体器件 Semiconductor devices |
| 03/02/1993 | USH1153 Non-metallized chip carrier |
| 03/02/1993 | US5191550 Dual antifuse memory device |
| 03/02/1993 | US5191512 Heat sink/circuit board assembly |
| 03/02/1993 | US5191511 Semiconductor device including a package having a plurality of bumps arranged in a grid form as external terminals |
| 03/02/1993 | US5191405 Aluminum and tungsten wires |
| 03/02/1993 | US5191404 High density memory array packaging |
| 03/02/1993 | US5191403 Resin-sealed semiconductor device having a particular mold resin structure |
| 03/02/1993 | US5191402 Semiconductor device having an inter-layer insulating film disposed between two wiring layers |
| 03/02/1993 | US5191241 Programmable interconnect architecture |
| 03/02/1993 | US5191224 Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein |
| 03/02/1993 | US5190995 Polyepoxides, block polymer with polysiloxane |
| 03/02/1993 | US5190893 Process for fabricating a local interconnect structure in a semiconductor device |
| 03/02/1993 | US5190890 High temperature, high power, corrosion resistant |
| 03/02/1993 | US5190601 Surface structure of ceramics substrate and method of manufacturing the same |
| 03/02/1993 | US5190595 Ozone safe stripping solution for thermal grease |
| 03/02/1993 | US5190099 Pulsatile impinging cooling system for electronic IC modules and systems using fluidic oscillators |
| 02/27/1993 | CA2094928A1 Heat-accumulating material and use thereof |
| 02/27/1993 | CA2071778A1 Low dielectric inorganic composition for multilayer ceramic package |
| 02/25/1993 | DE4206278A1 Integriertes schaltkreis-bauelement mit unterdrueckten stromversorgungsstoerungen Integrated-circuit-component-with oppressed stromversorgungsstoerungen |
| 02/24/1993 | EP0528684A2 Thin type semiconductor device |
| 02/24/1993 | EP0528606A2 Thermally conductive interface materials |
| 02/24/1993 | EP0528323A1 A tape automated bonding (TAB) semiconductor device and method for making the same |
| 02/24/1993 | EP0528291A2 Semiconductor chip module and method for manufacturing the same |
| 02/24/1993 | EP0528171A2 Composition containing a mixture of dicyanates and use thereof |
| 02/24/1993 | EP0528001A1 Batch assembly methods for packaging of chips. |
| 02/24/1993 | EP0491855A4 Sealing glass compositions |
| 02/24/1993 | CA2076421A1 Method for making thick film/solder joints |
| 02/23/1993 | US5189509 Semiconductor device and electrode block for the same |
| 02/23/1993 | US5189505 Integrated circuit assembly |
| 02/23/1993 | US5189502 With a SiO2 film of lower density for gas permeability |
| 02/23/1993 | US5189261 Electrical and/or thermal interconnections and methods for obtaining such |
| 02/23/1993 | US5189082 Imide epoxy resins for sealing semiconductor elements |
| 02/23/1993 | US5188987 Method of manufacturing a semiconductor device using a polishing step prior to a selective vapor growth step |
| 02/23/1993 | US5188985 Surface mount device with high thermal conductivity |
| 02/23/1993 | US5188984 Semiconductor device and production method thereof |
| 02/23/1993 | US5188975 Method of producing a connection hole for a DRAM having at least three conductor layers in a self alignment manner. |
| 02/23/1993 | US5188767 Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder |
| 02/23/1993 | US5188280 Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals |
| 02/18/1993 | WO1993003499A1 Anti-fuse structures and methods for making same |
| 02/18/1993 | WO1993003497A1 Programming of antifuses |
| 02/18/1993 | WO1993003319A1 Controlled highly densified diamond packing of thermally conductive electrically resistive conduit |
| 02/17/1993 | EP0527583A2 Method and apparatus for interconnecting devices using TAB in board technology |
| 02/17/1993 | EP0527468A1 High frequency module |
| 02/17/1993 | EP0527387A1 Methods and apparatus for bonding bumps to leads of a TAB tape |
| 02/17/1993 | EP0527359A2 Heat sink |
| 02/17/1993 | EP0527194A1 High density local interconnect in a semiconductor circuit using metal silicide |
| 02/17/1993 | EP0324766B1 Semiconductor mounting assembly |
| 02/17/1993 | CN1069147A Epoxy molding composition for surface mount applications |
| 02/16/1993 | US5187632 Controllable semiconductor switching device having integrated current limitation and overheating disconnection |
| 02/16/1993 | US5187566 Semiconductor memory and method of manufacturing the same |
| 02/16/1993 | US5187565 Liquid sealed semiconductor device and method of assembling the same |
| 02/16/1993 | US5187564 Application of laminated interconnect media between a laminated power source and semiconductor devices |
| 02/16/1993 | US5187561 Metal single crystal line having a particular crystal orientation |
| 02/16/1993 | US5187558 Stress reduction structure for a resin sealed semiconductor device |
| 02/16/1993 | US5187120 Selective deposition of metal on metal nitride to form interconnect |
| 02/16/1993 | US5187119 Depositing conductor layer on substrate, coating with resist, patterning, etching |
| 02/16/1993 | US5187118 Method of manufacturing semiconductor devices |
| 02/16/1993 | US5187020 Compliant contact pad |
| 02/16/1993 | US5186745 Teos based spin-on-glass and processes for making and using the same |
| 02/16/1993 | US5186379 Semiconductor chips, alloying, free of intermetallics |
| 02/14/1993 | CA2073950A1 Thermally conductive interface materials and methods of using the same |
| 02/10/1993 | EP0527100A2 Low TCE polyimides as improved insulator in multilayer interconnected structures |
| 02/10/1993 | EP0527044A1 Memory package |
| 02/10/1993 | EP0527033A2 Semiconductor module |
| 02/10/1993 | EP0526992A2 Multilayer carrier for mounting an integrated circuit and method of making the same |
| 02/10/1993 | EP0526707A1 Low temperature co-fired ceramic structure containing buried capacitors |
| 02/10/1993 | EP0526656A1 Wiring board |