| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/19/1994 | EP0578991A1 Bidirectional semiconductor switch |
| 01/19/1994 | EP0578915A2 Two-port ram cell |
| 01/18/1994 | US5280413 Hermetically sealed circuit modules having conductive cap anchors |
| 01/18/1994 | US5280409 For efficiently dissipating heat generated by integrated circuits |
| 01/18/1994 | US5280194 Electrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device |
| 01/18/1994 | US5280193 Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate |
| 01/18/1994 | US5280180 Interconnect structure for coupling semiconductor regions and method for making |
| 01/18/1994 | US5279992 Method of producing a wafer having a curved notch |
| 01/18/1994 | US5279989 Forming minature contacts over source and drain |
| 01/18/1994 | US5279984 Method for producing a semiconductor integrated circuit device in which circuit functions can be remedied or changed |
| 01/18/1994 | US5279983 Method of making a semiconductor memory device |
| 01/18/1994 | US5279980 Sputtering |
| 01/18/1994 | US5279888 Multilayer; silicon carbide, dielectric, electroconductive polysilicon and wiring layer |
| 01/18/1994 | US5279887 Polycrystalline silicon contact structure |
| 01/18/1994 | US5279850 Removal impurties from metallic layer to increase bonding sites |
| 01/18/1994 | US5279711 Chip attach and sealing method |
| 01/18/1994 | US5279706 Forming metal layer, applying photoresist, exposure to radiation |
| 01/18/1994 | US5279029 Ultra high density integrated circuit packages method |
| 01/17/1994 | CA2097388A1 Topographical selective patterns |
| 01/14/1994 | CA2100278A1 Curing silicon hydride containing materials by exposure to nitrous oxide |
| 01/13/1994 | DE4222512A1 Epitaxial deposition method for producing components on semiconductor substrate - forming components while substrate is placed on support substrate with test, measurement or adjustment structures |
| 01/13/1994 | DE4222474A1 Montageeinheit für Mehrlagenhybrid mit Leistungsbauelementen Mounting unit for multilayer hybrid with power devices |
| 01/13/1994 | DE4222402A1 Anordnung für die Mehrfachverdrahtung von Mulichipmodulen Arrangement for multiple wiring Mulichipmodulen |
| 01/13/1994 | DE4220966A1 Mfg. carrier plate for electrical components - providing through opening for heat sink element in form of press-fitting cylindrical plug of metal to contact electronic device |
| 01/13/1994 | DE4210538A1 Monolithic integrated sensor for photoelectric incremental distance and angle measurement - has photoelectric sensor and signal processing components on silicon@ chip with regions around bonding islands recessed to depth of 50 to 100 microns |
| 01/12/1994 | EP0578446A2 Epoxy resin compositions, preparations and uses thereof, semiconductor devices encapsulated therewith |
| 01/12/1994 | EP0578411A1 Heat sinks for integrated circuit packages |
| 01/12/1994 | EP0578410A2 Programmable die identification circuits |
| 01/12/1994 | EP0578307A2 Chip carrier with protective coating for circuitized surface |
| 01/12/1994 | EP0578250A1 Lead on chip type semiconductor integrated circuit device to avoid bonding wire short |
| 01/12/1994 | EP0578108A1 Semiconductor power module |
| 01/12/1994 | EP0578028A1 High frequency semiconductor device |
| 01/12/1994 | EP0577985A1 Amorphous semiconductor solar module having improved passivation |
| 01/12/1994 | EP0577966A1 Reduced stress plastic package |
| 01/12/1994 | EP0577779A1 Multichip integrated circuit module and method of fabrication |
| 01/12/1994 | EP0577754A1 Three-dimensional multichip module systems and methods of fabrication |
| 01/12/1994 | EP0577731A1 Surface mount device with high thermal conductivity |
| 01/12/1994 | EP0271533B1 Electrical device transport medium |
| 01/11/1994 | US5278727 High density electrical interconnection device and method therefor |
| 01/11/1994 | US5278726 Method and apparatus for partially overmolded integrated circuit package |
| 01/11/1994 | US5278724 Electronic package and method of making same |
| 01/11/1994 | US5278451 Polysesquisiloxane ladder polymer |
| 01/11/1994 | US5278450 Semiconductor contact with discontinuous noble metal |
| 01/11/1994 | US5278449 Alloy having a low eutectic point |
| 01/11/1994 | US5278448 Multilayer of vapor deposited refractory and aluminum |
| 01/11/1994 | US5278447 Semiconductor device assembly carrier |
| 01/11/1994 | US5278446 Reduced stress plastic package |
| 01/11/1994 | US5278445 Semiconductor device card having a plurality of self-locking pawls |
| 01/11/1994 | US5278442 Electronic packages and smart structures formed by thermal spray deposition |
| 01/11/1994 | US5278434 Pressure engagement structure for a full press-pack type semiconductor device |
| 01/11/1994 | US5278429 Semiconductor device having improved adhesive structure and method of producing same |
| 01/11/1994 | US5278105 Forming plurality regions |
| 01/11/1994 | US5278101 Semiconductor device and method for manufacturing the same |
| 01/11/1994 | US5278099 Method for manufacturing a semiconductor device having wiring electrodes |
| 01/11/1994 | US5278098 Method for self-aligned polysilicon contact formation |
| 01/11/1994 | US5278083 Removal masking layer above a removable planarizing material |
| 01/11/1994 | US5277985 Alloying, fast heating annealing |
| 01/11/1994 | US5277972 Adhesive tapes |
| 01/11/1994 | US5277946 Glass plate window having an ion exchanging surface |
| 01/11/1994 | US5277756 Post fabrication processing of semiconductor chips |
| 01/11/1994 | US5277725 Process for fabricating a low dielectric composite substrate |
| 01/11/1994 | US5277724 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board |
| 01/11/1994 | US5277357 Process for making a metal wall of a package used for accommodating electronic elements |
| 01/11/1994 | US5276963 Process for obtaining side metallization and articles produced thereby |
| 01/11/1994 | US5276961 Demountable tape-automated bonding method |
| 01/06/1994 | WO1994000880A1 Semiconductor device |
| 01/06/1994 | WO1994000879A1 Pyroelectric sensor and production method therefor |
| 01/06/1994 | WO1994000727A1 Low profile integrated heat sink and fan assembly |
| 01/05/1994 | EP0577264A1 A semiconductor device comprising a plurality of semiconductor chips |
| 01/05/1994 | EP0577223A1 Mounting structure for a terminal |
| 01/05/1994 | EP0577099A2 Cooling apparatus for electronic elements |
| 01/05/1994 | EP0576708A1 Integrated circuit with leadframe |
| 01/05/1994 | DE4321592A1 Semiconductor device for Chip On Board substrate and TAB substrate and lead frame - has rectangular chip-retaining support, with internal conductors on support surface round retaining surface formed in regular, rectangular arrangement |
| 01/05/1994 | DE4321053A1 Pressure-packed semiconductor device - has semiconductor substrate pressed against heat compensators to produce electrical contacts without solder |
| 01/05/1994 | DE4319070A1 Semiconductor device with multilevel interconnect structure - comprises etch preventing film between inter level insulation layers of poly:phenyl silsequioxane with openings, and interconnect layers, avoiding recess formation |
| 01/05/1994 | DE4221385A1 Encapsulated contactless magnetoresistive AC and DC current sensor - has plug-in IC incorporating split current path and permanent magnet stabiliser giving linear, externally adjustable response |
| 01/05/1994 | CN2152306Y Heat sink sealing structure semiconductor power tube shell |
| 01/05/1994 | CN1080433A Heat sink mounting system for semiconductor devices |
| 01/04/1994 | US5276586 Bonding structure of thermal conductive members for a multi-chip module |
| 01/04/1994 | US5276585 Heat sink mounting apparatus |
| 01/04/1994 | US5276423 Circuit units, substrates therefor and method of making |
| 01/04/1994 | US5276400 Test circuit for imaging sensing integrated circuits |
| 01/04/1994 | US5276354 Integrated circuit package with battery housing |
| 01/04/1994 | US5276352 Resin sealed semiconductor device having power source by-pass connecting line |
| 01/04/1994 | US5276351 Electronic device and a manufacturing method for the same |
| 01/04/1994 | US5276350 Low reverse junction breakdown voltage zener diode for electrostatic discharge protection of integrated circuits |
| 01/04/1994 | US5276345 Durability |
| 01/04/1994 | US5276289 Electronic circuit device and method of producing the same |
| 01/04/1994 | US5275975 Method of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded material |
| 01/04/1994 | US5275971 Method of forming an ohmic contact to III-V semiconductor materials |
| 01/04/1994 | US5275963 Depositing thick passivating layer; forming plurality of first stud openings |
| 01/04/1994 | US5275962 Forming plurality of moat regions |
| 01/04/1994 | US5275897 Precisely aligned lead frame using registration traces and pads |
| 01/04/1994 | US5275889 Multi-layer wiring board |
| 01/04/1994 | US5275841 Method for encapsulating integrated circuit |
| 01/04/1994 | US5275782 Preparing aluminum silicide rapidly solidified powder; molding by hot working; applying vacuum; cutting |
| 01/04/1994 | US5275715 Electroplating process for enhancing the conformality of titanium and titanium nitride films in the manufacture of integrated circuits and structures produced thereby |
| 01/04/1994 | US5275546 Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
| 01/04/1994 | US5275328 Methods of joining components |
| 01/04/1994 | US5274920 Method of fabricating a heat exchanger for solid-state electronic devices |