Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1993
10/06/1993EP0563264A1 Leadless pad array chip carrier
10/06/1993EP0563247A1 Photodefinable interlevel dielectrics
10/06/1993EP0538465A4 Thin planer package for cooling an array of edge-emitting laser diodes
10/06/1993EP0364479B1 Gold compression bonding
10/06/1993EP0242369B1 Surface mountable integrated circuit packages having solder bearing leads
10/06/1993CN1077057A Method for producing high power transistor
10/06/1993CN1077056A Self-shielding semiconductor devices and manufacture thereof
10/05/1993USRE34395 Method of making a chip carrier with terminating resistive elements
10/05/1993US5251168 Boundary cells for improving retention time in memory devices
10/05/1993US5251107 Semiconductor package
10/05/1993US5251101 Dissipating structure for central processing unit chip
10/05/1993US5251100 Semiconductor integrated circuit device with cooling system and manufacturing method therefor
10/05/1993US5251098 Heat sink-hybrid circuit assembly
10/05/1993US5250931 Active matrix panel having display and driver TFT's on the same substrate
10/05/1993US5250848 For semiconductors, stability, durability
10/05/1993US5250847 Stress isolating signal path for integrated circuits
10/05/1993US5250846 Semiconductor device with multi-layer leads
10/05/1993US5250844 Multiple power/ground planes for tab
10/05/1993US5250843 Multichip integrated circuit modules
10/05/1993US5250842 Semiconductor devices using tab tape
10/05/1993US5250841 Semiconductor device with test-only leads
10/05/1993US5250840 Semiconductor lead frame with a chip having bonding pads in a cross arrangement
10/05/1993US5250839 Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates
10/05/1993US5250831 DRAM device having a memory cell array of a divided bit line type
10/05/1993US5250821 Electronic power device having plural elementary semiconductor components connected in parallel
10/05/1993US5250782 Method for the closing, by laser, of electronic circuit packages, notably hybrid circuit packages, minimizing mechanical stresses
10/05/1993US5250760 Semiconductor device
10/05/1993US5250637 Semiconductor encapsulating epoxy resin compositions and semiconductor devices
10/05/1993US5250600 Polyhydroxyl polyesters and polyethers modified with cyanate ester
10/05/1993US5250470 Method for manufacturing a semiconductor device with corrosion resistant leads
10/05/1993US5250469 IC mounting circuit substrate and process for mounting the IC
10/05/1993US5250467 Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer
10/05/1993US5250464 Method of making a low capacitance, low resistance sidewall antifuse structure
10/05/1993US5250459 Doping electrode(s) with antimony
10/05/1993US5250451 Passivation of substrate by hydrogenated amorphous carbon layer
10/05/1993US5250394 Screen printing thick film paste in pattern; drying; firing to form conductive layer; repeating with metallorganic conductive noble metal paste
10/05/1993US5250347 Mechanically enhanced, high impact strength triazine resins, and method of preparing same
10/05/1993US5250327 Improved electrical insulation, heat conductivity, adhesion
10/05/1993US5250319 Embedding polymerization catalyst in grooves in substrate, contacting with monomer to form electroconductive polymer oriented in longitudinal direction of grooves
10/05/1993US5250229 A mixture of finely divided particle of oxides of bismuth, copper, lead, zinc and transition metal; thick films
10/05/1993US5250130 Heating body and applying pressure in uniaxial direction
10/05/1993US5249728 Bumpless bonding process having multilayer metallization
10/05/1993US5249354 Method of making electronic component packages
10/04/1993CA2065124A1 Semiconductor device
09/1993
09/30/1993WO1993019488A1 Surface mountable integrated circuit package
09/30/1993WO1993019487A1 Integrated circuit module having microscopic self-alignment features
09/30/1993WO1993019485A1 Ic chip package and method of making same
09/30/1993DE4308705A1 Integrated circuit device with non-rectangular semiconductor chip - has inner contact points bordering on chip in configuration which corresponds to chip configuration
09/30/1993DE4209983A1 Semiconductor component mfr. esp. IMPATT diode prodn. - producing component, housing and connection contacts in integrated construction from and on semiconductor substrate
09/29/1993EP0562996A1 Electrically programmable antifuse using metal penetration of a junction
09/29/1993EP0562725A2 Adaptor element for modifying electrical connections to an electrical component
09/29/1993EP0562629A2 Semiconductor device comprising a package
09/29/1993EP0562613A2 Buried avalanche diode
09/29/1993EP0562556A1 Method for producing resin sealed type semiconductor device
09/29/1993EP0562388A1 Manufacturing method and apparatus for carrier elements with IC modules in ID-cards
09/29/1993EP0562309A2 Planar process using common alignment marks for well implants
09/29/1993EP0562060A1 Mounting arrangements for high voltage/high power semiconductors
09/29/1993EP0561914A1 Microelectronics package
09/29/1993EP0561806A1 Electrical device, in particular a switching and control device for motor vehicles.
09/28/1993US5249245 Optoelectroinc mount including flexible substrate and method for making same
09/28/1993US5249101 Using encapsulated solder spheres
09/28/1993US5249100 Silver, germanium alloy
09/28/1993US5249098 Semiconductor device package with solder bump electrical connections on an external surface of the package
09/28/1993US5248903 Composite bond pads for semiconductor devices
09/28/1993US5248902 Surface mounting diode
09/28/1993US5248901 Semiconductor devices and methods of assembly thereof
09/28/1993US5248895 Semiconductor apparatus having resin encapsulated tab tape connections
09/28/1993US5248854 Multilevel metallization for vlsi and method for forming the same
09/28/1993US5248853 Semiconductor element-mounting printed board
09/28/1993US5248848 Reflow compatible device package
09/28/1993US5248710 Flip chip encapsulating compositions and semiconductor devices encapsulated therewith
09/28/1993US5248663 Laminar structure, vacuum deposition
09/28/1993US5248632 Semiconductors
09/28/1993US5248351 Copper Ni-Si-P alloy for an electronic device
09/28/1993US5248347 Multilayer
09/27/1993CA2092767A1 Semiconductor device
09/23/1993DE4307743A1 Resin-encapsulated semiconductor device - uses resin mixt. contg. special epoxy] resin, phenolic resin hardener, imidazole cpd., tri:phenyl phosphate and/or wax
09/23/1993DE4209072A1 Stress free liquid crystal display system - embeds connections from conductors to printed circuit board leads in e.g. epoxy] resin which is cured in UV and unheated
09/23/1993DE4208891A1 Liquid cooled power semiconductor component - has ring-shaped outer housing gripping inner insulating housing to form liquid cooling channel with inlet and outlet
09/23/1993DE4208758A1 Polyarylene-ether] sulphone(s) and polyarylene-ether] ketone(s) - useful for encapsulating electrical and electronic components
09/22/1993EP0561620A2 Wiring sheet assemblies, and forming electrical connections thereof
09/22/1993EP0561567A2 Alloys containing gallium and aluminum as semiconductor electrical contacts
09/22/1993EP0561132A1 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD
09/22/1993EP0560832A1 Coin validators.
09/22/1993EP0560787A1 Identical semiconductor chips with indexing, produced together on a circuit board and subsequently separated.
09/22/1993EP0248883B1 Selective deposition process
09/22/1993CN1076548A Refractory metal capped low resistivity metal conductor lines and vias formed using pvd and cvd
09/22/1993CN1076547A Refractory metal capped low resisitivity metal conductor lines and vias
09/21/1993US5247426 Semiconductor heat removal apparatus with non-uniform conductance
09/21/1993US5247425 Semiconductor device
09/21/1993US5247423 Stacking three dimensional leadless multi-chip module and method for making the same
09/21/1993US5247349 Passivation and insulation of III-V devices with pnictides, particularly amorphous pnictides having a layer-like structure
09/21/1993US5247262 Linewidth micro-bridge test structure
09/21/1993US5247250 Integrated circuit test socket
09/21/1993US5247204 Semiconductor device having multilayer interconnection structure
09/21/1993US5247203 Semiconductor device mounted on a heat sink with an intervening amorphous semiconductor material
09/21/1993US5247202 Plurality of arrangements each including an ic magnetic field sensor and two ferromagnetic field concentrators, and a procedure for incorporating each arrangement into a package
09/21/1993US5247199 Process for forming twin well CMOS integrated circuits
09/21/1993US5247191 Semiconductor device
09/21/1993US5247134 Heat-resistant hermetic packages for electronic components
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