Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1993
09/01/1993EP0557754A2 Self-aligned contacts for complementary field-effect integrated circuits
09/01/1993EP0557278A1 A method of making a multilayer thin film structure.
09/01/1993EP0551382A4 Semiconductor chip assemblies, methods of making same and components for same
09/01/1993EP0455714B1 A method of manufacturing a substrate for placement of electrical and/or electronic components
09/01/1993CN1021997C Semiconductor memory device
09/01/1993CN1021996C Semiconductor memory device
08/1993
08/31/1993US5241456 Compact high density interconnect structure
08/31/1993US5241455 L-shaped channel wiring method
08/31/1993US5241454 Mutlilayered flexible circuit package
08/31/1993US5241453 EMI shielding device
08/31/1993US5241452 Package with heat sink
08/31/1993US5241450 Three dimensional, multi-chip module
08/31/1993US5241216 Ceramic-to-conducting-lead hermetic seal
08/31/1993US5241212 Semiconductor device having a redundant circuit portion and a manufacturing method of the same
08/31/1993US5241209 Semi-conductor device having circuits on both sides of insulation layer and ultrasonic signal path between the circuits
08/31/1993US5241207 Semiconductor device having an interconnected film with tapered edge
08/31/1993US5241134 Terminals of surface mount components
08/31/1993US5241133 Leadless pad array chip carrier
08/31/1993US5241131 Erosion/corrosion resistant diaphragm
08/31/1993US5240881 Soldering conductive clip
08/31/1993US5240872 Method of manufacturing semiconductor device having interconnection layer contacting source/drain regions
08/31/1993US5240867 Semiconductor integrated circuit having interconnection with improved design flexibility, and method of production
08/31/1993US5240588 Method for electroplating the lead pins of a semiconductor device pin grid array package
08/31/1993US5240429 Chip carrier socket
08/31/1993US5240421 Connector
08/31/1993US5240170 Method for bonding lead of IC component with electrode
08/31/1993US5239806 Thermoplastic semiconductor package and method of producing it
08/31/1993US5239747 Method of forming integrated circuit devices
08/31/1993US5239746 Method of fabricating electronic circuits
08/25/1993EP0557079A2 Discretionary lithography for integrated circuits
08/25/1993EP0556888A2 Large ceramic article and method of manufacturing
08/25/1993EP0556844A2 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
08/25/1993EP0556550A2 Ceramic chip carrier with lead frame or edge clip
08/25/1993EP0556429A1 Epoxy resin compositions
08/25/1993EP0556421A1 Curable resin compositions
08/25/1993EP0551395A4 Thermal stress-relieved composite microelectronic device
08/25/1993EP0258444B1 Semiconductor device
08/25/1993CN1021942C Protective structure of integrated ciruit
08/24/1993US5239448 For providing function in a computer system
08/24/1993US5239443 Blind hole cold plate cooling system
08/24/1993US5239440 Electrostatic discharge protection for integrated circuits
08/24/1993US5239201 Semiconductor memory device
08/24/1993US5239200 Apparatus for cooling integrated circuit chips
08/24/1993US5239199 For a high density array of semiconductor devices
08/24/1993US5239198 Overmolded semiconductor device having solder ball and edge lead connective structure
08/24/1993US5239191 Semiconductor wafer
08/24/1993US5239131 Electronic package having controlled epoxy flow
08/24/1993US5239126 High-frequency circuit package
08/24/1993US5238874 Fabrication method for laminated films comprising Al-Si-Co alloy film and refractory metal silioide copper film
08/24/1993US5238873 Method for manufacturing semiconductor device having a metallic silicide layer
08/24/1993US5238850 Bi-MOS type semiconductor integrated circuit device having high-frequency characteristics and method of making the same
08/24/1993US5237836 Fiber mat cryogenic cooling
08/24/1993CA2023439C Heat transfer member
08/24/1993CA1321659C Uses of uniaxially electrically conductive articles
08/22/1993CA2089939A1 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
08/19/1993WO1993016580A1 Pin-grid arrays
08/19/1993WO1993016579A1 High conductivity hybrid material for thermal management
08/19/1993WO1993016577A1 Sealed electronic package providing in-situ metallization
08/19/1993WO1993016493A1 Variable electrical impedance termination for leads on integrated circuit chips
08/19/1993WO1993016492A1 Advance multilayer molded plastic package using mesic technology
08/19/1993WO1993016488A1 Double layered tab tape and its manufacture
08/19/1993WO1993016487A1 Semiconductor device and its manufacture
08/19/1993WO1993016394A1 Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits
08/19/1993DE4303401A1 Semiconductor device e.g. DRAM mfr. - involves hole-free passive oxide film prodn. on bonding pad
08/19/1993DE4302203A1 Micropack integrated circuit mfr. using connection spider - has separate stations for separation of outer leads, separation of associated retaining strips and bending into spider format
08/19/1993DE4204539A1 Protection circuit for bipolar integrated circuit - uses integrated or external diodes to couple IC outputs to constant positive potential corresponding to half base-emitter operating voltage
08/19/1993DE4204459A1 Micropack integrated circuit with peripheral testing pads - has separation slits in surface of film carrier on all four sides of IC chip facilitating torsion-free separation
08/19/1993DE4204370A1 Structured conductor track mfr. from high temp. superconducting layers
08/19/1993CA2129334A1 Pin-grid arrays
08/19/1993CA2120464A1 Advance multilayer molded plastic package using mesic technology
08/19/1993CA2108542A1 Advance multilayer molded plastic package using mesic technology
08/19/1993CA2087756A1 Heat curable blends of silicone polyimide and epoxy resin
08/18/1993EP0555668A1 Printed circuit board for electronical power circuit containing power semiconductors
08/18/1993EP0555659A2 Multi-chip Module
08/18/1993EP0555407A1 Stacked configuration for integrated circuit devices.
08/18/1993EP0555284A1 Plastisol composition.
08/18/1993CN1075378A Thick film copper paste composition
08/18/1993CN1075340A Sealed electronic package providing in-situ metallization
08/18/1993CN1021862C Semiconductor device with device separation structure
08/17/1993US5237485 Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board
08/17/1993US5237434 Microelectronic module having optical and electrical interconnects
08/17/1993US5237269 Connections between circuit chips and a temporary carrier for use in burn-in tests
08/17/1993US5237206 Low-melting point glass sealed semiconductor device and method of manufacturing the same
08/17/1993US5237205 Ground plane for plastic encapsulated integrated circuit die packages
08/17/1993US5237204 Electric potential distribution device and an electronic component case incorporating such a device
08/17/1993US5237203 Multilayer overlay interconnect for high-density packaging of circuit elements
08/17/1993US5237202 Lead frame and semiconductor device using same
08/17/1993US5237201 TAB type semiconductor device and method of manufacturing the same
08/17/1993US5237199 Semiconductor device with interlayer insulating film covering the chip scribe lines
08/17/1993US5237184 For providing a target function
08/17/1993US5237130 Flip chip technology using electrically conductive polymers and dielectrics
08/17/1993US5236870 Efficiency, simplification
08/17/1993US5236869 Method of producing semiconductor device
08/17/1993US5236852 Method for contacting a semiconductor device
08/17/1993US5236779 Article of manufacture
08/17/1993US5236630 Conductor paste containing high amounts of either molybdenum or tungsten
08/17/1993US5236551 Termination of metallization
08/17/1993US5236118 Aligning, contacting for initial bonding, annealing to strengthen bonds
08/17/1993CA2004231C Conducting material and a method of fabricating thereof
08/11/1993EP0555032A1 Semiconductor contact via structure and method
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