| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/10/2013 | US8531023 Substrate for semiconductor package and method of manufacturing thereof |
| 09/10/2013 | US8531022 Routable array metal integrated circuit package |
| 09/10/2013 | US8531021 Package stack device and fabrication method thereof |
| 09/10/2013 | US8531020 Stacked packaging improvements |
| 09/10/2013 | US8531018 Component comprising a chip in a cavity and a stress-reduced attachment |
| 09/10/2013 | US8531017 Semiconductor packages having increased input/output capacity and related methods |
| 09/10/2013 | US8531016 Thermally enhanced semiconductor package with exposed parallel conductive clip |
| 09/10/2013 | US8531014 Method and system for minimizing carrier stress of a semiconductor device |
| 09/10/2013 | US8531013 Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires |
| 09/10/2013 | US8531012 Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV |
| 09/10/2013 | US8531009 Package structure of three-dimensional stacking dice and method for manufacturing the same |
| 09/10/2013 | US8531008 Material structure in scribe line and method of separating chips |
| 09/10/2013 | US8530997 Double seal ring |
| 09/10/2013 | US8530985 Chip package and method for forming the same |
| 09/10/2013 | US8530984 Semiconductor device structures and their fabrication |
| 09/10/2013 | US8530969 Semiconductor device |
| 09/10/2013 | US8530968 Electrostatic discharge protection element and electrostatic discharge protection chip and method of producing the same |
| 09/10/2013 | US8530939 Cross-point memory structures |
| 09/10/2013 | US8530760 Electronic device including indium gasket and related methods |
| 09/10/2013 | US8530335 Method for manufacturing semiconductor device |
| 09/10/2013 | US8530283 Process for forming an electronic device including a nonvolatile memory structure having an antifuse component |
| 09/10/2013 | US8530266 Image sensor having metal grid with a triangular cross-section |
| 09/10/2013 | US8528627 Heat-dissipating device having air-guiding cover |
| 09/10/2013 | DE202013103297U1 Geriffelte Kühlrippe und Kühlkörper mit Selbiger Corrugated fin and heatsink with Selbiger |
| 09/10/2013 | DE202013006969U1 Stützstruktur für eine Kühleinheit Support structure for a cooling unit |
| 09/06/2013 | WO2013131031A1 Integrated circuit with electromagnetic energy anomaly detection and processing |
| 09/06/2013 | WO2013130915A1 Integrated circuit socket system with configurable structures and method of manufacture thereof |
| 09/06/2013 | WO2013130803A1 Methods and apparatus to form electronic circuitry on ophthalmic devices |
| 09/06/2013 | WO2013130582A1 Method for embedding controlled-cavity mems package in integration board |
| 09/06/2013 | WO2013130574A1 Compositions of resin-linear organosiloxane block copolymers |
| 09/06/2013 | WO2013130425A1 Structure and method for strain-relieved tsv |
| 09/06/2013 | WO2013130418A1 Graphitic substrates with ceramic dielectric layers |
| 09/06/2013 | WO2013130221A1 System including thermal interface material |
| 09/06/2013 | WO2013128361A1 Hybrid plasma processing systems |
| 09/06/2013 | WO2013128341A2 An electronic circuit arrangement and method of manufacturing the same |
| 09/06/2013 | WO2013128205A1 Circuit board assembly |
| 09/06/2013 | WO2013052368A3 Stub minimization using duplicate sets of terminals for wirebond assemblies without windows |
| 09/05/2013 | US20130231240 Method and system for binding halide-based contaminants |
| 09/05/2013 | US20130228939 Semiconductor integrated circuit device |
| 09/05/2013 | US20130228938 High speed, high density, low power die interconnect system |
| 09/05/2013 | US20130228936 Method of forming through silicon via of semiconductor device using low-k dielectric material |
| 09/05/2013 | US20130228935 Semiconductor device having signal line and power supply line intersecting with each other |
| 09/05/2013 | US20130228934 Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same |
| 09/05/2013 | US20130228933 BEOL Interconnect With Carbon Nanotubes |
| 09/05/2013 | US20130228932 Package on Package Structure |
| 09/05/2013 | US20130228931 Semiconductor apparatus manufacturing method and semiconductor apparatus |
| 09/05/2013 | US20130228930 Method of manufacturing semiconductor device and semiconductor device |
| 09/05/2013 | US20130228929 Protection Layers for Conductive Pads and Methods of Formation Thereof |
| 09/05/2013 | US20130228928 Semiconductor device and method for manufacturing same |
| 09/05/2013 | US20130228927 Interconnect structures |
| 09/05/2013 | US20130228926 Interconnection structure |
| 09/05/2013 | US20130228925 Hybrid interconnect structure for performance improvement and reliability enhancement |
| 09/05/2013 | US20130228924 Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor |
| 09/05/2013 | US20130228923 Methods and layers for metallization |
| 09/05/2013 | US20130228922 Semiconductor device structures and printed circuit boards comprising semiconductor devices |
| 09/05/2013 | US20130228921 Substrate structure and fabrication method thereof |
| 09/05/2013 | US20130228920 Protection layer for adhesive material at wafer edge |
| 09/05/2013 | US20130228919 Semiconductor Device and Method of Forming Protective Coating Over Interconnect Structure to Inhibit Surface Oxidation |
| 09/05/2013 | US20130228918 Three-dimensional integrated circuit which incorporates a glass interposer and method for fabricating the same |
| 09/05/2013 | US20130228917 Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLP-MLP) |
| 09/05/2013 | US20130228916 Two-solder method for self-aligning solder bumps in semiconductor assembly |
| 09/05/2013 | US20130228915 Semiconductor package and fabrication method thereof |
| 09/05/2013 | US20130228914 Heat Sink Apparatus for Microelectronic Devices |
| 09/05/2013 | US20130228913 Semiconductor device and method of manufacturing the same |
| 09/05/2013 | US20130228912 Apparatus for Chip Thermal Stress Relief |
| 09/05/2013 | US20130228911 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same |
| 09/05/2013 | US20130228910 Power conversion device |
| 09/05/2013 | US20130228909 Semiconductor device and method for manufacturing semiconductor device |
| 09/05/2013 | US20130228908 Manufacturing method of semiconductor device, and semiconductor device |
| 09/05/2013 | US20130228907 Semiconductor device and method of manufacturing the same |
| 09/05/2013 | US20130228906 Interconnect for an optoelectronic device |
| 09/05/2013 | US20130228905 Method for manufacturing semiconductor devices having a glass substrate |
| 09/05/2013 | US20130228904 Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips |
| 09/05/2013 | US20130228901 Materials and methods for stress reduction in semiconductor wafer passivation layers |
| 09/05/2013 | US20130228900 Gate conductor with a diffusion barrier |
| 09/05/2013 | US20130228898 Semiconductor device having penetrating electrodes each penetrating through substrate |
| 09/05/2013 | US20130228897 Electrical Connections for Chip Scale Packaging |
| 09/05/2013 | US20130228896 Semiconductor integrated circuit device |
| 09/05/2013 | US20130228885 Semiconductor device and manufacturing method of semiconductor device |
| 09/05/2013 | US20130228868 Electrostatic discharge protection devices |
| 09/05/2013 | US20130228867 Semiconductor device protected from electrostatic discharge |
| 09/05/2013 | US20130228796 High voltage semiconductor devices including electric arc suppression material and methods of forming the same |
| 09/05/2013 | US20130228794 Stacked Half-Bridge Package with a Common Leadframe |
| 09/05/2013 | US20130228316 Heat Dissipation Structure of Tire Repair Machine |
| 09/05/2013 | DE112012000238T5 Reversibel klebendes Wärmegrenzflächenmaterial Reversible adhesive thermal interface material |
| 09/05/2013 | DE112011103137T5 Kühlungsstruktur für Chip Cooling structure for chip |
| 09/05/2013 | DE10250634B4 Halbleiterstruktur mit nachgiebigem Zwischenverbindungselement und Verfahren zu deren Herstellung Semiconductor structure having resilient interconnection element and process for their preparation |
| 09/05/2013 | DE102013101935A1 Schutzschichten für leitfähige Pads und Verfahren zu deren Ausbildung Protective layers of conductive pads and methods of training |
| 09/05/2013 | DE102012213066B3 Kühlvorrichtung und Verfahren zum Herstellen einer Kühlvorrichtung sowie Schaltungsanordnung mit einer Kühlvorrichtung Cooling device and method of manufacturing a cooling device and circuit arrangement with a cooling device |
| 09/05/2013 | DE102012203293A1 Halbleitermodul mit integriertem Wellenleiter für Radarsignale Semiconductor module with integrated waveguides for radar signals |
| 09/05/2013 | DE102012203281A1 Switching arrangement, has resilient positioning elements provided away from lower part of two-part housing of driver device, and fixing electronic printed circuit board on support elements of lower part by resilient force |
| 09/05/2013 | DE102012101818A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 09/05/2013 | DE102009035436B4 Verfahren zur Herstellung eines dreidimensionalen Halbleiterbauelements mit einer Zwischenchipverbindung auf der Grundlage funktionaler Moleküle A process for producing a three-dimensional semiconductor device is a two-chip connection on the basis of functional molecules |
| 09/05/2013 | DE102008025705B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 09/05/2013 | DE102004058806B4 Verfahren zur Herstellung von Schaltungsstrukturen auf einem Kühlkörper und Schaltungsstruktur auf einem Kühlkörper A process for the production of circuit patterns on a heat sink and circuit pattern on a heat sink |
| 09/04/2013 | EP2634803A1 Wirelessly communicating among vertically arranged integrated circuits (ICs) in a semiconductor package |
| 09/04/2013 | EP2634801A2 Power conversion device |
| 09/04/2013 | EP2634800A2 Cooling device |
| 09/04/2013 | EP2634799A2 Semiconductor device and method for manufacturing semiconductor device |
| 09/04/2013 | EP2634798A1 Electric device with cooling housing |