| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/26/1993 | EP0543121A2 Method of manufacturing a metal/ceramic substrate with an interface region |
| 05/25/1993 | US5214655 Integrated circuit packaging configuration for rapid customized design and unique test capability |
| 05/25/1993 | US5214498 Package for a circuit operating on an RF signal |
| 05/25/1993 | US5214486 Monitor plate for automatic particle detection system |
| 05/25/1993 | US5214318 Semiconductor integrated circuit device having a signal transmission line pair interconnected by propagation delay time control resistance |
| 05/25/1993 | US5214309 Thermally conductive bar cooling arrangement for a transistor |
| 05/25/1993 | US5214308 Substrate for packaging a semiconductor device |
| 05/25/1993 | US5214307 Lead frame for semiconductor devices having improved adhesive bond line control |
| 05/25/1993 | US5214304 Multilayer insulating films and polycrystalline silicon films |
| 05/25/1993 | US5214284 Method and arrangement for testing and repairing an integrated circuit |
| 05/25/1993 | US5214005 Glass-aluminum nitride composite material |
| 05/25/1993 | US5214000 Thermal transfer posts for high density multichip substrates and formation method |
| 05/25/1993 | US5213990 Multilayer transistors formed by vapor deposition, channels and patterns |
| 05/25/1993 | US5213878 Hollow thin walled refractory, ceramic bubbles distributed in matrix |
| 05/25/1993 | US5213877 Ceramic substrate used for fabricating electric or electronic circuit |
| 05/25/1993 | US5213868 Thermally conductive interface materials and methods of using the same |
| 05/25/1993 | US5213864 Encapsulatant for electronics comprising polydimethyldiphenyl methylphenylsiloxane |
| 05/25/1993 | US5213748 Joining leads with dam to form a ring and joining the ring to the leads and forming a ring of liquid anisotropic liquid crystal |
| 05/25/1993 | US5213676 Integrated circuits |
| 05/25/1993 | US5213153 Heat radiating device |
| 05/25/1993 | US5213099 Ear canal pulse/oxygen saturation measuring device |
| 05/25/1993 | CA1318415C Compression method of electrically interconnecting circuit assemblies and interconnected circuit assemblies produced thereby |
| 05/19/1993 | EP0552278A4 Flame retardant epoxy molding compound, method and encapsulated device. |
| 05/19/1993 | EP0542546A1 Substrate to heatsink interface apparatus and method |
| 05/19/1993 | EP0542533A1 Semiconductor chip carrier capable of stably mounting a semiconductor chip |
| 05/19/1993 | EP0542532A2 Package structure of a semiconductor device having a built-in capacitor |
| 05/19/1993 | EP0542486A1 Electrically programmable antifuse element |
| 05/19/1993 | EP0542478A1 Pin fin heat sink including flow enhancement |
| 05/19/1993 | EP0542379A1 Temperature stabilizable laser apparatus |
| 05/19/1993 | EP0542273A1 Room-temperature curable epoxy resin composition |
| 05/19/1993 | EP0542263A1 Semiconductor device having low resistance values at connection points of conductor layers |
| 05/19/1993 | EP0542262A1 Method for forming a metal conductor in semiconductor device |
| 05/19/1993 | EP0542225A2 Voltage control circuit |
| 05/19/1993 | EP0542180A1 External lead terminal adaptor and semiconductor device |
| 05/19/1993 | EP0542105A1 Aqueous binder combination, process for its preparation and its use |
| 05/19/1993 | EP0541914A1 Recessed chip capacitor wells with cleaning channels on integrated circuit packages |
| 05/19/1993 | EP0541823A1 Heat pipe connector, electronic device and heat radiating fan having said pipe |
| 05/19/1993 | EP0500690A4 Multi-layer lead frames for integrated circuit packages |
| 05/19/1993 | EP0401211B1 Semiconductor component, manufacturing process, device and assembly station |
| 05/19/1993 | DE4237267A1 Plug-type casing for semiconductor IC - has semiconductor chip with bondable coupling faces and plug for casing mounting on circuit board. |
| 05/19/1993 | DE4234700A1 Compact SOJ semiconductor module with coupling frame - has semiconductor chip with contact points connectable to inner frame terminals. |
| 05/19/1993 | DE4137389A1 Ceramic substrate for integrated circuit with bevelled side faces - including additional long side bevels for fracture resistance |
| 05/18/1993 | US5212626 Electronic packaging and cooling system using superconductors for power distribution |
| 05/18/1993 | US5212625 Semiconductor module having projecting cooling fin groups |
| 05/18/1993 | US5212576 Insulating material with coefficient linear expansion matching that of one substrate over connection between two conductive patterns |
| 05/18/1993 | US5212406 High density packaging of solid state devices |
| 05/18/1993 | US5212405 Composite lead frame |
| 05/18/1993 | US5212403 Integrated circuit device having an ic chip mounted on the wiring substrate and having suitable mutual connections between internal circuits |
| 05/18/1993 | US5212402 Semiconductor device with integral decoupling capacitor |
| 05/18/1993 | US5212150 Heat and oxidation resistance |
| 05/18/1993 | US5212119 Method for maintaining the resistance of a high resistive polysilicon layer for a semiconductor device |
| 05/18/1993 | US5212115 Method for microelectronic device packaging employing capacitively coupled connections |
| 05/18/1993 | US5212107 Wiring method for semiconductor integrated circuits |
| 05/18/1993 | US5211325 Method and apparatus for soldering surface-mountable components to a printed circuit board |
| 05/18/1993 | US5210939 Lead grid array integrated circuit |
| 05/18/1993 | US5210936 Method and apparatus for the excise and lead form of TAB devices |
| 05/18/1993 | CA1317822C Multilayer ceramics coatings from the ceramification of hydrogen silsesquioxane resin in the presence of ammonia |
| 05/13/1993 | WO1993009566A1 Method for moisture sealing integrated circuits using silicon nitride spacer protection of oxide passivation edges |
| 05/13/1993 | WO1993009565A1 Apparatus for and method of manufacturing semiconductor wafer |
| 05/13/1993 | WO1993009456A1 Microelectronic module having optical and electrical interconnects |
| 05/13/1993 | WO1993009167A1 Process for preparing a polyimide film with a preselected value for cte |
| 05/13/1993 | DE4237414A1 Cooling appts. for heat generating semiconductor devices - circulates cooling fluid through nozzles and over surfaces of devices in enclosed space |
| 05/12/1993 | EP0541456A1 Support for card with electronic components having a low thermal resistance |
| 05/12/1993 | EP0541436A2 Conductive pattern layer structure and method of producing the conductive pattern layer structure |
| 05/12/1993 | EP0541405A1 Bond pad for semiconductor device |
| 05/12/1993 | EP0541229A1 Methods of joining components by laser soldering |
| 05/12/1993 | EP0540926A1 Protection circuit on a lead of a power device |
| 05/12/1993 | EP0540578A1 Compact sram cell layout |
| 05/12/1993 | EP0540522A1 Solder interconnections and methods for making same |
| 05/12/1993 | EP0540519A1 Metal bump for a thermal compression bond and method for making same. |
| 05/12/1993 | EP0336944B1 Copper-tungsten metal mixture and process |
| 05/11/1993 | US5210683 Recessed chip capacitor wells with cleaning channels on integrated circuit packages |
| 05/11/1993 | US5210601 Compression contacted semiconductor device and method for making of the same |
| 05/11/1993 | US5210598 Amorphous silicon, silicon dioxide insulation |
| 05/11/1993 | US5210596 Thermally optimized interdigitated transistor |
| 05/11/1993 | US5210441 High conductivity |
| 05/11/1993 | US5210440 Semiconductor chip cooling apparatus |
| 05/11/1993 | US5210439 Power transistor monolithic integrated structure |
| 05/11/1993 | US5210375 Electronic device package--carrier assembly ready to be mounted onto a substrate |
| 05/11/1993 | US5210115 Allyl magnesium halide modified epoxy resin composition |
| 05/11/1993 | US5210054 Reliability without causing peeling |
| 05/11/1993 | US5210053 Having wirings with good step coverage on contacts |
| 05/11/1993 | US5209817 Simplification of process |
| 05/11/1993 | US5209815 Semiconductors, polyether sulfone release layer |
| 05/11/1993 | US5209814 Applying a layer in a solvent, heat treatment and washing |
| 05/11/1993 | US5209390 Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid |
| 05/11/1993 | US5208976 Apparatus and method for assembling circuit structures |
| 05/11/1993 | CA2018808C Power semiconductor package |
| 05/11/1993 | CA1317696C Encapsulating compositions containing ultra-pure, fused-silica fillers |
| 05/06/1993 | DE4236625A1 Plastics encapsulated semiconductor device - has resin-filled space above element and under parallel plane in which internal wiring is arranged in proximity to surface electrode connections |
| 05/06/1993 | DE4226200C1 Forming air bridges to cross conductor paths on semiconductor integrated circuit - covering conducting path to be bridged with photo-resist layers, creating air gap in second layer using etching process and adding top conductive layer |
| 05/06/1993 | DE4136355A1 Three=dimensional assembly of electronic components and sensors, e.g. for accelerometer mfr. - interconnecting substrates with solder joints, conductive adhesive or wire bonds to edges of polyhedron |
| 05/05/1993 | EP0540451A2 Structure and process for thin film interconnect |
| 05/05/1993 | EP0540446A2 Self-aligned contact studs for semiconductor structures |
| 05/05/1993 | EP0540420A2 Heat sink fin and production process therefor |
| 05/05/1993 | EP0540312A1 Bump electrode structure and semiconductor chip having the same |
| 05/05/1993 | EP0540289A2 Electrical and electronic parts formed of polybutylene naphthalenedicarboxylate |
| 05/05/1993 | EP0540287A2 Dynamic power compensation |
| 05/05/1993 | EP0540276A2 A self-aligned contact process |
| 05/05/1993 | EP0540261A2 Process of removing polymers in semiconductor vias |