| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/30/1993 | US5198884 Semiconductor devices having a double-layer interconnection structure |
| 03/30/1993 | US5198883 Semiconductor device having an improved lead arrangement and method for manufacturing the same |
| 03/30/1993 | US5198882 Crimp-type power semiconductor device |
| 03/30/1993 | US5198869 Reference wafer for haze calibration |
| 03/30/1993 | US5198695 Semiconductor wafer with circuits bonded to a substrate |
| 03/30/1993 | US5198693 Aperture formation in aluminum circuit card for enhanced thermal dissipation |
| 03/30/1993 | US5198396 Barium titanate and barium titanium zincate |
| 03/30/1993 | US5198391 Leadless ceramic chip carrier, heat resistance |
| 03/30/1993 | US5198389 Method of metallizing contact holes in a semiconductor device |
| 03/30/1993 | US5198388 Corrosion resistance |
| 03/30/1993 | US5198385 Photolithographic formation of die-to-package airbridge in a semiconductor device |
| 03/30/1993 | US5198295 Titanate or zirconate ceramics in circuit boards |
| 03/30/1993 | US5198189 Liquid metal matrix thermal paste |
| 03/30/1993 | US5198153 Dope Precursor, Electron and Photoresists |
| 03/30/1993 | US5198066 Mounting of the lids of capsules for solid state integrated circuits |
| 03/30/1993 | US5197892 Electric circuit device having an electric connecting member and electric circuit components |
| 03/30/1993 | US5197185 Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques |
| 03/30/1993 | US5197183 Modified lead frame for reducing wire wash in transfer molding of IC packages |
| 03/30/1993 | CA1315416C Protected electronic component |
| 03/24/1993 | EP0533589A1 A semiconductor device |
| 03/24/1993 | EP0533470A1 Socket for IC devices |
| 03/24/1993 | EP0533269A2 Test structure for multi-layer, thin-film modules |
| 03/24/1993 | EP0533254A2 Method of manufacturing a semiconductor device whereby a layer comprising aluminium is deposited on a surface for a semiconductor body |
| 03/24/1993 | EP0533158A2 Power conversion device and semiconductor module suitable for use in the device |
| 03/24/1993 | EP0533137A2 Leadframe and resin-sealed semiconductor device |
| 03/24/1993 | EP0533067A1 Package with heat sink |
| 03/24/1993 | EP0532898A2 Flex tape protective coating |
| 03/24/1993 | EP0532896A2 Cleavable diepoxide for removable device protection in electronic packaging |
| 03/24/1993 | EP0532845A1 Support for planar microwave circuits |
| 03/24/1993 | EP0532842A1 Low dielectric inorganic composition for multilayer ceramic package |
| 03/24/1993 | EP0532543A1 Sog with moisture resistant protective capping layer. |
| 03/24/1993 | CN1070287A Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 03/23/1993 | US5197076 Temperature stabilizable laser apparatus |
| 03/23/1993 | US5196992 Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin |
| 03/23/1993 | US5196980 Low impedance, high voltage protection circuit |
| 03/23/1993 | US5196920 Semiconductor integrated circuit device for limiting capacitive coupling between adjacent circuit blocks |
| 03/23/1993 | US5196919 Use of a contamination shield during the manufacture of semiconductor packages |
| 03/23/1993 | US5196917 Carrier tape |
| 03/23/1993 | US5196916 Integrated circuit wiring, titanium, hafnium, zirconium |
| 03/23/1993 | US5196726 Substrate for packaging a semiconductor device having particular terminal and bump structure |
| 03/23/1993 | US5196725 High pin count and multi-layer wiring lead frame |
| 03/23/1993 | US5196724 Programmable interconnect structures and programmable integrated circuits |
| 03/23/1993 | US5196723 Integrated circuit screen arrangement and a method for its manufacture |
| 03/23/1993 | US5196549 Dielectric films |
| 03/23/1993 | US5196506 Polymide |
| 03/23/1993 | US5196500 Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride |
| 03/23/1993 | US5196384 Method for preparing green sheets |
| 03/23/1993 | US5196381 Metaphosphate glass composition |
| 03/23/1993 | US5196377 Etching cavities into wafer; integrated circuits |
| 03/23/1993 | US5196374 Integrated circuit package with molded cell |
| 03/23/1993 | US5196373 Semiconductor subdivided into electrically isolated islands |
| 03/23/1993 | US5196371 Flip chip bonding method using electrically conductive polymer bumps |
| 03/23/1993 | US5196362 Multilayer wiring method of on-chip modification for an lsi |
| 03/23/1993 | US5196354 Passivation layer, packages, moisture resistant |
| 03/23/1993 | US5196268 Integrated circuit interconnect leads releasably mounted on film |
| 03/23/1993 | US5196251 Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate |
| 03/23/1993 | US5196103 Dielectric polycyclobutarene layer, adhesion, metal carbide interface, sputtering |
| 03/23/1993 | US5196089 Multilayer ceramic substrate for mounting of semiconductor device |
| 03/23/1993 | US5195577 Cooling device for power semiconductor switching elements |
| 03/23/1993 | US5195576 Lsi cooling apparatus and computer cooling apparatus |
| 03/23/1993 | US5195299 Method of reducing moisture content of hermetic packages containing semiconductor devices |
| 03/23/1993 | US5195237 Flying leads for integrated circuits |
| 03/23/1993 | CA1315021C Stacked leadframe assembly |
| 03/23/1993 | CA1315019C Universal semiconductor chip package |
| 03/18/1993 | WO1993005632A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
| 03/18/1993 | WO1993005631A1 Power electronics substrate and process for making it |
| 03/18/1993 | WO1993005514A1 Anti-fuse structures and methods for making same |
| 03/18/1993 | DE4230187A1 Component having conductors on lead on chip - comprises insulating film on semiconductor chip contg. projections |
| 03/18/1993 | DE4230030A1 Chip housing with thin inner leads - has reduced vol. of housing body esp. composed of cast epoxide] material |
| 03/18/1993 | DE4129964A1 Fixing integrated circuit element onto printed circuit - attaching IC to plastics film having conductive tracks, cutting out film, sticking onto printed circuit, and connecting tracks |
| 03/17/1993 | EP0532305A2 Power supply system for semiconductor chip |
| 03/17/1993 | EP0532244A1 Semiconductor device |
| 03/17/1993 | EP0532215A2 Electrical connecting method |
| 03/17/1993 | EP0532139A1 Clean burning green ceramic tape cast system |
| 03/17/1993 | EP0531984A1 Electronic circuit for semi-conductor power components |
| 03/17/1993 | EP0531867A1 Resin paste for tight sealing |
| 03/17/1993 | EP0531500A1 Method of producing coaxial connections for an electronic component |
| 03/17/1993 | EP0290497B1 Liquid cooling system for integrated circuits |
| 03/17/1993 | EP0218685B1 Electrostatic discharge input protection network |
| 03/16/1993 | US5195021 Constraining core for surface mount technology |
| 03/16/1993 | US5195020 Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally conductive compound layer and method for forming the layer |
| 03/16/1993 | US5194935 Plastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structure |
| 03/16/1993 | US5194933 Semiconductor device using insulation coated metal substrate |
| 03/16/1993 | US5194932 Semiconductor integrated circuit device |
| 03/16/1993 | US5194931 Master slice semiconductor device |
| 03/16/1993 | US5194930 Polyepoxide with anhydride hardener for semiconductors |
| 03/16/1993 | US5194695 Thermoplastic semiconductor package |
| 03/16/1993 | US5194404 Method of manufacturing a contact structure for a semiconductor device |
| 03/16/1993 | US5194326 Bonding plies for electronics |
| 03/16/1993 | US5194316 Polyimide layer laminate sheet |
| 03/16/1993 | US5194196 Hermetic package for an electronic device and method of manufacturing same |
| 03/16/1993 | US5193348 Superconducting quantum interferometer device |
| 03/16/1993 | CA1314631C Process for fabricating integrated circuits having shallow junctions |
| 03/11/1993 | DE4230330A1 Tape carrier package for soldering multipin chip to substrate by hf heating - comprises base film with device hose, leads having lead sections extending outwardly for bonding to substrate and lead sections extending into device hole |
| 03/11/1993 | DE4228679A1 Semiconductor device contact structure - has 1st and 2nd conductive layers contact with each other via nitrided oxide film as oxidn. barrier |
| 03/11/1993 | DE4228253A1 Contact points for mounting semiconductor casing on circuit board - has points arranged on circuit board in zigzag fashion in two adjacent rows. |
| 03/11/1993 | DE4129835A1 Leistungselektroniksubstrat und verfahren zu dessen herstellung Power electronics substrate and method for its production |
| 03/11/1993 | CA2072727A1 Copper-based paste containing copper aluminate, for microstructural and shrinkage control of copper-filled vias |
| 03/10/1993 | EP0531197A1 Method of laser sealing electronic packages, in particular for hybrid packages with stress minimising |
| 03/10/1993 | EP0531185A1 Supporting structure, especially for signalling lights of motor vehicles, and its manufacturing process |