Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1993
08/11/1993EP0554966A2 Cryogenic device
08/11/1993EP0554893A2 Partially-molded, PCB chip carrier package
08/11/1993EP0554742A2 Lead-on-chip semiconductor device
08/11/1993EP0554689A2 Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
08/11/1993EP0554563A1 Stabilizer/spacer for semiconductor device
08/11/1993EP0554500A1 Clip-on heat sink for computer chip package
08/11/1993EP0554396A1 Rapid-curing adhesive formulation for semiconductor devices
08/11/1993EP0487640A4 Capacitor laminate for printed circuit board
08/11/1993EP0402368B1 Cvd process for depositing a layer on an electrically conductive thin-layer structure
08/11/1993EP0385979B1 High-density electronic modules, process and product
08/10/1993US5235541 Integrated circuit entirely protected against ultraviolet rays
08/10/1993US5235496 Device for packaging integrated circuits
08/10/1993US5235300 Millimeter module package
08/10/1993US5235212 Semiconductor device having a mechanical buffer
08/10/1993US5235211 Semiconductor package having wraparound metallization
08/10/1993US5235209 Multi-layer lead frame for a semiconductor device with contact geometry
08/10/1993US5235208 Package for microwave integrated circuit
08/10/1993US5235207 Semiconductor device
08/10/1993US5235200 Semiconductor integrated circuit device
08/10/1993US5235140 Electrode bump for flip chip die attachment
08/10/1993US5235135 Sealed electronic package providing in-situ metallization
08/10/1993US5235005 Polyimide resin composition and semiconductor device encapsulated therewith
08/10/1993US5234868 Method for determining planarization endpoint during chemical-mechanical polishing
08/10/1993US5234866 Semiconductor device and process for producing the same, and lead frame used in said process
08/10/1993US5234864 Etching contactor windows in interior dielectric layer yields uniform contact resistance
08/10/1993US5234655 Method of forming a mold
08/10/1993US5234556 Irradiating a metalalkoxide solution to break the metal-alkoxy group bond; forming metal oxide prepolymer
08/10/1993US5234536 Process for the manufacture of an interconnect circuit
08/10/1993US5234513 Used for color cathode ray tubes
08/10/1993US5234153 Permanent metallic bonding method
08/05/1993WO1993015521A1 Backplane grounding for flip-chip integrated circuit
08/05/1993WO1993015520A1 Flexible multilayer circuit wiring board
08/04/1993WO1993015142A1 Electrically dissipative composite
08/04/1993EP0554195A1 Auto-protected semi-conductor protection component
08/04/1993EP0554019A1 Improved bump structure and method for thermo-compression bonding to a semi-conductor device
08/04/1993EP0553981A2 Low-inductance package for multiple paralleled devices operating at high frequency
08/04/1993EP0553904A1 Thermal dissipation of integrated circuits using diamond paths
08/04/1993EP0553557A1 Process for making a multilayer lead frame assembly for an integrated circuit structure and multilayer integrated circuit die package formed by such process
08/04/1993EP0553463A1 Electronic package with enhanced heat sinking and method of making same
08/04/1993EP0553371A1 Epoxy resin molding material for sealing of electronic component
08/04/1993EP0366711B1 Semiconductor casing
08/04/1993EP0309543B1 Liquid immersion cooling assembly for integrated circuits
08/04/1993EP0284624B1 Method of forming a multichip integrated circuit package
08/04/1993CN2139767Y Contacting radiator for electronic device
08/04/1993CA2129443A1 Electrically dissipative composite
08/03/1993US5233622 Structure of semiconductor laser package
08/03/1993US5233563 Memory security device
08/03/1993US5233504 Noncollapsing multisolder interconnection
08/03/1993US5233503 Pressure-contact type semiconductor device
08/03/1993US5233500 Package for cascaded microwave devices
08/03/1993US5233313 High power field effect transistor amplifier
08/03/1993US5233310 Microwave integrated circuit
08/03/1993US5233225 Resin encapsulated pin grid array and method of manufacturing the same
08/03/1993US5233224 Electrode having an improved configuration for a semiconductor element
08/03/1993US5233223 Semiconductor device having a plurality of conductive layers interconnected via a tungsten plug
08/03/1993US5233222 Semiconductor device having window-frame flag with tapered edge in opening
08/03/1993US5233221 Electronic substrate multiple location conductor attachment technology
08/03/1993US5233220 Balanced capacitance lead frame for integrated circuits and integrated circuit device with separate conductive layer
08/03/1993US5233217 Compactness, integrated circuits
08/03/1993US5233206 Double digitlines for multiple programming of prom applications and other anti-fuse circuit element applications
08/03/1993US5233135 Interconnect for integrated circuits
08/03/1993US5233134 Mounting arrangement for a semiconductor device
08/03/1993US5233131 Integrated circuit die-to-leadframe interconnect assembly system
08/03/1993US5233130 Semiconductor device
08/03/1993US5232909 Applying sol-gel method, coating by sintering or firing, evaporation under oxygen ions, deposition from a fluoride solution or oxidation after application of fluorides
08/03/1993US5232765 Distributed constant circuit board using ceramic substrate material
08/03/1993US5232747 Oxidizing PT surface, depositing AL
08/03/1993US5232463 Apparatus for manufacturing a semiconductor device
08/03/1993US5232047 Heat exchanger for solid-state electronic devices
08/03/1993US5231756 Process for manufacturing a multi-layer lead frame
08/03/1993US5231751 Process for thin film interconnect
08/03/1993CA2014311C Semiconductor device package and sealing method therefore
08/03/1993CA1320994C Reduction in power rail perturbation and in the effect thereof on integrated circuit performance
08/02/1993EP0563264A4 Leadless pad array chip carrier.
07/1993
07/31/1993CA2086846A1 Microcircuit package with integrated acoustic isolator
07/30/1993CA2085644A1 Low inductance package for multiple paralleled devices operating at high frequency
07/29/1993DE4301728A1 Printed circuit board used in electronic switches - comprises solder contact metal layer contg. two metals
07/29/1993DE4219575A1 Encapsulated pressure sensing semiconducting device - contains sensor element with membrane in resin capsule with section removed to form membrane access window
07/29/1993DE4202024A1 Insulated cooling box convecting lost heat from semiconductor components esp. in electric rail vehicle - has electrically insulating inner housing, highly impermeable to water vapour in annular edge region, and water-vapour permeable electrical seals
07/29/1993DE4138779A1 Contacting integrated circuit on flexible circuit board, glass or ceramic substrate - fixing IC using organic resin which contains highly conductive particles with irregular structure
07/28/1993EP0552984A2 Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials
07/28/1993EP0552969A1 A clear-mould solid-state imaging device using a charge coupled device
07/28/1993EP0552968A2 Semiconductor device including a wiring layer
07/28/1993EP0552935A2 A method of determining routes for a plurality of wiring connections and a circuit board produced by such a method
07/28/1993EP0552910A1 Socket
07/28/1993EP0552893A1 Method for forming an aluminium contact
07/28/1993EP0552787A1 Cooling structure for integrated circuits
07/28/1993EP0552701A2 Package for microwave device
07/28/1993EP0552575A1 Procedure of polytomic segmentation
07/28/1993EP0552538A1 Narrow channel finned heat sinking for cooling high power electronic components
07/28/1993EP0552522A1 Low dielectric, low temperature fired glass ceramics
07/28/1993EP0552475A1 Semi-conductor module with higher insulating and heat dissipating capability
07/28/1993EP0552278A1 Flame retardant epoxy molding compound, method and encapsulated device.
07/28/1993EP0296246B1 Semiconductor device and method of fabricating the same
07/27/1993US5231474 Semiconductor device with doped electrical breakdown control region
07/27/1993US5231306 Titanium/aluminum/nitrogen material for semiconductor devices
07/27/1993US5231305 Ceramic bonding bridge
07/27/1993US5231304 Framed chip hybrid stacked layer assembly
07/27/1993US5231303 Semiconductor device with incorporated stress reducing means
07/27/1993US5231302 Semiconductor device including an oblique surface and an electrode crossing the oblique surface
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