| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/04/1994 | US5274916 Method of manufacturing ceramic multilayer electronic component |
| 01/04/1994 | US5274914 Method of producing surface package type semiconductor package |
| 01/04/1994 | US5274913 Method of fabricating a reworkable module |
| 01/04/1994 | US5274911 Electronic components with leads partly solder coated |
| 01/04/1994 | CA2024784C Stackable multilayer substrate for mounting integrated circuits |
| 12/29/1993 | EP0576374A1 Tool for mounting a chip between two heat sinks |
| 12/29/1993 | EP0576025A2 Semiconductor device and production method thereof |
| 12/29/1993 | EP0576021A1 Lead on chip structure for semiconductor device |
| 12/29/1993 | EP0575892A1 Semiconducteur power module |
| 12/29/1993 | EP0575889A2 Semiconductor device, resin for sealing same and method of fabricating same |
| 12/29/1993 | EP0575813A2 Multilayer glass ceramic substrate and process for producing the same |
| 12/29/1993 | EP0575398A1 Method and device for manufacturing a single product from integrated circuits received on a lead frame |
| 12/29/1993 | EP0484353B1 Substrate element with at least one integrated circuit, in particular a substrate element for inclusion in chip cards |
| 12/29/1993 | CN1080091A Insulated semiconductor package |
| 12/28/1993 | US5274531 For mounting a circuit component |
| 12/28/1993 | US5274279 Thin film CMOS inverter |
| 12/28/1993 | US5274270 Multichip module having SiO2 insulating layer |
| 12/28/1993 | US5274268 Electric circuit having superconducting layered structure |
| 12/28/1993 | US5274264 Defect tolerant power distribution network and method for integrated circuits |
| 12/28/1993 | US5274241 Optical and electromagnetic field |
| 12/28/1993 | US5274197 Electronic-parts mounting board and electronic-parts mounting board frame |
| 12/28/1993 | US5274193 Load spring for heat sink assemblies |
| 12/28/1993 | US5273954 Vapor deposition of a logitudinally continuous oxide superconducting layer of the surface of a flexible ceramics elongated substrate |
| 12/28/1993 | US5273940 Encapsulating around the semiconductor chips having contact pads with a gold bump mated to the substrate and removing some exposed chip material |
| 12/28/1993 | US5273938 Connecting the first semiconductor die and the first side of the conductive traces pattern and encapsulating followed by doing the same to the second die after removing the transfer film |
| 12/28/1993 | US5273929 Method of manufacture transistor having gradient doping during lateral epitaxy |
| 12/28/1993 | US5273203 Ceramic-to-conducting-lead hermetic seal |
| 12/28/1993 | US5272800 Method and apparatus for forming and positioning a preform on a workpiece |
| 12/27/1993 | CA2098855A1 Semiconductor device and production method thereof |
| 12/23/1993 | WO1993026142A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 12/23/1993 | WO1993025611A1 Inorganic fillers and organic matrix materials whose refractive index is adapted |
| 12/23/1993 | WO1993025605A1 Silicon and zirconium based lacquer, its use as a substrate coating and substrates thus obtained |
| 12/23/1993 | WO1993025332A1 Multipin structures |
| 12/23/1993 | DE4319786A1 Compact plastics encapsulated charge coupled device unit for mass prodn. - comprises semiconductor chip, lead frame, thin confining wall of thermosetting polymer, glass cover, metal wires, and cast body e.g for camcorder |
| 12/22/1993 | EP0575051A1 Stacked multi-chip modules and method of manufacturing |
| 12/22/1993 | EP0574956A1 Metallized circuit substrate comprising nitride type ceramics |
| 12/22/1993 | EP0574797A2 Pressure glass passing-through |
| 12/22/1993 | EP0574662A2 Insulated semiconductor package |
| 12/22/1993 | EP0554396A4 Rapid-curing adhesive formulation for semiconductor devices |
| 12/22/1993 | EP0363460B1 Epoxy-amine compositions employing unsaturated imides |
| 12/21/1993 | US5272600 Electrical interconnect device with interwoven power and ground lines and capacitive vias |
| 12/21/1993 | US5272377 Maleimide resin composition and resin encapsulated semiconductor device manufactured using the composition |
| 12/21/1993 | US5272376 Electrode structure for a semiconductor device |
| 12/21/1993 | US5272375 Electronic assembly with optimum heat dissipation |
| 12/21/1993 | US5272222 Curable resin compositions and electronic part protective coatings |
| 12/21/1993 | US5272111 Method for manufacturing semiconductor device contact |
| 12/21/1993 | US5272110 Method of forming wirings |
| 12/21/1993 | US5272104 Bonded wafer process incorporating diamond insulator |
| 12/21/1993 | US5272101 Electrically programmable antifuse and fabrication processes |
| 12/21/1993 | US5272009 Laminate material and its use as heat-sink |
| 12/21/1993 | US5271993 Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor |
| 12/21/1993 | US5271887 Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits |
| 12/21/1993 | US5271798 Method for selective removal of a material from a wafer's alignment marks |
| 12/21/1993 | US5271549 Multiple-lead element soldering method using sheet solder |
| 12/21/1993 | US5271148 Used for mounting/encapsulating an integrated circuit |
| 12/19/1993 | CA2098699A1 Compression glass lead-through arrangement |
| 12/16/1993 | DE4319249A1 Copper@ alloy contact backing material for semiconductor use - has excellent adhesion compared to epoxy] resin sealants, and contains nickel@, silicon, zinc@, magnesium@, tin@, etc. |
| 12/16/1993 | DE4319045A1 Low porosity fluoro-polymer electric substrate material - comprises coated ceramic filler in matrix contg. both PTFE and another fluoro:polymer of lower melt viscosity |
| 12/16/1993 | DE4317570A1 Semiconductor device formed on SOI substrate - has several integrated circuit elements formed in respective semiconductor areas separated from one another by insulating channels, bridged by connecting conductors |
| 12/16/1993 | DE4219287A1 Anorganische Füllstoffe und organische Matrixmaterialien mit Brechungsindex-Anpassung Inorganic fillers and organic matrix materials having a refractive index matching |
| 12/16/1993 | DE4217289A1 Fluid-cooled power transistor device, e.g. IGBT, MOSFET or BIMOS for controlling machine |
| 12/15/1993 | EP0574097A2 Semiconductor device having multilayer wiring and the method of making it |
| 12/15/1993 | EP0573965A2 Semiconductor device having bonding optional circuit |
| 12/15/1993 | EP0573838A2 Multi-chip-module |
| 12/15/1993 | EP0573714A2 Electrical connector circuit wafer |
| 12/15/1993 | EP0573519A1 A package for integrated circuits |
| 12/15/1993 | EP0357758B1 Hermetic package for integrated circuit chips |
| 12/15/1993 | EP0340284B1 Self-aligning liquid-cooling assembly |
| 12/15/1993 | CN1023165C Method of manufacturing electric devices |
| 12/14/1993 | US5270902 Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip |
| 12/14/1993 | US5270673 Surface mount microcircuit hybrid |
| 12/14/1993 | US5270592 Clock supply circuit layout in a circuit area |
| 12/14/1993 | US5270573 Resin mold field effect semiconductor device |
| 12/14/1993 | US5270572 Liquid impingement cooling module for semiconductor devices |
| 12/14/1993 | US5270571 Three-dimensional package for semiconductor devices |
| 12/14/1993 | US5270570 Lead frame for a multiplicity of terminals |
| 12/14/1993 | US5270492 Structure of lead terminal of electronic device |
| 12/14/1993 | US5270491 Hermetically sealed microelectronic package |
| 12/14/1993 | US5270488 Shield construction for electrical devices |
| 12/14/1993 | US5270485 High density, three-dimensional, intercoupled circuit structure |
| 12/14/1993 | US5270453 Aromatic bistriazene compounds |
| 12/14/1993 | US5270371 Adhesive compositions for electronic packages |
| 12/14/1993 | US5270262 O-ring package |
| 12/14/1993 | US5270256 Method of forming a guard wall to reduce delamination effects |
| 12/14/1993 | US5270255 Metallization process for good metal step coverage while maintaining useful alignment mark |
| 12/14/1993 | US5270254 Integrated circuit metallization with zero contact enclosure requirements and method of making the same |
| 12/14/1993 | US5270253 Method of producing semiconductor device |
| 12/14/1993 | US5270251 Incoherent radiation regulated voltage programmable link |
| 12/14/1993 | US5269453 Low temperature method for forming solder bump interconnections to a plated circuit trace |
| 12/14/1993 | US5269372 Intersecting flow network for a cold plate cooling system |
| 12/14/1993 | CA1325299C Epoxy resin based powder coating composition |
| 12/09/1993 | WO1993025003A1 Sub-nanoscale electronic systems, devices and processes |
| 12/09/1993 | WO1993024983A1 Electric machine with semiconductor valves |
| 12/09/1993 | WO1993024956A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device |
| 12/09/1993 | WO1993024955A1 Fluid-cooled power transistor arrangement |
| 12/09/1993 | WO1993024953A1 Transport robot for a machining or processing line for lead frames |
| 12/09/1993 | WO1993024925A1 Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board |
| 12/09/1993 | WO1993024902A1 Electronic tag |
| 12/09/1993 | WO1993024896A1 Computer-aided design methods and apparatus for multilevel interconnect technologies |
| 12/09/1993 | WO1993024564A1 Low temperature flexible die attach adhesive and articles using same |