| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/08/1994 | US5293301 Semiconductor device and lead frame used therein |
| 03/08/1994 | US5293073 Electrode structure of a semiconductor device which uses a copper wire as a bonding wire |
| 03/08/1994 | US5293072 Semiconductor device having spherical terminals attached to the lead frame embedded within the package body |
| 03/08/1994 | US5293071 Bump structure for bonding to a semi-conductor device |
| 03/08/1994 | US5293070 Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules |
| 03/08/1994 | US5293069 Ceramic-glass IC package assembly having multiple conductive layers |
| 03/08/1994 | US5293068 Semiconductor device |
| 03/08/1994 | US5293067 Integrated circuit chip carrier |
| 03/08/1994 | US5293066 Semiconductor device mounting structure including lead frame and lead plate |
| 03/08/1994 | US5293065 Lead frame having an outlet with a larger cross sectional area than the inlet |
| 03/08/1994 | US5293064 Lead frame and method of manufacturing a semiconductor device |
| 03/08/1994 | US5293006 Interconnection system for a microelectronic substrate |
| 03/08/1994 | US5293005 Electronic device having high-density wiring |
| 03/08/1994 | US5292688 Solder interconnection structure on organic substrates and process for making |
| 03/08/1994 | US5292687 Process for lay-out of a semiconductor integrated circuit |
| 03/08/1994 | US5292684 Semiconductor device with improved contact and method of making the same |
| 03/08/1994 | US5292574 Ceramic substrate having wiring of silver series |
| 03/08/1994 | US5292548 Substrates used in multilayered integrated circuits and multichips |
| 03/08/1994 | US5292478 Oxide matrix material |
| 03/08/1994 | US5292477 Electrical conductor with controlled grain size |
| 03/08/1994 | US5292376 Thermoelectric refrigeration material and method of making the same |
| 03/08/1994 | US5292266 Integrated circuit carrier |
| 03/08/1994 | US5291814 Lead frame cutting apparatus for integrated circuit packages |
| 03/03/1994 | WO1994005041A1 Antifuse structure and method for forming |
| 03/03/1994 | WO1994005040A1 Power semiconductor packaging |
| 03/03/1994 | WO1994005039A1 Semiconductor wafer for lamination applications |
| 03/03/1994 | WO1994005038A1 Metal electronic package incorporating a multi-chip module |
| 03/03/1994 | WO1994004985A1 Method of reducing the surface requirements, on a circuit board, of a power-supply net connecting consumers with the power supply |
| 03/03/1994 | DE4328916A1 Package for charge coupled memory with glass cover - has metal lines connected to raised parts on contact face and to terminals of circuit substrate, and glass cover bonded to upper surface |
| 03/03/1994 | DE4328270A1 Polyimide and polyamic acid compsns. modified with polyarylene ether - used in prodn. of flexible laminate with metal foil esp. for printed circuit with good solvent resistance and low thermal expansion coefft. |
| 03/03/1994 | DE4327950A1 Lead structure for semiconductor component e.g. DIP or PGA - has guide hole drilled in semiconductor package for guiding wiring section of electronic component |
| 03/03/1994 | DE4229270A1 Multi-layer bonding contact for electronic semiconductor components - has blocking layer between bonding layer and substrate body of Fe or Fe alloy |
| 03/03/1994 | DE4228274A1 Device contacting process for high density connections - esp. for contacting LEDs on common silicon@ chip without use of bonding techniques |
| 03/03/1994 | DE4228133A1 Polyarylene sulphide blend with spherical filler and opt. di:sulphide - used as thermoplastic encapsulating compsn., esp. for electronic device, with lower melt viscosity than blend filled with aspherical filler |
| 03/03/1994 | CA2142866A1 Metal electronic package incorporating a multi-chip module |
| 03/02/1994 | EP0585186A2 Semiconductor insulation for optical devices |
| 03/02/1994 | EP0585084A1 Permanent metallic bonding method |
| 03/02/1994 | EP0584668A1 Semi-conductor power module |
| 03/02/1994 | EP0584570A1 Epoxy resin composition containing analiphatic sulphonium salts |
| 03/02/1994 | EP0584349A1 Process and device for three-dimensional interconnection of housings for electronic components |
| 03/02/1994 | EP0253691B1 Silicon die bonding process |
| 03/02/1994 | CN1083305A Radiator assembly for substrate |
| 03/02/1994 | CN1083267A Large ceramic article and method of manufacturing |
| 03/01/1994 | US5291572 Article comprising compression bonded parts |
| 03/01/1994 | US5291434 MOS fuse with oxide breakdown and application thereof to memory cards |
| 03/01/1994 | US5291374 Semiconductor device having an opening and method of manufacturing the same |
| 03/01/1994 | US5291372 Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure |
| 03/01/1994 | US5291371 Thermal joint |
| 03/01/1994 | US5291292 Image sensor and method of driving the same |
| 03/01/1994 | US5291066 Moisture-proof electrical circuit high density interconnect module and method for making same |
| 03/01/1994 | US5291065 Semiconductor device and method of fabricating semiconductor device |
| 03/01/1994 | US5291064 Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing |
| 03/01/1994 | US5291063 High-power RF device with heat spreader bushing |
| 03/01/1994 | US5291062 Area array semiconductor device having a lid with functional contacts |
| 03/01/1994 | US5291061 Multi-chip stacked devices |
| 03/01/1994 | US5291060 Lead frame and semiconductor device using same |
| 03/01/1994 | US5291059 Resin-molded semiconductor device and lead frame employed for fabricating the same |
| 03/01/1994 | US5291058 Semiconductor device silicon via fill formed in multiple dielectric layers |
| 03/01/1994 | US5291051 ESD protection for inputs requiring operation beyond supply voltages |
| 03/01/1994 | US5291019 Thin film flexible interconnect for infrared detectors |
| 03/01/1994 | US5291010 Solid state imaging device having a chambered imaging chip corner |
| 03/01/1994 | US5290971 Printed circuit board provided with a higher density of terminals for hybrid integrated circuit and method of fabricating the same |
| 03/01/1994 | US5290835 Electrical and electronic parts formed of polybutylene naphthalenedicarboxylate |
| 03/01/1994 | US5290736 Method of forming interlayer-insulating film using ozone and organic silanes at a pressure above atmospheric |
| 03/01/1994 | US5290735 Thin, high leadcount package |
| 03/01/1994 | US5290734 Depositing a conductive, conforming protective coating and forming spacers |
| 03/01/1994 | US5290732 Process for making semiconductor electrode bumps by metal cluster ion deposition and etching |
| 03/01/1994 | US5290731 Aluminum metallization method |
| 03/01/1994 | US5290728 Method for producing a semiconductor device |
| 03/01/1994 | US5290727 Method for suppressing charge loss in EEPROMs/EPROMS and instabilities in SRAM load resistors |
| 03/01/1994 | US5290711 Method for fabricating semiconductor devices which lessens the effect of electrostatic discharge |
| 03/01/1994 | US5290624 Heat-conductive adhesive films, laminates with heat-conductive adhesive layers and the use thereof |
| 03/01/1994 | US5290614 Protective film and adhesive layer laminated on organic insulating film, adhesive comprising resole-type phenol resin and polyamide |
| 03/01/1994 | US5290588 Titanium, tungsten alloys |
| 03/01/1994 | US5290423 Electrochemical interconnection |
| 03/01/1994 | US5290396 Trench planarization techniques |
| 03/01/1994 | US5290191 Interface conditioning insert wafer |
| 03/01/1994 | US5289869 Closed loop feedback control variable conductance heat pipe |
| 03/01/1994 | US5289632 Applying conductive lines to integrated circuits |
| 03/01/1994 | US5289631 Method for testing, burn-in, and/or programming of integrated circuit chips |
| 03/01/1994 | CA2104487A1 Hermetic protection for integrated circuits |
| 03/01/1994 | CA2104484A1 Hermetic protection for integrated circuits |
| 03/01/1994 | CA2104340A1 Hermetic protection for integrated circuits |
| 02/23/1994 | EP0584028A1 As-deposited large grain aluminium |
| 02/23/1994 | EP0583997A1 Topographical selective patterns |
| 02/23/1994 | EP0583877A1 Improved semiconductor bond pad structure and method |
| 02/23/1994 | EP0583876A2 Planar contact with a void |
| 02/23/1994 | EP0583625A2 Method of increasing the layout efficiency of dies on a wafer, and increasing the ratio of I/O area to active area per die |
| 02/23/1994 | EP0583407A1 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards |
| 02/23/1994 | EP0404760B1 Semiconductor component with two connections and process and device for manufacturing it |
| 02/23/1994 | CN1082770A Electronic devices having metallurgies containing copper-semiconductor compounds |
| 02/22/1994 | US5289422 Semiconductor device having dummy wiring pattern therein and manufacturing method thereof |
| 02/22/1994 | US5289349 Integrated circuit card |
| 02/22/1994 | US5289346 Peripheral to area adapter with protective bumper for an integrated circuit chip |
| 02/22/1994 | US5289344 Integrated-circuit lead-frame package with failure-resistant ground-lead and heat-sink means |
| 02/22/1994 | US5289337 Heatspreader for cavity down multi-chip module with flip chip |
| 02/22/1994 | US5289336 Static electricity dispersant |
| 02/22/1994 | US5289040 Compensating lead structure for distributed IC components |
| 02/22/1994 | US5289039 Resin encapsulated semiconductor device |
| 02/22/1994 | US5289038 Bump electrode structure and semiconductor chip having the same |