| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/22/1994 | US5289037 Conductor track configuration for very large-scale integrated circuits |
| 02/22/1994 | US5289036 Resin sealed semiconductor integrated circuit |
| 02/22/1994 | US5289035 Containign titanium nitride |
| 02/22/1994 | US5289034 IC package having replaceable backup battery |
| 02/22/1994 | US5289033 Packaging of semiconductor chips with resin |
| 02/22/1994 | US5289032 Tape automated bonding(tab)semiconductor device and method for making the same |
| 02/22/1994 | US5288952 Multilayer connector |
| 02/22/1994 | US5288951 Copper-based metallizations for hybrid integrated circuits |
| 02/22/1994 | US5288950 Flexible wiring board and method of preparing the same |
| 02/22/1994 | US5288949 Connection system for integrated circuits which reduces cross-talk |
| 02/22/1994 | US5288948 Structure of a semiconductor chip having a conductive layer |
| 02/22/1994 | US5288944 Pinned ceramic chip carrier |
| 02/22/1994 | US5288769 Having copper coating; bonding semiconductors |
| 02/22/1994 | US5288667 Method of manufacturing a molded semiconductor package having a lead frame and an connecting coupler |
| 02/22/1994 | US5288665 Process for forming low resistance aluminum plug in via electrically connected to overlying patterned metal layer for integrated circuit structures |
| 02/22/1994 | US5288661 Semiconductor device having bonding pad comprising buffer layer |
| 02/22/1994 | US5288655 Method of making dynamic random access memory having a reliable contact |
| 02/22/1994 | US5288539 Tab tape with a peeling-prevention structure for the conductive layer |
| 02/22/1994 | US5288240 Top-load socket for integrated circuit device |
| 02/22/1994 | US5288235 Electrical interconnects having a supported bulge configuration |
| 02/22/1994 | US5288203 Low profile fan body with heat transfer characteristics |
| 02/22/1994 | US5287759 Method and apparatus of measuring state of IC lead frame |
| 02/22/1994 | US5287620 Process of producing multiple-layer glass-ceramic circuit board |
| 02/22/1994 | US5287619 Method of manufacture multichip module substrate |
| 02/22/1994 | CA2008284C Multi-layer ceramic substrate with solder dam on connecting pattern |
| 02/17/1994 | WO1994004013A1 Cooler for heat generation device |
| 02/17/1994 | WO1994003926A1 Semiconductor arrangement |
| 02/17/1994 | WO1994003925A1 Construction of a power converter |
| 02/17/1994 | WO1994003924A1 Chip module |
| 02/17/1994 | DE4226816A1 Heat sink for integrated circuit - has metallic heat sink pressed onto flat surface of integrated circuit housing by bow-type spring |
| 02/17/1994 | DE4226590A1 Verfahren zur Verringerung des Flächenbedarfs eines Stromversorgungsnetzes auf einem Schaltungsträger, welches Stromverbraucher und Stromversorger verbindet Process for reducing the space requirements of an electricity supply system on a circuit board that conducts electricity consumers and electricity suppliers connects |
| 02/17/1994 | DE4226429A1 Halbleiteranordnung Semiconductor device |
| 02/17/1994 | CA2141566A1 Cubic metal oxide thin film epitaxially grown on silicon |
| 02/17/1994 | CA2141458A1 Chip module |
| 02/16/1994 | EP0583119A1 Programmable contact structure and its forming method |
| 02/16/1994 | EP0582881A1 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics thereof |
| 02/16/1994 | EP0582850A1 High-yield spatial light modulator with light blocking layer |
| 02/16/1994 | EP0582705A1 Molded ring integrated circuit package |
| 02/16/1994 | EP0582694A1 Semiconductor device with a semiconductor substrate and a ceramic plate as lid |
| 02/16/1994 | EP0582605A1 Stabilization of the interface between aluminum and titanium nitride |
| 02/16/1994 | EP0335965B1 Phantom esd protection circuit employing e-field crowding |
| 02/15/1994 | US5287292 Heat regulator for integrated circuits |
| 02/15/1994 | US5287249 Fin assembly for an integrated circuit |
| 02/15/1994 | US5287247 Computer system module assembly |
| 02/15/1994 | US5287072 Semiconductor device for improving high-frequency characteristics and avoiding chip cracking |
| 02/15/1994 | US5287003 Resin-encapsulated semiconductor device having a passivation reinforcement hard polyimide film |
| 02/15/1994 | US5287002 Planar multi-layer metal bonding pad |
| 02/15/1994 | US5287001 For direct heat transfer |
| 02/15/1994 | US5287000 Resin-encapsulated semiconductor memory device useful for single in-line packages |
| 02/15/1994 | US5286999 Leadframe for attaching to a semiconductor device |
| 02/15/1994 | US5286993 One-sided ozone TEOS spacer |
| 02/15/1994 | US5286926 Integrated circuit package and process for producing same |
| 02/15/1994 | US5286713 Method for manufacturing an oxide superconducting circuit board by printing |
| 02/15/1994 | US5286680 Semiconductor die packages having lead support frame |
| 02/15/1994 | US5286679 Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer |
| 02/15/1994 | US5286676 Methods of making integrated circuit barrier structures |
| 02/15/1994 | US5286673 Method for forming position alignment marks in a manufacturing SOI device |
| 02/15/1994 | US5286670 Method of manufacturing a semiconductor device having buried elements with electrical characteristic |
| 02/15/1994 | US5286656 Individualized prepackage AC performance testing of IC dies on a wafer using DC parametric test patterns |
| 02/15/1994 | US5286572 Planarizing ladder-type silsequioxane polymer insulation layer |
| 02/15/1994 | US5286439 Packaging for semiconductors |
| 02/15/1994 | US5286415 Water-based polymer thick film conductive ink |
| 02/15/1994 | US5286342 Etching, punching |
| 02/15/1994 | US5286209 IC socket |
| 02/15/1994 | US5285949 Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method |
| 02/15/1994 | US5285571 Method for extending an electrical conductor over an edge of an HDI substrate |
| 02/15/1994 | CA1326979C Ceramic coated metal substrates for electronic applications |
| 02/10/1994 | DE4325735A1 Water-cooled semiconductor regulator clamped stack for locomotive |
| 02/10/1994 | DE4325706A1 Mfg. electrode or wiring layer on semiconductor device - forming metal oxide film and reducing to produce wiring layer e.g. of copper or silver |
| 02/10/1994 | DE4313797A1 Conductor for bonding in semiconductor chip - has perforated end section through conducting layer for connection to contact bumps on semiconductor chip |
| 02/10/1994 | DE4239587A1 Semiconductor device formed on module substrate - has resin moulded package with conductors providing respective internal connections at one end and external connections at other |
| 02/09/1994 | EP0582387A1 A metallic wiring board and a method for producing the same |
| 02/09/1994 | EP0582315A1 Functional substrates for packaging semiconductor chips |
| 02/09/1994 | EP0582306A1 Semiconductor device having hollowed conductor |
| 02/09/1994 | EP0582225A2 Low-temperature curing epoxy resin composition |
| 02/09/1994 | EP0582213A1 Pressure assembly with semi-conductor cells and cooling boxes |
| 02/09/1994 | EP0582211A1 Photoelectrochemical cell |
| 02/09/1994 | EP0582084A2 Semiconductor leadframe and package |
| 02/09/1994 | EP0582052A1 Low profile overmolded semiconductor device and method for making the same |
| 02/09/1994 | CN1081788A Cooling apparatus for electronic elements |
| 02/09/1994 | CN1081787A Chip carrier with protective coating for circuitized surface |
| 02/09/1994 | CN1023739C Transistor for electric power |
| 02/08/1994 | US5285352 Pad array semiconductor device with thermal conductor and process for making the same |
| 02/08/1994 | US5285351 Cooling structure for integrated circuits |
| 02/08/1994 | US5285350 Heat sink plate for multiple semi-conductors |
| 02/08/1994 | US5285110 Interconnection structure in semiconductor device |
| 02/08/1994 | US5285108 Cooling system for integrated circuits |
| 02/08/1994 | US5285106 Semiconductor device parts |
| 02/08/1994 | US5285105 Semiconductor die packages having lead support frame |
| 02/08/1994 | US5285104 Encapsulated semiconductor device with bridge sealed lead frame |
| 02/08/1994 | US5285102 Formed with active ambient to create an internal stress |
| 02/08/1994 | US5285099 Deletable by low voltage electrical or laser pulse |
| 02/08/1994 | US5285090 Contacts to rod shaped Schottky gate fets |
| 02/08/1994 | US5285082 Integrated test circuits having pads provided along scribe lines |
| 02/08/1994 | US5285076 Optoelectronic device, metal mold for manufacturing the device and manufacturing method of the device using the metal mold |
| 02/08/1994 | US5285018 Power and signal distribution in electronic packaging |
| 02/08/1994 | US5285017 Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias |
| 02/08/1994 | US5285016 Wiring board provided with a heat bypass layer |
| 02/08/1994 | US5285012 Low noise integrated circuit package |
| 02/08/1994 | US5284899 Resin paste for tight sealing |