Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1993
11/18/1993EP0569949A2 Surface mount components and semifinished products thereof
11/18/1993EP0569799A2 Conductive paste for a ceramic substrate
11/18/1993EP0569762A1 Pattern formation in photohardenable dielectric layers
11/18/1993EP0569705A1 Electronic part assembly
11/18/1993EP0569487A1 Endothelin converting enzyme inhibitors
11/18/1993EP0563266A4 Integrated circuit die-to-leadframe interconnect assembly system
11/18/1993EP0538457A4 Fabrication of metal matrix composites by vacuum die casting
11/18/1993DE4311509A1 Prodn. of semiconductor constructional element - by producing reliable connections between conducting pathways using number of insulators and conductors on substrate
11/18/1993DE4232547C1 Fixture device for substrate of HF thin layer circuits - is positioned on floor of screening housing on which component is screwed extending transversely over substrate
11/16/1993US5262927 Partially-molded, PCB chip carrier package
11/16/1993US5262925 Tab frame with area array edge contacts
11/16/1993US5262922 Heat radiation structure for semiconductor device
11/16/1993US5262719 Test structure for multi-layer, thin-film modules
11/16/1993US5262718 Anisotropically electrically conductive article
11/16/1993US5262675 Laser diode package
11/16/1993US5262674 Chip carrier for an integrated circuit assembly
11/16/1993US5262673 Semiconductor element
11/16/1993US5262672 Semiconductor structure
11/16/1993US5262671 Semiconductor device in which a peripheral potential barrier is established
11/16/1993US5262614 Circuit board and sealing structure and methods for manufacturing the same
11/16/1993US5262361 Vacuum evaporation onto a silicon, germanium or calcium fluoride surface
11/16/1993US5262354 Refractory metal capped low resistivity metal conductor lines and vias
11/16/1993US5262353 Process for forming a structure which electrically shields conductors
11/16/1993US5262352 Method for forming an interconnection structure for conductive layers
11/16/1993US5262351 Process for manufacturing a multilayer integrated circuit interconnection
11/16/1993US5262226 Anisotropic conductive film
11/16/1993US5261593 Direct application of unpackaged integrated circuit to flexible printed circuit
11/16/1993US5261158 Forming an electrical connector component
11/16/1993US5261156 Method of electrically connecting an integrated circuit to an electric device
11/16/1993US5261155 Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
11/11/1993WO1993022795A1 Interconnection system for high performance electronic hybrids
11/11/1993WO1993022475A1 Solder bumping of integrated circuit die
11/10/1993EP0569090A1 Image sensor
11/10/1993EP0568995A2 Semiconductor device with bumps
11/10/1993EP0568715A1 Circuit board
11/10/1993EP0568692A1 Power fet with shielded channels.
11/10/1993EP0424522A4 Interconnect device and method of manufacture thereof
11/09/1993US5260728 Apparatus for reducing, enlarging and projecting image information
11/09/1993US5260604 Aluminum alloy film used as interconnection of semiconductor device
11/09/1993US5260602 Hybrid integrated-circuit device having an asymmetrical thermal dissipator
11/09/1993US5260601 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
11/09/1993US5260600 Silicon oxynitride film
11/09/1993US5260599 Conductive clearing frame for a semiconductor component
11/09/1993US5260597 Routing structure for a customizable integrated circuit
11/09/1993US5260519 Multilayer ceramic substrate with graded vias
11/09/1993US5260518 Multilayer circuit board for mounting ICs and method of manufacturing the same
11/09/1993US5260517 For a semiconductor wafer
11/09/1993US5260234 Method for bonding a lead to a die pad using an electroless plating solution
11/09/1993US5260233 Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding
11/09/1993US5260169 Method for manufacturing semiconductor device
11/09/1993US5260168 Application specific tape automated bonding
11/09/1993US5260119 Sintered borosilicate and high silica glass mixture; printed circuits
11/09/1993US5260115 Unidirectional polymer film from an acetylenic hydrocarbon monomer having a silyl trichloride group anchored perpendicularly to a silicon dioxide layer on a grooved silicon substrate; nonlinear optics
11/09/1993US5259923 Dry etching method
11/09/1993US5259436 Fabrication of metal matrix composites by vacuum die casting
11/09/1993US5259110 Method for forming a multilayer microelectronic wiring module
11/09/1993CA2016851C Method of manufacturing thick-film devices
11/07/1993CA2095058A1 Semiconductor device with bumps
11/04/1993DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame
11/04/1993DE4214202A1 Plastic laminates with thermal expansion tailored to suit application - have all layers with rod-shaped molecules and arranged in pairs with their molecules orientated in planned pattern as required
11/03/1993EP0568385A2 Method for forming contact vias in integrated circuits
11/03/1993EP0568312A2 Semiconductor device with driver chip and methods of manufacture
11/03/1993EP0568108A1 Method and structure for inhibiting dopant and/or silicon out-diffusion
11/03/1993EP0567996A1 Semiconductor device and method of assembling the same
11/03/1993EP0567937A2 High reliability die processing
11/03/1993EP0567919A2 Epoxy resin composition and resin-encapsulated semiconductor device
11/03/1993EP0567867A2 Oxidation-resistant compound of Cu3Si and fabrication thereof
11/03/1993EP0567835A1 Electrically conductive abrasion resistant polymeric materials, their fabrication and uses thereof
11/03/1993EP0567814A1 Printed circuit board for mounting semiconductors and other electronic components
11/03/1993EP0567694A1 Semiconductor integrated circuit device with noise protecting shield
11/03/1993EP0401341B1 Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
11/03/1993EP0261194B1 Interconnection systems for electrical circuits
11/02/1993US5258947 MOS fuse with programmable tunnel oxide breakdown
11/02/1993US5258920 Locally orientation specific routing system
11/02/1993US5258891 Multichip module with multilayer wiring substrate
11/02/1993US5258887 Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels
11/02/1993US5258726 Voltage controlled oscillator with low operating supply voltage
11/02/1993US5258673 Rectifier device in vehicle AC generator
11/02/1993US5258650 Pressure transducer
11/02/1993US5258649 Semiconductor device and electronic apparatus using semiconductor device
11/02/1993US5258648 Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
11/02/1993US5258647 Electronic systems disposed in a high force environment
11/02/1993US5258646 Package for microwave IC
11/02/1993US5258643 Electrically programmable link structures and methods of making same
11/02/1993US5258633 Semiconductor device having an IGFET with diffused gate connection
11/02/1993US5258577 Method of forming an electronic device
11/02/1993US5258576 Integrated circuit chip carrier lid
11/02/1993US5258575 Ceramic glass integrated circuit package with integral ground and power planes
11/02/1993US5258426 Semiconductor device encapsulant
11/02/1993US5258335 Low dielectric, low temperature fired glass ceramics
11/02/1993US5258334 Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices
11/02/1993US5258331 Method of manufacturing resin-encapsulated semiconductor device package using photoresist or pre-peg lead frame dam bars
11/02/1993US5258330 Semiconductor chip assemblies with fan-in leads
11/02/1993US5258329 Method for manufacturing a multi-layered interconnection structure for a semiconductor IC structure
11/02/1993US5258328 Method of forming multilayered wiring structure of semiconductor device
11/02/1993US5258236 Multi-layer thin film structure and parallel processing method for fabricating same
11/02/1993US5258219 Optimized thin film metal interconnects in integrated circuit structures of apparatus to reduce circuit operational delay
11/02/1993US5258218 Laser scored
11/02/1993CA1323914C Thick film microwave coupler
10/1993
10/31/1993CA2094344A1 Epoxy resin composition and resin-encapsulated semiconductor device
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