| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/1993 | WO1993007657A1 Plated compliant lead |
| 04/15/1993 | WO1993007644A1 Structure for suppression of field inversion caused by charge build-up in the dielectric |
| 04/15/1993 | WO1993007640A1 Method and compositions for diffusion patterning |
| 04/15/1993 | WO1993006943A1 Electrically conductive compositions and methods for the preparation and use thereof |
| 04/14/1993 | EP0537001A1 Forming dielectrics in semiconductor devices |
| 04/14/1993 | EP0536972A2 An integrated circuit device having improved substrate capacitance isolation |
| 04/14/1993 | EP0536902A1 Interconnect and resistor for integrated circuits |
| 04/14/1993 | EP0536862A1 A method of forming a body with buried channels |
| 04/14/1993 | EP0536802A2 Multilayer circuit board with repaired I/O pin and process for repairing I/O pin on multilayer circuit board |
| 04/14/1993 | EP0536748A1 Polyhydric phenol and epoxy resin obtained using the same |
| 04/14/1993 | EP0536739A2 Electrical packaging structure and liquid crystal display device having the same |
| 04/14/1993 | EP0536418A1 Semiconductor device and manufacturing method therefor |
| 04/14/1993 | EP0536115A1 Process for the manufacture of a conductive polymer composition |
| 04/14/1993 | EP0527194A4 High density local interconnect in a semiconductor circuit using metal silicide |
| 04/14/1993 | EP0279814B1 Thermally insulative and electrically conductive interconnect and process for making same |
| 04/14/1993 | CN1071031A Method and compositions for diffusion patterning |
| 04/14/1993 | CN1020317C Electric device and mfg. method of same |
| 04/13/1993 | US5202753 Thermosetting seals consisting of base resin, aluminum oxide and fused silica is used to connect lead frame and silicon chip |
| 04/13/1993 | US5202752 Monolithic integrated circuit device |
| 04/13/1993 | US5202751 Semiconductor integrated circuit |
| 04/13/1993 | US5202579 Semiconductor device having multilayer interconnection structure |
| 04/13/1993 | US5202577 Leadframe having a particular dam bar |
| 04/13/1993 | US5202289 Method of plastically deforming a semiconductor device lead frame in preparation for ultrasonic bonding |
| 04/13/1993 | US5202288 Method of manufacturing an electronic circuit component incorporating a heat sink |
| 04/13/1993 | US5202275 Forming insulation films, doping gate electrodes of random memory cells |
| 04/13/1993 | US5202153 Method for making thick film/solder joints |
| 04/13/1993 | US5202061 Electrically conductive polymeric materials and uses thereof |
| 04/13/1993 | US5201866 Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface |
| 04/13/1993 | US5201456 Process for assembly of a metal can on a substrate bearing an integrated circuit |
| 04/13/1993 | US5201451 Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
| 04/12/1993 | CA2079821A1 Polyhydric phenol and epoxy resin obtained using the same |
| 04/08/1993 | DE4233097A1 New semiconductor encapsulation compsn. - contains epoxy] and phenolic] resins both contg. naphthalene rings and has high heat resistance and low moisture adsorption |
| 04/07/1993 | EP0536075A1 Direct distribution repair and engineering change system |
| 04/07/1993 | EP0535996A1 Ceramic coated plastic package |
| 04/07/1993 | EP0535882A1 Method of processing a semiconductor chip package |
| 04/07/1993 | EP0535864A1 Fabrication of a conductive region in electronic devices |
| 04/07/1993 | EP0535736A1 Semiconductor device |
| 04/07/1993 | EP0535633A1 Method of fabricating nano-size thin wires and devices made of such thin wires |
| 04/07/1993 | EP0535479A1 Multichip integrated circuit packages and systems |
| 04/07/1993 | EP0535414A2 Electronic circuit device |
| 04/07/1993 | CN1020245C Input/output circuits |
| 04/06/1993 | US5200880 Method for forming interconnect for integrated circuits |
| 04/06/1993 | US5200810 High density interconnect structure with top mounted components |
| 04/06/1993 | US5200809 Exposed die-attach heatsink package |
| 04/06/1993 | US5200808 Semiconductor device having smooth contact holes formed through multi-layer insulators of different etching speeds |
| 04/06/1993 | US5200807 Wiring connection structure for a semiconductor integrated circuit device |
| 04/06/1993 | US5200806 Lead frame having a plurality of island regions and a suspension pin |
| 04/06/1993 | US5200733 Resistor structure and method of fabrication |
| 04/06/1993 | US5200642 Internal capacitor arrangement for semiconductor device assembly |
| 04/06/1993 | US5200641 Semiconductor device structure including bending-resistant radiating layer |
| 04/06/1993 | US5200640 Hermetic package having covers and a base providing for direct electrical connection |
| 04/06/1993 | US5200580 Configurable multi-chip module interconnect |
| 04/06/1993 | US5200368 Continuous solder coating apparatus and its method |
| 04/06/1993 | US5200367 Method for assembling packages of semi-conductor elements |
| 04/06/1993 | US5200366 Semiconductor device, its fabrication method and molding apparatus used therefor |
| 04/06/1993 | US5200365 System for achieving desired bondlength of adhesive between a semiconductor chip package and a heatsink |
| 04/06/1993 | US5200364 Packaged integrated circuit with encapsulated electronic devices |
| 04/06/1993 | US5200363 Silicon chip bonded to glass having bores filled with conductive paste |
| 04/06/1993 | US5200362 Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
| 04/06/1993 | US5200360 Method for reducing selectivity loss in selective tungsten deposition |
| 04/06/1993 | US5200348 Method of manufacturing semiconductor device with constant width deep groove isolation |
| 04/06/1993 | US5200347 Method for improving the radiation hardness of an integrated circuit bipolar transistor |
| 04/06/1993 | US5200300 Manufacturing integrated circuit structures |
| 04/06/1993 | US5200249 Aluminum nitride and tungsten and/or molybdenum; hermetic |
| 04/06/1993 | US5200112 Electrically conductive polymeric materials and uses thereof |
| 04/06/1993 | US5199890 IC socket |
| 04/06/1993 | US5199883 Mount-to-contact type contact |
| 04/06/1993 | US5199487 Electroformed high efficiency heat exchanger and method for making |
| 04/06/1993 | US5199469 Exterior lead forming device for semiconductor devices |
| 04/06/1993 | US5199165 Heat pipe-electrical interconnect integration method for chip modules |
| 04/06/1993 | US5199164 Stacking upper and lower members to minimize size, forming heat sinks for improved heat emission |
| 04/06/1993 | US5199163 Metal transfer layers for parallel processing |
| 04/06/1993 | CA2032266C Integrated circuit solder die-attach design and method |
| 04/01/1993 | WO1993006703A1 Flat module |
| 04/01/1993 | WO1993006701A1 Suspension packaging for static-sensitive products |
| 04/01/1993 | WO1993006621A1 Exposed die-attach heatsink package |
| 04/01/1993 | WO1993006620A1 Solder bump fabrication method and solder bumps formed thereby |
| 04/01/1993 | WO1993006559A1 Universal interconnect matrix array |
| 04/01/1993 | WO1993006340A1 Method and apparatus for cooling an object |
| 04/01/1993 | WO1993006053A1 Low dielectric constant substrate and method of making |
| 04/01/1993 | DE4231325A1 Encapsulated semiconductor pressure sensor conductor and support arrangement - includes arms sloping downwards, bonded to chip base, permitting high level electrical connections |
| 04/01/1993 | DE4131739A1 Electric component cooler with cavity - receiving liq. stream and formed between two flat members, at least one being of metal |
| 04/01/1993 | DE4131200A1 Integrated circuit with housing giving mechanical and thermal load protection - includes heat dissipating base and pressure block with projections matching chip and conductors |
| 03/31/1993 | EP0534923A1 Small sized heater of self cooling type |
| 03/31/1993 | EP0534733A1 Multilayer ceramic structure and method of fabrication |
| 03/31/1993 | EP0534678A2 Method of making electronic component packages |
| 03/31/1993 | EP0534631A1 Method of forming vias structure obtained |
| 03/31/1993 | EP0534440A1 Cooled electronic device |
| 03/31/1993 | EP0534133A1 Insulating sealing device for lead-in layers of a protection housing |
| 03/31/1993 | EP0534130A1 Method of fabricating a self-aligned contact hole structure |
| 03/30/1993 | US5198986 Crosstalk verification device |
| 03/30/1993 | US5198965 Free form packaging of specific functions within a computer system |
| 03/30/1993 | US5198964 Packaged semiconductor device and electronic device module including same |
| 03/30/1993 | US5198963 Multiple integrated circuit module which simplifies handling and testing |
| 03/30/1993 | US5198905 Image sensor having an electrical interference reducing wire structure |
| 03/30/1993 | US5198889 Cooling apparatus |
| 03/30/1993 | US5198888 Semiconductor stacked device |
| 03/30/1993 | US5198887 Semiconductor chip carrier |
| 03/30/1993 | US5198886 Semiconductor device having a clamping support |
| 03/30/1993 | US5198885 Ceramic base power package |