| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/27/1993 | US5231077 Injection of particles and annaealing to form oxide with crystallization |
| 07/27/1993 | US5231057 Method of depositing insulating layer on underlying layer using plasma-assisted cvd process using pulse-modulated plasma |
| 07/27/1993 | US5231055 Etching, vapor deposition, titanium, tungsten |
| 07/27/1993 | US5231054 Vapor deposition, multilevel, temperature |
| 07/27/1993 | US5231053 Aluminum, titanium nitride |
| 07/27/1993 | US5231052 Process for forming a multilayer polysilicon semiconductor electrode |
| 07/27/1993 | US5231050 Method of laser connection of a conductor to a doped region of the substrate of an integrated circuit |
| 07/27/1993 | US5231042 Formation of silicide contacts using a sidewall oxide process |
| 07/27/1993 | US5231036 Hermetic sealing, integrated circuits, UV transparent |
| 07/27/1993 | US5230965 High density interconnect with electroplated conductors |
| 07/27/1993 | US5230759 Hermetic, resin adhesive |
| 07/27/1993 | US5230747 Wafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer |
| 07/27/1993 | US5230564 Temperature monitoring system for air-cooled electric components |
| 07/27/1993 | US5230145 Assembly including patterned diamond film submount with self-aligned laser device |
| 07/27/1993 | US5230144 Method of producing lead frame |
| 07/27/1993 | CA2017340C Hybrid module electronics package |
| 07/25/1993 | CA2086982A1 Package for microwave device |
| 07/24/1993 | CA2087799A1 Semiconductor module with superior insulating and thermal conductivity capabilities |
| 07/22/1993 | WO1993014612A1 Sheet batteries as substrate for electronic circuits |
| 07/22/1993 | WO1993014518A1 Lead frames with improved adhesion |
| 07/22/1993 | WO1993014517A1 Semiconductor devices and methods of assembly thereof |
| 07/22/1993 | WO1993014516A1 Flexible circuit wiring board, and its manufacture |
| 07/22/1993 | DE4200491A1 Input protection circuit for data line semiconductor circuit - has transformer with centre tap on input coil, with output coil coupled to protection circuit outputs |
| 07/22/1993 | CA2127890A1 Semiconductor devices and methods of assembly thereof |
| 07/21/1993 | EP0552058A1 Method of producing multi-layered wiring substrate |
| 07/21/1993 | EP0551741A1 Heat pipe-electrical interconnect integration for chip modules |
| 07/21/1993 | EP0551726A1 Circuit pack layout with improved dissipation of heat produced by high power electronic components |
| 07/21/1993 | EP0551712A2 Semiconductor device with field plates |
| 07/21/1993 | EP0551677A1 Method of manufacturing fusible links in semiconductor devices |
| 07/21/1993 | EP0551512A1 Tape for tab |
| 07/21/1993 | EP0551395A1 Thermal stress-relieved composite microelectronic device |
| 07/21/1993 | EP0551382A1 Semiconductor chip assemblies, methods of making same and components for same |
| 07/21/1993 | CN1074557A 半导体装置 Semiconductor device |
| 07/20/1993 | US5229918 Metal heat sink baseplate for a semiconductor device |
| 07/20/1993 | US5229917 VLSI integration into a 3-D WSI dual composite module |
| 07/20/1993 | US5229916 Chip edge interconnect overlay element |
| 07/20/1993 | US5229915 Power semiconductor device with heat dissipating property |
| 07/20/1993 | US5229914 Cooling device that creates longitudinal vortices |
| 07/20/1993 | US5229846 Semiconductor device having noise reducing die pads |
| 07/20/1993 | US5229682 Field electron emission device |
| 07/20/1993 | US5229647 High density data storage using stacked wafers |
| 07/20/1993 | US5229645 Semiconductor device and manufacturing method thereof |
| 07/20/1993 | US5229643 Semiconductor apparatus and semiconductor package |
| 07/20/1993 | US5229642 Resin molded type semiconductor device having a conductor film |
| 07/20/1993 | US5229640 Surface mountable clock oscillator module |
| 07/20/1993 | US5229639 Low powder distribution inductance lead frame for semiconductor chips |
| 07/20/1993 | US5229638 Integrated circuit lead frame having Z-shape step portion |
| 07/20/1993 | US5229625 Boron-doped resistant silicon carbide layer on a silicon substrate, single crystal |
| 07/20/1993 | US5229329 Method of manufacturing insulated lead frame for integrated circuits |
| 07/20/1993 | US5229328 Method for bonding dielectric mounted conductors to semiconductor chip contact pads |
| 07/20/1993 | US5229327 Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemblies therefor |
| 07/20/1993 | US5229326 Forming conductive runners on semiconductor wafer, providing spacers, an active region, an oxide layer, and a planarized dielectric layer, patterning, etching, providing conductive material plug, patterning and etching, and coating |
| 07/20/1993 | US5229311 Method of reducing hot-electron degradation in semiconductor devices |
| 07/20/1993 | US5229307 Method of making extended silicide and external contact |
| 07/20/1993 | US5229257 Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions |
| 07/20/1993 | US5229213 Laminated structure, printed circuits |
| 07/20/1993 | US5228951 Method for embodying twin-connection integrated circuits |
| 07/20/1993 | US5228502 Cooling by use of multiple parallel convective surfaces |
| 07/20/1993 | CA2031865C High-density memory array packaging |
| 07/20/1993 | CA1320546C Electrical connectors and ic chip tester embodying same |
| 07/20/1993 | CA1320507C Thermal writing on glass or glass-ceramic substrates and copper-exuding glasses |
| 07/15/1993 | DE4243610A1 MOS power transistor with adjustable switching speed - has long meander shaped gate electrode connected to MOS transistors which determine turn on=off time |
| 07/15/1993 | DE4238438A1 Semiconductor component - comprises chip with bonding sites, base with hollow to house chip and lid on upper surface of chip |
| 07/15/1993 | DE4200586A1 Integrated circuit produced on semiconductor wafer - has electrical conducting path running over one edge of chip |
| 07/15/1993 | DE4200384A1 Expansion device for augmenting functions of basic component, e.g. EPROM or SRAM - has cover with cavity on component housing with fasteners, contg. extension modules |
| 07/14/1993 | EP0551117A2 Large scale integrated circuit device and thin film forming method and apparatus for the same |
| 07/14/1993 | EP0550999A1 A heat-transferring circuit substrate with limited thermal expansion and method for making same |
| 07/14/1993 | EP0550996A1 Structure and method for mounting laser diode arrays |
| 07/14/1993 | EP0550910A1 Advanced low RC multi-level interconnect technology for high performance integrated circuits |
| 07/14/1993 | EP0550888A2 Method of forming a single crystal aluminum conductor on a single crystal substrate |
| 07/13/1993 | US5227995 High density semiconductor memory module using split finger lead frame |
| 07/13/1993 | US5227738 Multistage amplifier |
| 07/13/1993 | US5227664 Semiconductor device having particular mounting arrangement |
| 07/13/1993 | US5227662 Composite lead frame and semiconductor device using the same |
| 07/13/1993 | US5227661 Integrated circuit device having an aminopropyltriethoxysilane coating |
| 07/13/1993 | US5227583 Ceramic package and method for making same |
| 07/13/1993 | US5227361 Oxide superconducting lead for interconnecting device component with a semiconductor substrate via at least one buffer layer |
| 07/13/1993 | US5227333 Selective etchingof a semiconductor substrate covered by a blanket of germanium and an overcoating of an electroconductive layer |
| 07/13/1993 | US5227332 Depositing a layer of a material containing a plating catalysts on a substrate; covering material with a dielectric, forming an aperture in dielectri and plating to fill the aperture |
| 07/13/1993 | US5227316 Depositing refractory metal layer over semiconductor, heat treating to form silicide, forming etch protection layer, etching away unprotected unreacted metal |
| 07/13/1993 | US5227314 Aluminum cosputtered with chromium; reducing out-diffusion |
| 07/13/1993 | US5227250 Glass-to-metal seal |
| 07/13/1993 | US5227232 Conductive tape for semiconductor package, a lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution |
| 07/13/1993 | US5226232 Method for forming a conductive pattern on an integrated circuit |
| 07/13/1993 | CA1320260C End fed liquid heat exchanger for an electronic component |
| 07/08/1993 | WO1993013637A1 Multi-layer circuit construction methods and structures with customization features and components for use therein |
| 07/08/1993 | WO1993013556A1 Multichip module cooling system |
| 07/08/1993 | WO1993013555A1 Semiconductor device |
| 07/08/1993 | WO1993013550A1 A method of constructing termination electrodes on yielded semiconductor die |
| 07/08/1993 | WO1993013246A1 Method and composition for cleaning articles |
| 07/08/1993 | DE4244615A1 Integrated circuit chip package with multi-voltage wiring pattern - has concentric rings of body surface metallisation provided for power supply to single or multivoltage chip |
| 07/08/1993 | DE4244083A1 Semiconductor memory device with internal state determining circuit - has region of chip surface for alternative connections of internal circuit to ends of supply lines |
| 07/08/1993 | CA2126969A1 Method and composition for cleaning articles |
| 07/08/1993 | CA2123120A1 Multichip module cooling system |
| 07/08/1993 | CA2086444A1 Stabilizer/spacer for semiconductor device |
| 07/07/1993 | EP0550171A2 Integrated circuit with silicon contact to silicide |
| 07/07/1993 | EP0550013A2 Semiconductor device and method of producing the same |
| 07/07/1993 | EP0549842A1 Camera unit for sheet surface flaw detection apparatus |
| 07/07/1993 | EP0549627A1 Sealing and adhesive compounds with special plasticizers. |
| 07/07/1993 | EP0549626A1 Moisture-setting alkoxysilane-terminated polyurethanes. |