| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/04/2013 | EP2634797A1 Wiring board |
| 09/04/2013 | EP2634795A1 Process for manufacture of through-type wiring substrate, and through-type wiring substrate |
| 09/04/2013 | EP2633557A1 Electronic device in plastic |
| 09/04/2013 | EP2633553A2 Package inductance compensating tunable capacitor circuit |
| 09/04/2013 | EP2633552A1 An apparatus for monolithic power gating on an integrated circuit |
| 09/04/2013 | EP2633551A1 Lead-free structures in a semiconductor device |
| 09/04/2013 | EP2633550A1 Photonics module and method of manufacturing |
| 09/04/2013 | EP2633548A1 Process for producing interconnect or redirect lines for at least one integrated-circuit component |
| 09/04/2013 | CN203180808U Motor soft start control device |
| 09/04/2013 | CN203179883U Circuit packaging structure |
| 09/04/2013 | CN203179877U Chip and test mode protective circuit thereof |
| 09/04/2013 | CN203179876U Trimming resistor |
| 09/04/2013 | CN203179875U Packaging structure of electronic device |
| 09/04/2013 | CN203179874U Wafer level high Q value silicon-based inductor structure |
| 09/04/2013 | CN203179873U 电力开关装置 Electrical switching apparatus |
| 09/04/2013 | CN203179872U Novel leading wire framework |
| 09/04/2013 | CN203179871U Carrier-free multi-turn encapsulation piece based on frame |
| 09/04/2013 | CN203179870U Novel packaging structure for silicon-based adapter plate |
| 09/04/2013 | CN203179869U Novel triode pin structure |
| 09/04/2013 | CN203179868U Inner lead connection structure for integrated circuit |
| 09/04/2013 | CN203179867U 半导体封装结构 The semiconductor package structure |
| 09/04/2013 | CN203179866U Active heat radiation apparatus for rectification unit |
| 09/04/2013 | CN203179865U Square flat pin-free package unit and lead frame |
| 09/04/2013 | CN203179864U Multilayer-film composite wrapped film |
| 09/04/2013 | CN203179863U Three-dimensional circuit packaging structure |
| 09/04/2013 | CN203179011U High speed storage chip module capable of reconfiguration and electronic system apparatus |
| 09/04/2013 | CN203178899U Radiating sheet and central processing unit |
| 09/04/2013 | CN103283139A 半导体装置 Semiconductor device |
| 09/04/2013 | CN103283018A Power distribution network |
| 09/04/2013 | CN103283017A Electronic assembly with improved thermal management |
| 09/04/2013 | CN103282546A Laminate and method for producing laminate |
| 09/04/2013 | CN103282440A Curable composition, cured article, and method for using curable composition |
| 09/04/2013 | CN103282401A 树脂组合物 Resin composition |
| 09/04/2013 | CN103282320A Lead-free glass for encapsulating semiconductor, and overcoat tube for encapsulating semiconductor |
| 09/04/2013 | CN103281858A Printed circuit board and manufacturing method thereof, and flip-chip packaging member and manufacturing method thereof |
| 09/04/2013 | CN103280444A Packaging chip, synchronizing method and packaging method for chips of enhanced Flash |
| 09/04/2013 | CN103280442A Capacitors using same lead frame and capacitive coupling isolating circuit |
| 09/04/2013 | CN103280441A Through-chip-interface (TCI) structure for wireless chip-to-chip communication |
| 09/04/2013 | CN103280440A Semiconductor structure and method for preparation of TEM (transmission electron microscope) samples |
| 09/04/2013 | CN103280439A Ultrathin high-density multilayer circuit flip-chip encapsulation structure and manufacturing method |
| 09/04/2013 | CN103280438A High-power dielectric carrier with accurate chip adhesion layer |
| 09/04/2013 | CN103280437A Solder ball, ball grid array packaging element comprising same and heat management enhancement method thereof |
| 09/04/2013 | CN103280436A Surface-mounted device and production method thereof |
| 09/04/2013 | CN103280435A Micro-electronic chip for realizing interconnection of high-density silicon through holes and manufacturing method of micro-electronic chip |
| 09/04/2013 | CN103280434A Energy-saving circulating type micro-nano optoelectronic chip radiating device based on Stirling engine |
| 09/04/2013 | CN103280433A Solar alternating current generating system, inverter and fixer thereof |
| 09/04/2013 | CN103280430A Static random storage unit, through hole structure thereof and production method |
| 09/04/2013 | CN103280410A Method for efficiently producing removable peripheral cards |
| 09/04/2013 | CN102723289B Manufacture method of normal chip single-faced three-dimensional circuit by manufactured by encapsulation prior to etching and normal chip single-faced three-dimensional circuit encapsulation structure |
| 09/04/2013 | CN102723288B Manufacture method of flip chip single-faced three-dimensional circuit manufactured by encapsulation prior to etching and flip chip single-faced three-dimensional circuit encapsulation structure |
| 09/04/2013 | CN102468252B Thin buckle for radiator |
| 09/04/2013 | CN102386154B Method for manufacturing heat pipe radiator |
| 09/04/2013 | CN102339762B Non-carrier semiconductor packaging part and manufacturing method thereof |
| 09/04/2013 | CN102254887B Semiconductor device structure and manufacturing method thereof |
| 09/04/2013 | CN102246295B Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device |
| 09/04/2013 | CN102169862B Fairlead structure for Bipolar circuit and manufacturing method thereof |
| 09/04/2013 | CN102165011B Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device |
| 09/04/2013 | CN102148230B 影像感测模块及其封装方法 Image sensing module and packaging method |
| 09/04/2013 | CN102130027B 半导体器件 Semiconductor devices |
| 09/04/2013 | CN102064161B Optimized power package structure of intelligent power module |
| 09/04/2013 | CN102034749B Array substrate and manufacturing method thereof |
| 09/04/2013 | CN102017825B Cooling device for a plurality of power modules |
| 09/04/2013 | CN101996922B Silicon on insulator (SOI) wafer and formation method thereof |
| 09/04/2013 | CN101986001B Light-emitting diode (LED) lamp |
| 09/04/2013 | CN101978493B Semiconductor assembly having reduced thermal spreading resistance and methods of making same |
| 09/04/2013 | CN101938118B Electrostatic discharge protection circuit with multi-power area integrated circuit |
| 09/04/2013 | CN101807581B Contactless split-gate flash memory of shared word line and manufacture method thereof |
| 09/04/2013 | CN101587275B Electro-optical device and electronic apparatus |
| 09/04/2013 | CN101578025B Dissipating device |
| 09/04/2013 | CN101572991B Printed circuit board and method for its production |
| 09/04/2013 | CN101540311B Multilayer wiring substrate and method of manufacturing the same |
| 09/04/2013 | CN101538367B Diglycidylisocyanuryl-modified organopolysiloxane and composition containing the same |
| 09/04/2013 | CN101488487B Board adapted to mount an element, semiconductor module and manufacturing method therefore, and portable device |
| 09/04/2013 | CN101409281B Method and apparatus for laying out pattern of high power switch mode voltage regulators |
| 09/04/2013 | CN101127334B Integrated circuit packages and its manufacture method |
| 09/03/2013 | US8526199 Semiconductor device |
| 09/03/2013 | US8526194 Anti-ultraviolet memory device and fabrication method thereof |
| 09/03/2013 | US8526186 Electronic assembly including die on substrate with heat spreader having an open window on the die |
| 09/03/2013 | US8525994 Periodic patterns and technique to control misaligment between two layers |
| 09/03/2013 | US8525356 Wiring substrate, manufacturing method thereof, and semiconductor package |
| 09/03/2013 | US8525355 Semiconductor device, electronic apparatus and semiconductor device fabricating method |
| 09/03/2013 | US8525354 Bond pad structure and fabricating method thereof |
| 09/03/2013 | US8525353 Microspring structures adapted for target device cooling |
| 09/03/2013 | US8525352 Short and low loop wire bonding |
| 09/03/2013 | US8525351 Semiconductor device, substrate for producing semiconductor device and method of producing them |
| 09/03/2013 | US8525350 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps |
| 09/03/2013 | US8525349 Semiconductor device packages stacked together having a redistribution layer |
| 09/03/2013 | US8525348 Chip scale package and fabrication method thereof |
| 09/03/2013 | US8525347 Method for producing chip stacks, and associated chip stacks |
| 09/03/2013 | US8525346 Compliant conductive nano-particle electrical interconnect |
| 09/03/2013 | US8525345 Chip package and method for forming the same |
| 09/03/2013 | US8525343 Device with through-silicon via (TSV) and method of forming the same |
| 09/03/2013 | US8525342 Dual-side interconnected CMOS for stacked integrated circuits |
| 09/03/2013 | US8525341 Printed circuit board having different sub-core layers and semicondutor package comprising the same |
| 09/03/2013 | US8525340 Flexible electronic devices and related methods |
| 09/03/2013 | US8525339 Hybrid copper interconnect structure and method of fabricating same |
| 09/03/2013 | US8525338 Chip with sintered connections to package |
| 09/03/2013 | US8525337 Semiconductor device and method of forming stud bumps over embedded die |
| 09/03/2013 | US8525336 Semiconductor package and method of fabricating the same |
| 09/03/2013 | US8525335 Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |