| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/15/1993 | US5220487 Electronic package with enhanced heat sinking |
| 06/15/1993 | US5220486 Ic packing device |
| 06/15/1993 | US5220298 Integrated circuit having a built-in noise filter |
| 06/15/1993 | US5220199 Semiconductor integrated circuit device in which a semiconductor chip is mounted with solder bumps for mounting to a wiring substrate |
| 06/15/1993 | US5220197 Single inline packaged solid state relay with high current density capability |
| 06/15/1993 | US5220196 Semiconductor device |
| 06/15/1993 | US5220195 Semiconductor device having a multilayer leadframe with full power and ground planes |
| 06/15/1993 | US5219977 Low water absorption, low expansion, high modulus, for flexible printed circuits |
| 06/15/1993 | US5219920 Polyarylene sulfide resin composition |
| 06/15/1993 | US5219803 Mixing inorganic colorant with pure aluminum nitride powder, sintering |
| 06/15/1993 | US5219795 Moisture resistance integrated circuit; resilient |
| 06/15/1993 | US5219794 Semiconductor integrated circuit device and method of fabricating same |
| 06/15/1993 | US5219790 Fusing AL or alloy film in high pressure atmosphere, vibration |
| 06/15/1993 | US5219787 Trenching techniques for forming channels, vias and components in substrates |
| 06/15/1993 | US5219782 Sublithographic antifuse method for manufacturing |
| 06/15/1993 | US5219713 Multi-layer photoresist air bridge fabrication method |
| 06/15/1993 | US5219639 Multilayer structure and its fabrication method |
| 06/15/1993 | US5219117 Method of transferring solder balls onto a semiconductor device |
| 06/15/1993 | CA2082785A1 Water-based binder composition and its use for the production of coating or sealing compositions |
| 06/15/1993 | CA2006175C Method of forming patterned silicone rubber layer |
| 06/15/1993 | CA1319205C2 Modular integrated circuit device |
| 06/15/1993 | CA1319204C2 Universal integrated circuit module |
| 06/15/1993 | CA1319203C2 Method of building a variety of complex integrated circuits from standardizable components |
| 06/15/1993 | CA1319202C2 Method of testing integrated circuit device |
| 06/12/1993 | CA2084147A1 Metallized paths on diamond surfaces |
| 06/10/1993 | WO1993011567A1 Power fet with shielded channels |
| 06/10/1993 | WO1993011564A1 Printed circuit board including an integrated circuit protection system |
| 06/10/1993 | WO1993011563A1 Semiconductor arrangement with a metal layer system and device for producing it |
| 06/09/1993 | EP0545811A2 Superconducting multilayer interconnection formed of oxide superconductor material and method for manufacturing the same |
| 06/09/1993 | EP0545809A1 Device for mounting wideband microwave monolithic integrated circuits |
| 06/09/1993 | EP0545563A1 Stacking heatpipe for three dimensional electronic packaging |
| 06/09/1993 | EP0545487A2 Semiconductor device encapsulated in resin and electrically insulated having improved insulation characteristics and related manufacturing process |
| 06/09/1993 | EP0545411A2 Method for improving the step coverage at contact windows |
| 06/09/1993 | EP0545359A2 Partial isolation of power rails for output buffer circuits |
| 06/09/1993 | EP0545256A1 Arrangement of bitlines for integrated circuits |
| 06/09/1993 | EP0545007A1 A semiconductor device structure having a heat-sink and a plastics body, and highly reliable means of electrical connection to the heat-sink |
| 06/09/1993 | EP0544915A1 Package structure of semiconductor device and manufacturing method therefor |
| 06/09/1993 | DE4139908A1 Halbleiteranordnung mit metallschichtsystem sowie verfahren zur herstellung A semiconductor device comprising metal layer system and process for production |
| 06/09/1993 | CN1073044A Method of processing a semiconductor chip package |
| 06/09/1993 | CN1021174C Semiconductor module |
| 06/08/1993 | US5218515 Microchannel cooling of face down bonded chips |
| 06/08/1993 | US5218510 Suspension packaging for static-sensitive products |
| 06/08/1993 | US5218335 Electronic circuit device having thin film resistor and method for producing the same |
| 06/08/1993 | US5218234 Semiconductor device with controlled spread polymeric underfill |
| 06/08/1993 | US5218232 Semiconductor device having two-level wiring |
| 06/08/1993 | US5218231 Mold-type semiconductor device |
| 06/08/1993 | US5218230 Ic package with electric conductor lines in dielectric package body |
| 06/08/1993 | US5218229 Inset die lead frame configuration lead frame for a semiconductor device having means for improved busing and die-lead frame attachment |
| 06/08/1993 | US5218215 Semiconductor device package having a thermal dissipation means that allows for lateral movement of the lead frame with respect to the housing without breakage of the thermal dissipation path |
| 06/08/1993 | US5218172 Metallized frame which interconnects etched wirings for integrated circuits |
| 06/08/1993 | US5218168 For production of semiconductor devices |
| 06/08/1993 | US5217922 Method for forming a silicide layer and barrier layer on a semiconductor device rear surface |
| 06/08/1993 | US5217849 Plating copper layers onto both surfaces of polyimide film, then forming photoresist layers on both sides, masking, exposure, development, baking, etching |
| 06/08/1993 | US5217767 Multilayer sheet comprising self-supporting dielectric layer, electroconductive layer, antistatic layer having a compound or polyether of fluoroaliphaticsulfonamide and a tie layer; protective packages for electronics, semiconductors |
| 06/08/1993 | US5216807 Method of producing electrical connection members |
| 06/08/1993 | US5216806 Method of forming a chip package and package interconnects |
| 06/07/1993 | CA2084600A1 Partial isolation of power rails for output buffer circuits |
| 06/03/1993 | DE4239457A1 Semiconductor wafer structure forming peripheral structure of semiconductor device chip - has insulating layer on surface of substrate with mutually insulated openings which respectively surround device areas on substrate |
| 06/03/1993 | DE4238646A1 New encapsulated semiconductor memory chip - has chips with bonding pads on central region, lead frame with leads connected to bonding parts, insulating adhesive, metal wire for electrical connection etc. |
| 06/03/1993 | DE4235177A1 Speichervorrichtung zur unterdrueckung von rauschen, das zwischen signal-leitungen hervorgerufen wird Rushing storage device to suppress, which is caused between signal-lines |
| 06/03/1993 | DE4225617A1 Multilayer integrated circuit with hf noise radiation suppression - has upper conducting layer covering circuit section and signal line section, and maintained at set potential |
| 06/03/1993 | DE4208604A1 Ceramic connector material for electric circuit substrate - has copper layer with coating of aluminium oxide ceramic layer and aluminium nitride ceramic layer |
| 06/02/1993 | EP0544538A2 Coaxial line assembly |
| 06/02/1993 | EP0544329A2 Semiconductor package |
| 06/02/1993 | EP0544305A2 Method of forming a contact bump using a composite film |
| 06/02/1993 | EP0544076A2 Reworkable module and method of fabricating the module |
| 06/01/1993 | USRE34269 Semiconductor integrated circuit packages |
| 06/01/1993 | US5216580 Optimized integral heat pipe and electronic circuit module arrangement |
| 06/01/1993 | US5216491 Semiconductor photoconductive device with laminated refractory metal electrode |
| 06/01/1993 | US5216283 Semiconductor device having an insertable heat sink and method for mounting the same |
| 06/01/1993 | US5216282 Self-aligned contact studs for semiconductor structures |
| 06/01/1993 | US5216281 Self sealed aligned contact incorporating a dopant source |
| 06/01/1993 | US5216280 Semiconductor integrated circuit device having pads at periphery of semiconductor chip |
| 06/01/1993 | US5216279 Power semiconductor device suitable for automation of production |
| 06/01/1993 | US5216278 Semiconductor device having a pad array carrier package |
| 06/01/1993 | US5216277 Lead frames with location eye point markings |
| 06/01/1993 | US5216276 Semiconductor integrated circuit device having high matching degree and high integration density |
| 06/01/1993 | US5216207 Low temperature co-fired multilayer ceramic circuit boards with silver conductors |
| 06/01/1993 | US5215933 Uniform thickness of insulation film to improve the charge retaining capability of floating gate |
| 06/01/1993 | US5215801 Heat curing silicone resin composition including silicon dioxi de, silicon dioxide, silicon hydride and xylene; platinum catalyst; resin contains vinyl nd hydride functions |
| 06/01/1993 | US5215787 Using a vapor containing an alkoxyfluorosilane; temperature |
| 06/01/1993 | US5215610 Method for fabricating superconductor packages |
| 06/01/1993 | US5215140 Method of making a heat sink |
| 06/01/1993 | US5214846 Packaging of semiconductor chips |
| 06/01/1993 | US5214845 Method for producing high speed integrated circuits |
| 06/01/1993 | US5214844 Method of assembling integrated circuits to a silicon board |
| 05/27/1993 | WO1993010573A1 Die mounting with uniaxial conductive adhesive |
| 05/27/1993 | WO1993010560A1 High-voltage insulating disk |
| 05/27/1993 | WO1993010540A1 Direct-hardening sealing compounds |
| 05/27/1993 | DE4239324A1 Protective coating for electronic device contg. fluorinated acrylate] - and/or fluorinated polyurethane and opt. acrylic] resin, applied as organic soln. |
| 05/27/1993 | DE4138411A1 Haertende vergussmassen Encapsulants curing |
| 05/27/1993 | CA2123877A1 Die mounting with uniaxial conductive adhesive |
| 05/27/1993 | CA2123574A1 High voltage insulating disk |
| 05/26/1993 | EP0543411A2 A wiring board and a method for producing the same |
| 05/26/1993 | EP0543364A2 Method for manufacturing polyimide multilayer wiring substrate |
| 05/26/1993 | EP0543361A2 Semiconductor device and method of manufacturing the same |
| 05/26/1993 | EP0543331A2 Polyimide multilayer interconnection board and method of making the same |
| 05/26/1993 | EP0543254A2 A method of forming high-stability metallic contacts in an integrated circuit with one or more metallized layers |
| 05/26/1993 | EP0543228A1 Aqueous binder combination and its use |
| 05/26/1993 | EP0543158A2 Method of conducting strap formation in a semiconductor device |