| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/05/1993 | EP0540247A2 Formulation of multichip modules |
| 05/05/1993 | EP0540070A1 Method for forming an electrical connection for an integrated circuit |
| 05/05/1993 | EP0539813A1 Circuit configuration for the protection of integrated circuits |
| 05/05/1993 | EP0539756A1 Substrate material for a microstripline circuit and method for preparing substrates |
| 05/05/1993 | EP0539686A1 Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates |
| 05/05/1993 | EP0539597A1 Liquid crystal module |
| 05/05/1993 | EP0539583A1 Method of producing heat pipe-type semiconductor cooling device |
| 05/05/1993 | EP0539555A1 Arrangement for encasing a functional device, and a process for the production of same. |
| 05/05/1993 | EP0539481A1 Method of producing microchips |
| 05/05/1993 | EP0539384A1 Process for producing a marker indicating the orientation of the crystal lattice of a wafer |
| 05/04/1993 | US5208731 Heat dissipating assembly |
| 05/04/1993 | US5208729 Multi-chip module |
| 05/04/1993 | US5208725 High capacitance structure in a semiconductor device |
| 05/04/1993 | US5208658 Semiconductor integrated circuit provided with contact for inter-layer connection and method of inter-layer connection therefor |
| 05/04/1993 | US5208656 Multilayer wiring substrate and production thereof |
| 05/04/1993 | US5208481 Lead-frame for manufacturing semiconductor devices |
| 05/04/1993 | US5208480 Dynamic latch circuit |
| 05/04/1993 | US5208467 Sealing |
| 05/04/1993 | US5208463 Method and apparatus for detecting deformations of leads of semiconductor device |
| 05/04/1993 | US5208437 Method of cutting interconnection pattern with laser and apparatus thereof |
| 05/04/1993 | US5208188 Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process |
| 05/04/1993 | US5208187 Monocrystalline aluminum film, heating |
| 05/04/1993 | US5208186 Aluminum bonding pad, gold and tin eutectic |
| 05/04/1993 | US5208177 Etching trench between access lines; severing underlying diffusion region; integrated circuits, semiconductors |
| 05/04/1993 | US5208170 Method for fabricating bipolar and CMOS devices in integrated circuits using contact metallization for local interconnect and via landing |
| 05/04/1993 | US5208168 Semiconductor device having punch-through protected buried contacts and method for making the same |
| 05/04/1993 | US5208066 Process of forming a patterned polyimide film and articles including such a film |
| 05/04/1993 | US5207102 Semiconductor pressure sensor |
| 04/29/1993 | WO1993008673A1 Module for electronic control appliances |
| 04/29/1993 | WO1993008672A1 Manufacture of multilayer ceramic part, and multilayer ceramic part |
| 04/29/1993 | WO1993008602A1 Circuit for protecting a semiconductor device from voltage produced by discharges of static electricity |
| 04/29/1993 | WO1993008601A1 Mounting arrangements for high voltage/high power semiconductors |
| 04/29/1993 | WO1993008600A1 Intrinsically controlled cooling container |
| 04/29/1993 | DE4230039A1 Semiconductor component with chip embedded in cast plastics material - has electrode protrusions at required height on coupling faces, and numerous leads |
| 04/29/1993 | DE4135103A1 High frequency electrical connection appts. - has triple plate arrangement of thin layers on flexible polyimide substrates with electric through contacts |
| 04/29/1993 | DE4134929A1 Heat transfer body for cooling of semiconductor component - has ribs upstanding from base to grip prongs of component which are forced into corresp. grooves |
| 04/29/1993 | DE4134753A1 Wideband high frequency circuit for frequencies above 500 Mhz - compensates for stray inductance using inductor of lower Q connected in parallel across dielectric substrate having dielectric constant greater than 10 |
| 04/29/1993 | CA2096245A1 Mounting arrangements for high voltage/high power semiconductors |
| 04/28/1993 | EP0539327A1 Epoxy novolac resins stabilised with organic phosphor compounds |
| 04/28/1993 | EP0539211A2 Method for production of microcapsule type conductive filler |
| 04/28/1993 | EP0539197A1 Semiconductor device with anti-fuse and production method |
| 04/28/1993 | EP0539183A1 Application of laminated interconnect media between a laminated power source and semiconductor devices |
| 04/28/1993 | EP0539095A2 Semiconductor device having radiator structure and method of producing the same |
| 04/28/1993 | EP0539075A1 Semiconductor device |
| 04/28/1993 | EP0538833A1 Integrated circuit package having a cooling mechanism |
| 04/28/1993 | EP0538818A1 Cooling unit capable of speedily cooling an integrated circuit chip |
| 04/28/1993 | EP0538798A1 Diamond heat sink and method of manufacturing the same |
| 04/28/1993 | EP0538619A1 Multilayer conductive wire for semiconductor device and manufacturing method thereof |
| 04/28/1993 | EP0538471A1 Liquid cooled cooling device |
| 04/28/1993 | EP0538468A1 Thin-film conductive circuit and process for its production |
| 04/28/1993 | EP0538465A1 Thin planer package for cooling an array of edge-emitting laser diodes |
| 04/28/1993 | EP0538457A1 Fabrication of metal matrix composites by vacuum die casting |
| 04/28/1993 | CN1071535A Cilver-rich conductor compositions for high thermal cycled and aged adhesions |
| 04/27/1993 | US5206905 Password protected device using incorrect passwords as seed values for pseudo-random number generator for outputting random data to thwart unauthorized accesses |
| 04/27/1993 | US5206794 Integrated circuit package with device and wire coat assembly |
| 04/27/1993 | US5206793 Diode with electrodes and case assembled without soldering or crimping, and rectifier bridge made with such diodes |
| 04/27/1993 | US5206792 Attachment for contacting a heat sink with an integrated circuit chip and use thereof |
| 04/27/1993 | US5206791 Bellows heat pipe apparatus for cooling systems |
| 04/27/1993 | US5206713 Mounting silicon chips |
| 04/27/1993 | US5206712 Building block approach to microwave modules |
| 04/27/1993 | US5206536 Comb insert for semiconductor packaged devices |
| 04/27/1993 | US5206532 Buried contact between polysilicon gate and diffusion area |
| 04/27/1993 | US5206188 Method of manufacturing a high lead count circuit board |
| 04/27/1993 | US5206186 Method for forming semiconductor electrical contacts using metal foil and thermocompression bonding |
| 04/27/1993 | US5206184 Method of making single layer personalization |
| 04/27/1993 | US5206181 Method for manufacturing a semiconductor device with a slotted metal test pad to prevent lift-off during wafer scribing |
| 04/27/1993 | US5205353 Heat exchanging member |
| 04/27/1993 | US5205348 Semi-rigid heat transfer devices |
| 04/27/1993 | US5205036 Method of manufacturing a semiconductor device with selective coating on lead frame |
| 04/27/1993 | US5205032 Electronic parts mounting apparatus |
| 04/23/1993 | CA2081000A1 Epoxy novolaks stabilised with organic phosphorus compounds |
| 04/21/1993 | EP0538064A2 Method of fabricating wiring on a semiconductor substrate using a plating process |
| 04/21/1993 | EP0538019A2 Lead frame for a semiconductor device |
| 04/21/1993 | EP0538010A2 Semiconductor package, a holder, a method of production and testing for the same |
| 04/21/1993 | EP0538007A2 Integrated circuit demountable tab apparatus |
| 04/21/1993 | EP0538003A1 Method of manufacturing inversion type ICs and IC module using same |
| 04/21/1993 | EP0537982A2 Semiconductor device having improved leads |
| 04/21/1993 | EP0537965A2 Process of manufacturing a heat-conductive material |
| 04/21/1993 | EP0537667A2 High dielectric constant material |
| 04/21/1993 | EP0537479A1 Zinc stannate powder for molding materials and process for preparation thereof |
| 04/21/1993 | EP0537419A1 Device comprising an integrated magnetic field sensor and first and second magnetic flux concentrator, and method to build into a container of synthetic material a plurality of these devices |
| 04/21/1993 | EP0537162A1 Metal electronic package having improved resistance to electromagnetic interference |
| 04/21/1993 | EP0513273A4 Direct thermocompression bonding for thin electronic power chips |
| 04/20/1993 | US5204735 High-frequency semiconductor device having emitter stabilizing resistor and method of manufacturing the same |
| 04/20/1993 | US5204554 Partial isolation of power rails for output buffer circuits |
| 04/20/1993 | US5204540 Resin sealed semiconductor device for use in testing and evaluation method of stress due to resin seal |
| 04/20/1993 | US5204437 Blend of vinyl siloxane, hydrosiloxane and a hydrosilation catalyst; good adhesion to metal substrates; potting; semiconductors |
| 04/20/1993 | US5204416 Dielectrics in integrated circuits |
| 04/20/1993 | US5204399 Thermoplastic film die attach adhesives |
| 04/20/1993 | US5204289 Mullite bubbles dispersed in matrix |
| 04/20/1993 | US5204288 Chemical vapor deposition; dry etching; encapsulation; reduces number of process steps; minimizes contamination |
| 04/20/1993 | US5204287 Integrated circuit device having improved post for surface-mount package |
| 04/20/1993 | US5204286 Method of making self-aligned contacts and vertical interconnects to integrated circuits |
| 04/20/1993 | US5203075 Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
| 04/20/1993 | CA1316586C Device for cooling regions with limited thermal exchange surface, in particular for electronic components |
| 04/20/1993 | CA1316444C Static shielding film |
| 04/20/1993 | CA1316303C Composite structure |
| 04/15/1993 | WO1993007736A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion |
| 04/15/1993 | WO1993007663A1 Laser device |
| 04/15/1993 | WO1993007659A1 Direct integrated circuit interconnection system |