H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1993
12/09/1993	DE4318727A1 Semiconductor device with lead-on-chip-structure - has brazing solder material with no moisture absorption, formed on surface of semiconductor component and fixed to support plate
12/09/1993	DE4218367A1 Electronic device with large number of leads - has ends of leads fixed to strip of electrically insulating material, e.g. epoxy resin or polyamide
12/09/1993	DE4218224A1 Slip-free spring clip - esp. used for fastening semiconductor device to heat sink
12/09/1993	CA2134755A1 Sub-nanoscale electronic systems, devices and processes
12/09/1993	CA2113906A1 Electronic tag
12/08/1993	EP0573297A2 Semiconductor device comprising a TAB tape
12/08/1993	EP0573241A2 Semiconductor devices with a double layered silicide structure and process of making it
12/08/1993	EP0573167A1 Heat sink mounting system for semiconductor devices
12/08/1993	EP0572514A1 Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
12/08/1993	CN1079338A Display assembly of light-emitting diodes
12/07/1993	USH1267 Integrated circuit and lead frame assembly
12/07/1993	US5268814 Module packaging
12/07/1993	US5268813 Flexible printed circuit package and flexible printed circuit for incorporating in such a package
12/07/1993	US5268812 Cooling multi-chip modules using embedded heat pipes
12/07/1993	US5268743 Apparatus for measuring flatness of outer lead
12/07/1993	US5268533 Pre-stressed laminated lid for electronic circuit package
12/07/1993	US5268532 Semiconductor device
12/07/1993	US5268333 Forming a borophosilicate glass; etching
12/07/1993	US5268332 Method of integrated circuit fabrication having planarized dielectrics
12/07/1993	US5268331 Masking, plasma spraying
12/07/1993	US5268329 Method of fabricating an integrated circuit interconnection
12/07/1993	US5268325 Method for fabricating a polycrystalline silicon resistive load element in an integrated circuit
12/07/1993	US5268315 Masking, patterning, etching multilayer structure; overcoating with passivation layer
12/07/1993	US5268072 Etching processes for avoiding edge stress in semiconductor chip solder bumps
12/07/1993	US5267867 Package for multiple removable integrated circuits
12/07/1993	US5267611 Single phase porous layer heat exchanger
12/07/1993	US5267379 Method of fabricating surface mountable clock oscillator module
12/02/1993	DE4316266A1 Semiconductor device with linear silicone resin on intermediate insulation - giving level surface, ensuring constant dia. of etched through-holes
12/02/1993	DE4224012C1 Solderable electric contact element - has silver@-tin@ alloy layer below gold@-tin@ solder alloy layer
12/01/1993	EP0572343A1 Ceramic via composition, multilayer ceramic circuit containing same, and process for using same
12/01/1993	EP0572326A2 Heat sink for cooling a heat producing element and application
12/01/1993	EP0572282A1 Multi-layer lead frame for a semiconductor device
12/01/1993	EP0572214A2 Method for fabricating an interconnect structure in an integrated circuit
12/01/1993	EP0572212A2 Method to form silicon doped CVD aluminium
12/01/1993	EP0572195A1 Socket for IC package
12/01/1993	EP0572043A1 Integrated circuit package which does not delaminate or crack
12/01/1993	EP0572011A1 Radiator assembly for substrate
12/01/1993	EP0571863A1 Mounting system for highly integrated and caseless components, mounted on printed circuit boards
12/01/1993	EP0571862A1 Mounting system for highly integrated and caseless components, mounted on printed circuit boards
12/01/1993	EP0571861A1 Mounting system for large-scale integrated components without carrier package mounted on circuit boards
12/01/1993	EP0571860A1 Mounting system for large-scale integrated components mounted on circuit boards
12/01/1993	EP0571756A2 High density, three-dimensional, intercoupled circuit structure
12/01/1993	EP0571749A1 Stacking semiconductor multi-chip module and method for making the same
12/01/1993	EP0571713A2 Gold thin film vapor growing method
12/01/1993	EP0571547A1 Multichip module and integrated circuit substrates having planarized patterned surfaces
11/1993
11/30/1993	US5266912 Inherently impedance matched multiple integrated circuit module
11/30/1993	US5266890 Test wafer for diagnosing flaws in an integrated circuit fabrication process that cause A-C defects
11/30/1993	US5266834 Semiconductor device and an electronic device with the semiconductor devices mounted thereon
11/30/1993	US5266833 Integrated circuit bus structure
11/30/1993	US5266832 Semiconductor apparatus and method for producing the same
11/30/1993	US5266830 Hetero junction bipolar transistor with reduced surface recombination current
11/30/1993	US5266829 Low leakage before programming and low resistance after programming
11/30/1993	US5266826 Semiconductor integrated circuit
11/30/1993	US5266815 Semiconductor integrated circuit device having superconductive layer and isolation member with nitride isolation
11/30/1993	US5266612 Imide epoxy resin composition for sealing semiconductor elements
11/30/1993	US5266526 Method of forming trench buried wiring for semiconductor device
11/30/1993	US5266525 Microelectronic interlayer dielectric structure and methods of manufacturing same
11/30/1993	US5266524 Method of manufacturing a semiconductor device whereby a layer containing aluminium is deposited on a surface of a semiconductor body
11/30/1993	US5266522 Structure and method for corrosion and stress-resistant interconnecting metallurgy
11/30/1993	US5266521 Method for forming a planarized composite metal layer in a semiconductor device
11/30/1993	US5266520 Electronic packaging with varying height connectors
11/30/1993	US5266519 Method for forming a metal conductor in semiconductor device
11/30/1993	US5266516 Method for making electrical contact through an opening of one micron or less for CMOS technology
11/30/1993	US5266511 Integrated Circuits
11/30/1993	US5266501 Method for manufacturing a solid state image sensing device using transparent thermosetting resin layers
11/30/1993	US5265670 Convection transfer system
11/30/1993	US5265321 Integrated circuit structure with heat exchanger elements secured thereto and method of making
11/30/1993	US5265316 Coating stem, case and inner lead with solder contianing 90% lead and rest tin and/or silver, fixing by melting the solder
11/25/1993	WO1993023980A1 Electrical connection system, especially for hybrid or other circuits
11/25/1993	WO1993023873A1 Non-conductive end layer for integrated stack of ic chips
11/25/1993	WO1993017455A3 Integrated-circuit package configuration for packaging an integrated-circuit die and method of packaging an integrated-circuit die
11/24/1993	EP0571108A1 Semiconductor contact via structure and method
11/24/1993	EP0571015A1 Electrolytic cleaning method for metal surfaces of electronic components
11/24/1993	EP0570971A1 Flip-clip-bonding alignment structure
11/24/1993	EP0570855A2 Method for producing multilayered ceramic substrate
11/24/1993	EP0570784A1 Card with at least one electronic element and process for manufacturing said card
11/24/1993	EP0570709A2 Integrated circuit comprising shield lives
11/24/1993	EP0570424A1 Carrier ring for semiconductor packages
11/24/1993	EP0570392A1 Arrangement of heat-generating structural components in a liquid-cooled device
11/24/1993	CN2147652Y 大电流半导体器件 Large current semiconductor devices
11/23/1993	US5264984 Cooling system for a package with electronic circuit components
11/23/1993	US5264731 Protective monomolecular fluorosiloxane film
11/23/1993	US5264730 Resin mold package structure of integrated circuit
11/23/1993	US5264729 Semiconductor package having programmable interconnect
11/23/1993	US5264728 Line material, electronic device using the line material and liquid crystal display
11/23/1993	US5264726 Chip-carrier
11/23/1993	US5264725 Computer chips
11/23/1993	US5264664 Programmable chip to circuit board connection
11/23/1993	US5264390 Method of automatic wiring in a semiconductor device
11/23/1993	US5264388 Sintered body of aluminum nitride
11/23/1993	US5264379 Band gaps; mesa structure; sulfide passivation; forming insulating film
11/23/1993	US5264377 Integrated circuit electromigration monitor
11/23/1993	US5264050 Cathode ray tubes
11/23/1993	US5263536 Miniature heat exchanger
11/23/1993	US5263251 Method of fabricating a heat exchanger for solid-state electronic devices
11/23/1993	US5263245 Method of making an electronic package with enhanced heat sinking
11/23/1993	US5263242 Method of making semiconductor package with segmented lead frame
11/23/1993	CA2096551A1 Semiconductor device
11/18/1993	EP0570205A1 A method for producing metal wirings on an insulating substrate
11/18/1993	EP0570069A2 Semiconductor device with a semiconductor body of which a surface is provided with a conductor pattern formed in a layer package comprising a TiW layer and an Al layer

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