| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/07/1993 | EP0549619A1 Process for manufacturing circuits. |
| 07/07/1993 | EP0290578B1 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 07/06/1993 | US5226137 Electronic key with multiple password protected sub-keys using address and translation to implement a block data move between public and protected sub-keys |
| 07/06/1993 | US5225965 Heat sink load spring assembly |
| 07/06/1993 | US5225897 Molded package for semiconductor devices with leadframe locking structure |
| 07/06/1993 | US5225710 Highly integrated electronic component with heat-conducting plate |
| 07/06/1993 | US5225709 Package having a structure for stabilizing and/or impedance-matching a semiconductor IC device accommodated therein |
| 07/06/1993 | US5225699 Dram having a large dielectric breakdown voltage between an adjacent conductive layer and a capacitor electrode and method of manufacture thereof |
| 07/06/1993 | US5225634 Hybrid circuit formed of two circuits whose tracks are connected by electric connection balls |
| 07/06/1993 | US5225633 Bridge chip interconnect system |
| 07/06/1993 | US5225499 Molding materials of epoxy resins and ether imides |
| 07/06/1993 | US5225484 With thermoplastic |
| 07/06/1993 | US5225373 Method of manufacturing semiconductor pressure sensor device with two semiconductor pressure sensor chips |
| 07/06/1993 | US5225023 Coating with a thermoplastic resin, immersion and drying |
| 07/06/1993 | US5224538 Dimpled heat transfer surface and method of making same |
| 07/06/1993 | US5224356 Method of using thermal energy absorbing and conducting potting materials |
| 07/06/1993 | US5224265 Fabrication of discrete thin film wiring structures |
| 07/06/1993 | US5224264 Process for producing a film carrier having a superior lead strength |
| 07/06/1993 | CA1320006C Package for integrated circuit |
| 07/01/1993 | DE4244544A1 Lead frame blanking appts. for integrated circuit mfr. - has press tool with individual punches set into die block for formation of connection leads for IC elements |
| 07/01/1993 | DE4243654A1 Thin integrated circuit card with integral battery - contains circuit board with battery aperture in resin with aperture, connector holding battery in aperture |
| 07/01/1993 | DE4241684A1 Encapsulated housing for semiconductor - has connecting leads bonded to housing with connecting wires embedded within protective material |
| 07/01/1993 | DE4231122A1 Heat sink for air cooled semiconductor - has diecast metal unit with plate form having radial fins across which forced air flows |
| 06/30/1993 | EP0549261A1 Method for forming interconnect for integrated circuits |
| 06/30/1993 | EP0549199A2 Method of forming silicide in integrated circuit manufacture |
| 06/30/1993 | EP0549160A1 Connector |
| 06/30/1993 | EP0548970A2 Prepolymers from bifunctional aromatic cyanates and electrical laminates made therefrom |
| 06/30/1993 | EP0548913A1 Packaging device and its manufacturing method |
| 06/30/1993 | EP0548882A1 Hybrid optical/electrical circuit module |
| 06/30/1993 | EP0548802A1 Ceramic composite with definite thermal expansion |
| 06/30/1993 | EP0548652A1 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/30/1993 | EP0548497A1 Plastic encapsulated semiconductor device incorporating a heat sink of metal having controlled roughness contact surfaces, and method of making the same |
| 06/30/1993 | EP0548496A1 A mold and a method for manufacturing semiconductor devices of plastics incorporating an exposed heat sink of metal for inspecting the soldered joint |
| 06/30/1993 | EP0548445A1 Universal surface mount package |
| 06/30/1993 | EP0548128A1 System of machining devices. |
| 06/29/1993 | US5224030 Semiconductor cooling apparatus |
| 06/29/1993 | US5224022 Reroute strategy for high density substrates |
| 06/29/1993 | US5224017 Composite heat transfer device |
| 06/29/1993 | US5223851 Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device |
| 06/29/1993 | US5223747 Heat dissipating device |
| 06/29/1993 | US5223746 Packaging structure for a solid-state imaging device with selectively aluminium coated leads |
| 06/29/1993 | US5223741 Package for an integrated circuit structure |
| 06/29/1993 | US5223740 Plastic mold type semiconductor device |
| 06/29/1993 | US5223739 Plastic molded semiconductor device having waterproof cap |
| 06/29/1993 | US5223738 Leadframe |
| 06/29/1993 | US5223735 Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same |
| 06/29/1993 | US5223733 Semiconductor integrated circuit apparatus and method for designing the same |
| 06/29/1993 | US5223676 Composite circuit board having means to suppress heat diffusion and manufacturing method of the same |
| 06/29/1993 | US5223557 Electronic device sealing resin compositions and sealed electronic devices |
| 06/29/1993 | US5223458 Method of manufacturing a III-V semiconductor device using a self-biased substrate and a plasma containing an electronegative species |
| 06/29/1993 | US5223456 High density local interconnect in an integrated circit using metal silicide |
| 06/29/1993 | US5223454 Method of manufacturing semiconductor integrated circuit device |
| 06/29/1993 | US5223442 Method of making a semiconductor device of a high withstand voltage |
| 06/29/1993 | US5223321 Tape with interconnection terminals of gold having Vickers hardness of 55 or less for even bonding to pad |
| 06/29/1993 | US5222294 High isolation packaging method |
| 06/29/1993 | CA1319763C Cure-box resin molded semiconductor device |
| 06/24/1993 | WO1993012638A1 Extended architecture for field programmable gate array |
| 06/24/1993 | WO1993012582A1 Programmable logic device cell and method |
| 06/24/1993 | WO1993012540A1 Integrated circuit with variable pad pitch |
| 06/24/1993 | WO1993012539A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/24/1993 | WO1993012263A1 High-strength thin plate of iron-nickel-cobalt alloy excellent in corrosion resistance, repeated bending behavior and etchability, and production thereof |
| 06/24/1993 | WO1993012190A1 Conductive adhesive compositions based on thermally depolymerisable polymers |
| 06/24/1993 | DE4211426C1 Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate |
| 06/24/1993 | DE4141650A1 Heat sink for power semiconductor component - has end of retaining clamp acting on semiconductor component fitting into opening in body of heat sink |
| 06/24/1993 | CA2126189A1 Thermal transfer posts for high density multichip substrates and formation method |
| 06/23/1993 | EP0547989A2 Alpha particle disturb reduction techniques |
| 06/23/1993 | EP0547877A2 Semiconductor power module |
| 06/23/1993 | EP0547807A2 Packaged electronic system |
| 06/23/1993 | EP0547600A1 Refractory metal silicide deposition process and apparatus |
| 06/23/1993 | EP0285051B1 Method for bonding integrated circuit chips |
| 06/23/1993 | CN1073385A Method for making thick film/solder joints |
| 06/22/1993 | USRE34291 Hybrid module electronics package |
| 06/22/1993 | US5222043 Circuit configuration for identification of integrated semiconductor circuitries |
| 06/22/1993 | US5222014 Three-dimensional multi-chip pad array carrier |
| 06/22/1993 | US5221859 Higher solderability and corrosion resistance |
| 06/22/1993 | US5221858 Tape automated bonding (TAB) semiconductor device with ground plane and method for making the same |
| 06/22/1993 | US5221851 Controlled-turn-off high-power semiconductor component |
| 06/22/1993 | US5221812 System for protecting leads to a semiconductor chip package during testing, burn-in and handling |
| 06/22/1993 | US5221642 Improved transfer of heat from within integrated circuit package |
| 06/22/1993 | US5221640 Method of producing wiring structures for electronic materials |
| 06/22/1993 | US5221639 Method of fabricating resistive conductive patterns on aluminum nitride substrates |
| 06/22/1993 | US5221634 Method of making semiconductor device employing self diffusion of dopant from contact member for augmenting electrical connection to doped region in substrate |
| 06/22/1993 | US5221575 Thermally conductive sheet |
| 06/22/1993 | US5221428 Production of lead frame |
| 06/22/1993 | US5220804 High heat flux evaporative spray cooling |
| 06/22/1993 | US5220726 Method for manufacturing an electrically connectable module |
| 06/22/1993 | CA1319430C Flexible printed circuit, especially for electronic cards, and card incorporating such a circuit |
| 06/16/1993 | EP0546824A1 Metallized paths on diamond surfaces |
| 06/16/1993 | EP0546731A1 Internal wiring structure of a semiconductor device |
| 06/16/1993 | EP0546560A1 Thick film copper paste composition |
| 06/16/1993 | EP0546435A2 Protection device for integrated circuit associated with relative supports |
| 06/16/1993 | EP0546285A1 Electronic package assembly with protective encapsulant material |
| 06/16/1993 | EP0546172A1 Circuit card assembly conduction converter and method. |
| 06/16/1993 | EP0537162A4 Metal electronic package having improved resistance to electromagnetic interference |
| 06/16/1993 | EP0276321B1 Spherical corundum particles, process for their production, and highly heat-conductive rubber or plastic composition containing them |
| 06/16/1993 | CN1073300A Semiconductor device and method for forming the same |
| 06/15/1993 | US5220534 Substrate bias generator system |
| 06/15/1993 | US5220491 High packing density module board and electronic device having such module board |
| 06/15/1993 | US5220490 Substrate interconnect allowing personalization using spot surface links |
| 06/15/1993 | US5220489 Multicomponent integrated circuit package |