Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1993
10/28/1993WO1993021748A1 Membrane dielectric isolation ic fabrication
10/28/1993WO1993021280A1 Refrigerant composition and binary refrigerating system using the composition
10/27/1993EP0567255A1 Surface mount chip carrier
10/27/1993EP0567209A2 Liquid crystal panel module and tape carrier package for liquid crystal driver IC
10/27/1993EP0567127A2 Semiconductor device capable of correctly forming conductor groups
10/27/1993EP0567016A2 Multi layered wiring board and method for manufacturing the same
10/27/1993EP0566921A1 Semi-conductor assembly, in particular a remote control/receiver module
10/27/1993EP0566913A1 Thermally enhanced semiconductor chip package
10/27/1993EP0566901A2 Electronic devices having metallurgies containing copper-semiconductor compounds
10/27/1993EP0566872A2 A thermally enhanced semiconductor device and method for making the same
10/27/1993EP0506710A4 Process enhancement using molybdenum plugs in fabricating integrated circuits
10/27/1993EP0448713B1 Semiconductor device
10/27/1993EP0286690B1 Aluminum nitride and semiconductor substrate formed therefrom
10/26/1993US5257230 Memory device including redundancy cells with programmable fuel elements and process of manufacturing the same
10/26/1993US5257162 Bellows lid for c4 flip-chip package
10/26/1993US5256903 Plastic encapsulated semiconductor device
10/26/1993US5256902 Metal heatsink attach system
10/26/1993US5256900 Package for semiconductor device with at least one through hole
10/26/1993US5256899 Integrated circuit fuse link having an exothermic charge adjacent the fuse portion
10/26/1993US5256598 Shrink accommodating lead frame
10/26/1993US5256597 Self-aligned conducting etch stop for interconnect patterning
10/26/1993US5256590 Method of making a shielded semiconductor device
10/26/1993US5256578 Integral semiconductor wafer map recording
10/26/1993US5256577 Process for determining the position of a p-n transition
10/26/1993US5256470 Fired at low temperature; coefficient of thermal expansion; dielectric constant
10/26/1993US5256469 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
10/26/1993US5255840 Fluxless solder coating and joining
10/26/1993US5255839 Method for solder application and reflow
10/26/1993CA2014821C Semiconductor integrated circuit device
10/21/1993DE4312468A1 Dynamic random access memory cell - has insulating film on word-line, covered by conductive layer, insulating layer and bit-line formed on insulating layer
10/20/1993EP0566360A1 Process for the production of substrate for printed wiring
10/20/1993EP0566253A1 Method for forming contact structures in integrated circuits
10/20/1993EP0565729A1 Laser device
10/20/1993EP0322434B1 Flat bodies, in particular for use as heat sinks for electronic power components
10/20/1993EP0321550B1 Cryogenic vessel for cooling electronic circuit means
10/19/1993US5255157 Molded semiconductor package
10/19/1993US5255156 Bonding pad interconnection on a multiple chip module having minimum channel width
10/19/1993US5254941 Structure and method for determining isolation of integrated circuit
10/19/1993US5254874 High density local interconnect in a semiconductor circuit using metal silicide
10/19/1993US5254872 Semiconductor device and method of manufacturing the same
10/19/1993US5254871 Very large scale integrated circuit package, integrated circuit carrier and resultant interconnection board
10/19/1993US5254811 Hybrid microchip bonding article
10/19/1993US5254605 Imide epoxy resin composition for sealing semiconductor elements
10/19/1993US5254500 Method for making an integrally molded semiconductor device heat sink
10/19/1993US5254498 Opening contact hole larger than intended size; forming oxidation layer until hole diameter reaches target size; etching; embedding metal
10/19/1993US5254490 Forming, selective etching of refracotyr metal silicides and ) nitrides
10/19/1993US5254482 Ferroelectric capacitor test structure for chip die
10/19/1993US5253702 Integral heat pipe, heat exchanger, and clamping plate
10/19/1993US5253415 Method of making an integrated circuit substrate lead assembly
10/14/1993WO1993020675A1 Integrated circuit test socket
10/14/1993WO1993020586A1 Leadframe having one or more power/ground planes without vias
10/14/1993WO1993020585A1 Reaction resins for potting pressure-sensitive electronic components
10/14/1993WO1993020583A1 METHOD AND STRUCTURE FOR SUPPRESSING CHARGE LOSS IN EEPROMs/EPROMs AND INSTABILITIES IN SRAM LOAD RESISTORS
10/14/1993WO1993020562A1 Conductor-filled thermosetting resin
10/14/1993WO1993019857A1 Layered chip structure
10/14/1993DE4312057A1 Arrangement for cooling highly integrated multi=chip modules for data processing systems with high computing power - contains cooling plate and mechanical heat transfer devices, covering and sealing elastic plate
10/14/1993DE4309542A1 Semiconductor device with improved wire and contact resistance - comprising insulator with recesses and having patterned structure, and electrode intermediate connection
10/14/1993DE4212368A1 Mounting components in control device for motor vehicle - attaching several components to housing frame using single spring
10/14/1993DE4210834A1 Heat sink for integrated circuit micro-chip thin film package - uses cooling plate with cooling channels open to membrane sealed to underside of plate inside facing IC micro-package
10/14/1993CA2132747A1 Layered chip structure
10/13/1993EP0565297A1 Cooling system and cooling apparatus
10/13/1993EP0565151A2 Manufacture of multi-layer ceramic interconnect structures
10/13/1993EP0564865A1 Semiconductor device with test-only contacts and method for making the same
10/13/1993EP0564652A1 Manufacture of multilayer ceramic part, and multilayer ceramic part
10/13/1993EP0564467A1 Circuit for protecting a semiconductor device from voltage produced by discharges of static electricity.
10/12/1993US5253010 Flexible
10/12/1993US5252857 Stacked DCA memory chips
10/12/1993US5252855 Lead frame having an anodic oxide film coating
10/12/1993US5252854 Semiconductor device having stacked lead structure
10/12/1993US5252853 Packaged semiconductor device having tab tape and particular power distribution lead structure
10/12/1993US5252784 Electronic-parts mounting board and electronic-parts mounting board frame
10/12/1993US5252783 Semiconductor package
10/12/1993US5252781 Substrate member having electric lines and apertured insulating film
10/12/1993US5252639 Including a release agent and a zirconium chelate; adhesion; moisture resistance; moldability; encapsulation; semiconductors
10/12/1993US5252519 Multilayered ceramic substrate and method of manufacturing the same
10/12/1993US5252518 Method for forming a mixed phase TiN/TiSi film for semiconductor manufacture using metal organometallic precursors and organic silane
10/12/1993US5252516 Reducing defects
10/12/1993US5252505 Method for manufacturing a semiconductor device
10/12/1993US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered
10/12/1993US5252382 Interconnect structures having patterned interfaces to minimize stress migration and related electromigration damages
10/12/1993US5252177 Method for forming a multilayer wiring of a semiconductor device
10/12/1993US5251806 Method of forming dual height solder interconnections
10/12/1993US5251803 Controlled heating and pressing of ceramic base and copper(or alloy) layer having thin film of active metal between, in presence of inert gases, simplification, bonding strength
10/12/1993US5251679 Apparatus for shaping outboard terminals of surface-mountable circuit modules
10/12/1993CA2024383C Hermetic package for an electronic device and method of manufacturing same
10/07/1993DE4310556A1 Heat pipe radiator for large scale integrated circuit - has cooling plate and heat conduction plate cooperating with evaporation and condensation zones of heat pipe
10/07/1993DE4211250A1 Reaktionsharze zum Vergießen von druckempfindlichen elektronischen Bauelementen Resins for casting pressure-sensitive electronic components
10/06/1993EP0564191A2 Structure and method for fabricating integrated circuits
10/06/1993EP0564138A1 Field programmable device
10/06/1993EP0564136A1 Method for planarization of an integrated circuit
10/06/1993EP0564027A1 Heat exchanger, a method of manufacturing same, and applications
10/06/1993EP0564019A2 Multilayer thermoplastic electronic package and method of making same
10/06/1993EP0564009A1 Electric and electronic devices having a polyimide resin insulating film
10/06/1993EP0563993A2 Electronic unit cooling system
10/06/1993EP0563969A2 High frequency signal transmission tape and apparatus for bonding the high frequency signal transmission tape
10/06/1993EP0563873A2 High frequency ceramic multi-layer substrate
10/06/1993EP0563852A1 Zag fuse for reduced blow-current applications
10/06/1993EP0563679A1 Cooling device for bare integrated components assembled as a flat structure
10/06/1993EP0563668A2 Cooling device for bare integrated components assembled as a flat structure
10/06/1993EP0563266A1 Integrated circuit die-to-leadframe interconnect assembly system
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