| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/21/1993 | US5247133 High-vacuum substrate enclosure |
| 09/21/1993 | US5247001 Polyurethane and polypyrrole |
| 09/21/1993 | US5246898 Dielectric ceramics |
| 09/21/1993 | US5246888 Coating alloy on semiconductor, etching resist pattern with chlorine-based gas and removing with oxygen and ammonia plasma |
| 09/21/1993 | US5246887 Dielectric deposition |
| 09/21/1993 | US5246883 Semiconductor contact via structure and method |
| 09/21/1993 | US5246882 Method for embodying an electric circuit on an active element of an mis integrated circuit |
| 09/21/1993 | US5246880 Method for creating substrate electrodes for flip chip and other applications |
| 09/21/1993 | US5246873 Method of fabricating a programmable device including a protective region |
| 09/21/1993 | US5246732 Applying a metal, etching, activation with lead salts and electroless plating copper |
| 09/21/1993 | US5246539 Process for producing metrological structures particularly useful for analyzing the accuracy of instruments for measuring alignment on processed substrates |
| 09/21/1993 | US5246511 High-strength lead frame material and method of producing same |
| 09/21/1993 | US5245751 Array connector |
| 09/21/1993 | US5245750 Method of connecting a spaced ic chip to a conductor and the article thereby obtained |
| 09/16/1993 | WO1993018553A1 Method for reducing resistance for programmed antifuse |
| 09/16/1993 | WO1993018549A1 Process and device for three-dimensional interconnection of housings for electronic components |
| 09/16/1993 | WO1993018548A1 Microchannel cooling of face down bonded chips |
| 09/16/1993 | WO1993018547A1 Three dimensional, multi-chip module |
| 09/16/1993 | WO1993018546A1 Molded ring integrated circuit package |
| 09/16/1993 | DE4307600A1 Ceramic compsn. based on borosilicate glass, used in ceramic circuit board - contg. alumina filler and cordierite to control sintering temp., thermal expansion, dielectric constant and flexural strength |
| 09/16/1993 | DE4207524A1 Coding and identification system for semiconductor uses - has edge of disc formed with bar=code groove pattern that is read by opto-electronic sensors |
| 09/15/1993 | EP0560487A2 Semiconductor device having a lead frame |
| 09/15/1993 | EP0560478A1 Cooling structure for electronic circuit package |
| 09/15/1993 | EP0560471A2 Integrated circuit carrier |
| 09/15/1993 | EP0560276A2 IC chip attachment |
| 09/15/1993 | EP0560259A1 Heat sink having good heat dissipating characteristics and process for producing the same |
| 09/15/1993 | EP0560233A2 Metal-ceramic compound component |
| 09/15/1993 | EP0560123A2 Power transistor with multiple finger contacts |
| 09/15/1993 | EP0560084A2 Mechanically enhanced, high impact strength triazine resins, and method of preparing same |
| 09/15/1993 | EP0560077A2 Multichip module substrate and method of manufacture thereof |
| 09/15/1993 | EP0560072A2 Anisotropic electrically conductive adhesive film and connection structure using the same |
| 09/15/1993 | EP0559855A1 Flat module. |
| 09/15/1993 | EP0528001A4 Batch assembly methods for packaging of chips |
| 09/15/1993 | EP0278585B1 Packaged solid state surge protector |
| 09/14/1993 | US5245510 Hybrid integrated circuit device |
| 09/14/1993 | US5245412 Low capacitance silicon transient suppressor with monolithic structure |
| 09/14/1993 | US5245216 Plastic-molded type semiconductor device |
| 09/14/1993 | US5245215 Multichip packaged semiconductor device and method for manufacturing the same |
| 09/14/1993 | US5245214 Method of designing a leadframe and a leadframe created thereby |
| 09/14/1993 | US5245210 MOS type semiconductor device |
| 09/14/1993 | US5245205 Dynamic random access memory having a reliable contact |
| 09/14/1993 | US5245198 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
| 09/14/1993 | US5244838 Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device |
| 09/14/1993 | US5244836 Method of manufacturing fusible links in semiconductor devices |
| 09/14/1993 | US5244832 Method for fabricating a poly emitter logic array and apparatus produced thereby |
| 09/14/1993 | US5244712 Laminated diamond substrate |
| 09/14/1993 | US5244707 Enclosure for electronic devices |
| 09/14/1993 | US5244418 Method of making a plug-in diode device and diode device produced thereby |
| 09/14/1993 | US5244404 IC socket |
| 09/14/1993 | US5243756 Integrated circuit protection by liquid encapsulation |
| 09/09/1993 | DE4306322A1 Layer connecting structure mfr. for semiconductor memory device - filling hole between upper and lower conductive layers with blocking metal film and tungsten film in two-stage process |
| 09/09/1993 | DE4207226A1 Monolithically integrated circuit with variable characteristic and function - has system for blowing of conductive tracks or short circuiting circuit elements via external terminals |
| 09/08/1993 | EP0559384A2 Devices with tape automated bonding |
| 09/08/1993 | EP0559366A1 Stackable three-dimensional multiple chip semiconductor device and method for making the same |
| 09/08/1993 | EP0559338A1 Thermosetting resin compositions |
| 09/08/1993 | EP0559323A2 Improved method of patterning a submicron semiconductor layer |
| 09/08/1993 | EP0559182A2 Semiconductor device |
| 09/08/1993 | EP0559092A1 Metal foam heat dissipator |
| 09/08/1993 | EP0558984A2 Hybrid ceramic thin-film module structure |
| 09/08/1993 | EP0558876A1 A semiconductor device package with shaped parts for direct coupling to standard connectors |
| 09/08/1993 | EP0558589A1 Bonding of solid state device to terminal board |
| 09/07/1993 | US5243498 Multi-chip semiconductor module and method for making and testing |
| 09/07/1993 | US5243497 Chip on board assembly |
| 09/07/1993 | US5243496 Molded case integrated circuit with a dynamic impedance reducing device |
| 09/07/1993 | US5243226 Programming of antifuses |
| 09/07/1993 | US5243223 Semiconductor device having housing with a gelled filler and an internal pressure absorbing chamber |
| 09/07/1993 | US5243222 Copper alloy metallurgies for VLSI interconnection structures |
| 09/07/1993 | US5243221 Aluminum metallization doped with iron and copper to prevent electromigration |
| 09/07/1993 | US5243220 Semiconductor device having miniaturized contact electrode and wiring structure |
| 09/07/1993 | US5243218 Cooling structure for electronics devices |
| 09/07/1993 | US5243217 Sealed semiconductor device with protruding portion |
| 09/07/1993 | US5243211 Power fet with shielded channels |
| 09/07/1993 | US5243208 Semiconductor integrated circuit device having a gate array with a ram and by-pass signal lines which interconnect a logic section and I/O unit circuit of the gate array |
| 09/07/1993 | US5243199 High frequency device |
| 09/07/1993 | US5243145 Package structure for multichip modules |
| 09/07/1993 | US5243141 Tab tape, method of bonding tab tape and tab tape package |
| 09/07/1993 | US5243140 Direct distribution repair and engineering change system |
| 09/07/1993 | US5243133 Ceramic chip carrier with lead frame or edge clip |
| 09/07/1993 | US5242867 Composition for making multilayer ceramic substrates and dielectric materials with low firing temperature |
| 09/07/1993 | US5242861 Prevention of short circuiting, efficiency, accuracy |
| 09/07/1993 | US5242860 Method for the formation of tin barrier layer with preferential (111) crystallographic orientation |
| 09/07/1993 | US5242851 Programmable interconnect device and method of manufacturing same |
| 09/07/1993 | US5242715 Cationically hardening solvent-free epoxy resins by heat or uv rad |
| 09/07/1993 | US5242551 Isomerization of aromatic isoimides to imides |
| 09/04/1993 | CA2090789A1 Semiconductor device |
| 09/02/1993 | WO1993017536A1 Self-locking heat sinks for surface mount devices |
| 09/02/1993 | WO1993017457A1 Substrate for mounting semiconductor and method of producing the same |
| 09/02/1993 | WO1993017456A1 Semiconductor devices and methods of mass production thereof |
| 09/02/1993 | WO1993017455A2 Integrated-circuit package configuration for packaging an integrated-circuit die and method of packaging an integrated-circuit die |
| 09/02/1993 | WO1993017049A1 Connector |
| 09/02/1993 | WO1993016987A1 Low temperature flexible die attach adhesive and articles using same |
| 09/02/1993 | WO1993016921A1 Method of reducing moisture content of hermetic packages containing semiconductor devices |
| 09/02/1993 | CA2106981A1 Semiconductor devices and methods of mass production thereof |
| 09/01/1993 | EP0558359A1 Device for holding an electronic component to the side wall of a heat sink |
| 09/01/1993 | EP0558325A1 Raised feature on substrate for flip chip interconnection |
| 09/01/1993 | EP0558260A1 Method for formation of contact vias in integrated circuits |
| 09/01/1993 | EP0558226A2 Balanced circuitry for reducing inductive noise of external chip interconnections |
| 09/01/1993 | EP0558176A1 Metal-to-metal antifuse with improved diffusion barrier layer |
| 09/01/1993 | EP0558007A2 Semiconductor apparatus having excellent contact characteristics |
| 09/01/1993 | EP0558004A2 Refractory metal capped low resistivity metal conductor lines and vias |