| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/08/1994 | US5284801 Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric |
| 02/08/1994 | US5284797 Semiconductor bond pads |
| 02/08/1994 | US5284788 Forming first conduction element, forming antifuse material of monocrystalline silicone and depant, forming second conduction element |
| 02/08/1994 | US5284784 Formed to allow it to be utilized in a virtual ground buried bit-line array |
| 02/08/1994 | US5284725 Photo-mask for manufacture of two-layer tab |
| 02/08/1994 | US5283946 Method and apparatus for forming metal leads |
| 02/03/1994 | WO1994003037A1 Sealable electronics packages and methods of producing and sealing such packages |
| 02/03/1994 | WO1994003036A1 Semiconductor connection components and methods with releasable lead support |
| 02/03/1994 | WO1994002960A1 Miniature housing for electronic components |
| 02/03/1994 | WO1994002528A1 Process for producing a flame-resistant epoxy resin molding material |
| 02/03/1994 | WO1994002425A2 Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same |
| 02/03/1994 | DE4325668A1 Multi-level wiring ceramic substrate for multi-chip module carrier - consists of central region contg. two wiring layers and vertical conductors connected between lower wiring plane and surface, and second conductors coupled between upper wiring plane and surface |
| 02/03/1994 | DE4324638A1 Electric contact prodn. for integrated circuit - by self aligned process, esp. in ULSI mfr. |
| 02/03/1994 | DE4225154A1 Chip-Modul Chip module |
| 02/03/1994 | DE4224720A1 Circuit housing for motor vehicle ignition circuitry - has water-tight lid, moulded electrical connector and heat sink for power semiconductor devices moulded into wall of housing |
| 02/03/1994 | DE4224450A1 Heat flux regulation of semiconductor device - using electro-rheological liq. for active temp. control |
| 02/02/1994 | EP0581712A2 MLC conductor pattern off-set design to eliminate line to via cracking |
| 02/02/1994 | EP0581588A1 Metal plane support for a multi-layer lead frame and a process for manufacturing it |
| 02/02/1994 | EP0581284A2 Non-contact IC card and manufacturing and testing methods of the same |
| 02/02/1994 | EP0581206A2 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 02/02/1994 | EP0580987A1 Semiconductor device having a flag with opening |
| 02/02/1994 | EP0580895A2 Method of mapping a tested semiconductor device |
| 02/02/1994 | EP0580855A1 Advance multilayer molded plastic package using mesic technology |
| 02/02/1994 | EP0580826A1 Sealed electronic package providing in-situ metallization |
| 02/02/1994 | CN2155073Y Piled integrated circuit pad |
| 02/02/1994 | CN1023675C Method for mfg. semiconductor device |
| 02/01/1994 | US5283717 Circuit assembly having interposer lead frame |
| 02/01/1994 | US5283691 Solid state imaging apparatus |
| 02/01/1994 | US5283468 Electric circuit apparatus |
| 02/01/1994 | US5283467 Heat sink mounting system for semiconductor devices |
| 02/01/1994 | US5283466 Lead frame for semiconductor device of the resin encapsulation type |
| 02/01/1994 | US5283465 Semiconductors; oxidatio resistance |
| 02/01/1994 | US5283464 Electrically insulated heat pipe type cooling apparatus for semiconductor |
| 02/01/1994 | US5283463 High power self commutating semiconductor switch |
| 02/01/1994 | US5283461 Trench conductor and crossunder architecture |
| 02/01/1994 | US5283449 Semiconductor integrated circuit device including two types of MOSFETS having source/drain region different in sheet resistance from each other |
| 02/01/1994 | US5283210 A powder mixtures consists of cordierite, quartz and lead borosilicate glass; ceramic printed circuits, high speed transmitters |
| 02/01/1994 | US5283206 Migrate germanium particle reacts with copper to form a compound |
| 02/01/1994 | US5283205 Method for manufacturing a semiconductor device on a substrate having an anisotropic expansion/contraction characteristic |
| 02/01/1994 | US5283203 Self-aligned contact process for complementary field-effect integrated circuits |
| 02/01/1994 | US5283107 Modular multilayer interwiring structure |
| 02/01/1994 | US5283104 Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates |
| 02/01/1994 | US5283081 Applying photoresist to multilayer ceramic substrate, exposing to light, developing to form mask pattern, plating; printing with photosetting paste for dielectric, drying, forming via hole pattern, burying and sintering conductor paste in holes |
| 02/01/1994 | US5282945 Device for applying dot-shaped coatings |
| 02/01/1994 | US5282922 Applying layer of material resistant to fluorine ion etching over silicon substrate surface |
| 02/01/1994 | US5282312 Multi-layer circuit construction methods with customization features |
| 01/27/1994 | DE4309005A1 Multilayer hybrid integrated circuit mfr. from ceramic green sheets - providing contacts between conductive tracks via feedthrough(s) in holes through interposed ceramic plate which prevents shrinkage |
| 01/27/1994 | DE4224103A1 Miniaturgehäuse mit elektronischen Bauelementen Thumbnail housing with electronic components |
| 01/26/1994 | EP0580408A1 Excimer laser processing method and apparatus |
| 01/26/1994 | EP0580381A1 Sealing porous electronic substrates |
| 01/26/1994 | EP0580313A2 Surface mount microcircuit hybrid |
| 01/26/1994 | EP0580290A1 Self-aligned method of fabricating closely spaced apart metallization lines |
| 01/26/1994 | EP0579924A1 Intra-module spare routing for high density electronic packages |
| 01/26/1994 | EP0579911A2 Process for preparing composite isotropic copper-based materials by slip casting, having a low thermal expansion coefficient and high electrical conductivity and their use |
| 01/26/1994 | CN1081297A Component module |
| 01/26/1994 | CN1081283A Semiconductor device having a double-layered silicide structure and fabricating method thereof |
| 01/26/1994 | CN1081282A Electric circuit and method for forming the same |
| 01/25/1994 | US5282158 Transistor antifuse for a programmable ROM |
| 01/25/1994 | US5282111 Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate |
| 01/25/1994 | US5281855 Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die |
| 01/25/1994 | US5281852 Semiconductor device including stacked die |
| 01/25/1994 | US5281851 Integrated circuit packaging with reinforced leads |
| 01/25/1994 | US5281850 Semiconductor device multilayer metal layer structure including conductive migration resistant layers |
| 01/25/1994 | US5281849 Semiconductor package with segmented lead frame |
| 01/25/1994 | US5281848 Tape carrier semiconductor device |
| 01/25/1994 | US5281846 Electronic device having a discrete capacitor adherently mounted to a lead frame |
| 01/25/1994 | US5281838 Semiconductor device having contact between wiring layer and impurity region |
| 01/25/1994 | US5281772 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 01/25/1994 | US5281769 Circuit means in an integrated circuit |
| 01/25/1994 | US5281759 Semiconductor package |
| 01/25/1994 | US5281684 Solder bumping of integrated circuit die |
| 01/25/1994 | US5281560 Non-lead sealing glasses |
| 01/25/1994 | US5281556 Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane |
| 01/25/1994 | US5281553 Method for controlling the state of conduction of an MOS transistor of an integrated circuit |
| 01/25/1994 | US5281466 Adhesive for laminating layers of a multilayer circuit, alkali resistance |
| 01/25/1994 | US5281389 Vaporizable liquid vehicle, sinterable palladium powder dispersed in vehicle, titanium dioxide, strontium calcium titanate compound |
| 01/25/1994 | US5281304 Modifying surface of copper film to copper sulfide, etching to patternize wiring, reducing copper sulfide to copper, forming insulation |
| 01/25/1994 | US5281151 Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module |
| 01/25/1994 | US5281026 Printed circuit board with cooling monitoring system |
| 01/22/1994 | CA2096103A1 Electrical contact element |
| 01/21/1994 | CA2100277A1 Sealing porous electronic substrates |
| 01/20/1994 | WO1994001987A1 Component module |
| 01/20/1994 | WO1994001986A1 Electronic package having controlled epoxy flow |
| 01/20/1994 | WO1994001889A1 Fitting unit for multilayer hybrid circuit with power components |
| 01/20/1994 | WO1994001888A1 Multiple wiring arrangement for multichip modules |
| 01/20/1994 | WO1994001887A1 High density memory and method of forming the same |
| 01/20/1994 | WO1994001886A1 Electronic package with stress relief channel |
| 01/20/1994 | WO1994001377A1 Ceramic green sheet |
| 01/20/1994 | DE4323961A1 Stacked capacitor DRAM - has wiring layer which is used for top electrode of storage capacitor and for connecting to peripheral circuit in region separate from that contg. memory cell |
| 01/20/1994 | DE4323799A1 Semiconductor module coupled to pcb by face-down technology - has contact bumps of solder for connecting chip electrodes to circuit board electrodes, with wall piece not in contact with bumps |
| 01/20/1994 | DE4322665A1 Cooling appts. for power semiconductor device e.g. in motor vehicle - has coolant passage contg. cooling plates which are alternately stacked with semiconductor elements and form coolant circuit |
| 01/20/1994 | DE4223632A1 Verfahren zur Herstellung einer flammwidrig eingestellten Epoxidharzformmasse A process for producing a flame-resistant epoxy resin |
| 01/20/1994 | DE4223522A1 Electronic control device circuit module - has power components attached in two rows in two respective arms of U=shaped cooling element |
| 01/20/1994 | DE4223371A1 Electronic component mounting method for circuit board assembly - with openings in cover layer overlapping each component receiving conductive paste providing required electrical connections |
| 01/20/1994 | CA2140154A1 Electronic package having controlled epoxy flow |
| 01/19/1994 | EP0579464A2 Metal insert and a surface roughening treatment method for it |
| 01/19/1994 | EP0579456A2 Curing silicon hydride containing materials by exposure to nitrous oxide |
| 01/19/1994 | EP0579440A2 Method of making an assembly including patterned film submount with self-aligned electronic device |
| 01/19/1994 | EP0579278A2 Processing of copper alloys with moderate conductivity and high strength |
| 01/19/1994 | EP0579010A1 Lightweight packaging |