| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/23/1994 | EP0588609A1 Ball contact for flip-chip devices |
| 03/23/1994 | EP0588603A2 Hermetically sealed packaged electronic system and method of fabrication |
| 03/23/1994 | EP0588577A2 Hermetically sealed integrated circuits |
| 03/23/1994 | EP0588503A2 Integrated circuit magnetic memory element and method of making same |
| 03/23/1994 | EP0588501A1 Technique for enhancing adhesion capability of heat spreaders in molded packages |
| 03/23/1994 | EP0588491A2 Lead frame for integrated circuits and a method for optimizing heat dissipation |
| 03/23/1994 | EP0588481A1 Bond pad layouts for integrated circuit semiconductor dies and forming methods |
| 03/23/1994 | EP0588094A1 Semiconductor device with reduced internal inductance |
| 03/23/1994 | EP0588093A1 Method of treating surface of wiring on circuit board |
| 03/23/1994 | EP0588026A2 Turn-off high-power semiconductor device |
| 03/23/1994 | EP0587996A2 Conductive diffusion barrier |
| 03/23/1994 | EP0587739A1 Anti-fuse structures and methods for making same |
| 03/23/1994 | CN1084282A Temp-compensating circuit of hall device |
| 03/23/1994 | CA2106112A1 Potted electrical components and methods of making the same |
| 03/22/1994 | US5297008 Polymeric composite lead wire and method for making same |
| 03/22/1994 | US5297001 High power semiconductor assembly |
| 03/22/1994 | US5296745 Semiconductor device having a moisture barrier around periphery of device |
| 03/22/1994 | US5296744 Lead frame assembly and method for wiring same |
| 03/22/1994 | US5296743 Plastic encapsulated integrated circuit package and method of manufacturing the same |
| 03/22/1994 | US5296742 Multilayered integrated circuit chip wiring arrangement |
| 03/22/1994 | US5296740 Method and apparatus for a semiconductor device having a radiation part |
| 03/22/1994 | US5296739 Circuit arrangement with a cooling member |
| 03/22/1994 | US5296738 Moisture relief for chip carrier |
| 03/22/1994 | US5296737 Semiconductor device with a plurality of face to face chips |
| 03/22/1994 | US5296735 Power semiconductor module with multiple shielding layers |
| 03/22/1994 | US5296710 Infrared radiation detector |
| 03/22/1994 | US5296653 Device having a multi-layered conductor structure |
| 03/22/1994 | US5296310 Hybrid structure for thermoconductivity, multilayer element with core and facing sheets and frames |
| 03/22/1994 | US5296074 Method for bonding small electronic components |
| 03/22/1994 | US5295619 Method and apparatus for performing wire bonding by using solder wire |
| 03/22/1994 | US5295298 Method of forming leads of semiconductor device to shape |
| 03/22/1994 | US5295297 Method of producing semiconductor memory |
| 03/17/1994 | WO1994006267A1 Heat sink |
| 03/17/1994 | WO1994006155A1 Surface mountable clock oscillator module and method for fabricating such modules |
| 03/17/1994 | WO1994006154A1 Method for thermally coupling a heat sink to a lead frame |
| 03/17/1994 | WO1994002425A3 Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same |
| 03/16/1994 | EP0587442A2 Wire bonding over the active circuit area of an integrated circuit device |
| 03/16/1994 | EP0587400A2 Manufacture of interconnections in semiconductor devices |
| 03/16/1994 | EP0587399A2 Semiconductor device incorporating a contact and manufacture thereof |
| 03/16/1994 | EP0587296A1 Tab tape and method for producing it |
| 03/16/1994 | EP0587294A1 Semiconductor package |
| 03/16/1994 | EP0587212A2 ESD protection for inputs requiring operation beyond supply voltages |
| 03/16/1994 | EP0587144A2 Liquid crystal display apparatus, structure for mounting semiconductor device, method of mounting semiconductor device, electronic optical apparatus and electronic printing apparatus |
| 03/16/1994 | EP0587112A1 Reduced capacitance lead frame for lead on chip package |
| 03/16/1994 | EP0587011A1 Memory card using IC and manufacturing method thereof |
| 03/16/1994 | EP0586890A2 Etching processes for avoiding edge stress in semiconductor chip solder bumps |
| 03/16/1994 | EP0586888A2 Three-dimensional multichip module |
| 03/16/1994 | EP0586803A1 Process for forming low resistance aluminum plug in via electrically connected to overlying patterned metal layer for integrated circuit structures |
| 03/16/1994 | EP0586793A2 Half-bridge configuration |
| 03/16/1994 | EP0586558A1 Multichip interconnect module including superconductive materials |
| 03/16/1994 | CN2159066Y Square rectifying bridge pin-processing device |
| 03/16/1994 | CN1083779A Pattern formation in photohardenable dielectric layers |
| 03/16/1994 | CN1024066C Semiconductor device and method of manufacturing semiconductor device |
| 03/15/1994 | US5295088 Method for predicting capacitance of connection nets on an integrated circuit |
| 03/15/1994 | US5295082 Efficient method for multichip module interconnect |
| 03/15/1994 | US5295045 Plastic-molded-type semiconductor device and producing method therefor |
| 03/15/1994 | US5295044 Semiconductor device |
| 03/15/1994 | US5295043 Clip-on heat sink and method of cooling a computer chip package |
| 03/15/1994 | US5294975 Laser alignment target for semiconductor integrated circuits |
| 03/15/1994 | US5294897 Microwave IC package |
| 03/15/1994 | US5294837 Semiconductor integrated circuit capable of correcting wiring skew |
| 03/15/1994 | US5294836 Semiconductor device having a wiring strip of noble metal and process of fabricating the semiconductor device |
| 03/15/1994 | US5294835 Including the reaction product of a silane and a phenol aralkyl resin |
| 03/15/1994 | US5294831 Circuit pack layout with improved dissipation of heat produced by high power electronic components |
| 03/15/1994 | US5294830 Apparatus for indirect impingement cooling of integrated circuit chips |
| 03/15/1994 | US5294829 IC package having direct attach backup battery |
| 03/15/1994 | US5294827 Semiconductor device having thin package body and method for making the same |
| 03/15/1994 | US5294826 Integrated circuit package and assembly thereof for thermal and EMI management |
| 03/15/1994 | US5294812 Semiconductor device having identification region for carrying out failure analysis |
| 03/15/1994 | US5294776 Method of burning in a semiconductor device |
| 03/15/1994 | US5294754 Direct write EC single metal layer |
| 03/15/1994 | US5294751 High frequency signal transmission line structure having shielding conductor unit |
| 03/15/1994 | US5294750 For containing a semiconductor chip |
| 03/15/1994 | US5294486 Stack of gold-nickel-gold-nickel-copper; diffusion prevention |
| 03/15/1994 | US5294477 Functionally gradient circuit board |
| 03/15/1994 | US5294381 Grooves, metallization |
| 03/15/1994 | US5294295 Method for moisture sealing integrated circuits using silicon nitride spacer protection of oxide passivation edges |
| 03/15/1994 | US5294238 Lithium |
| 03/15/1994 | US5294039 Plated compliant lead |
| 03/15/1994 | US5293930 Surface-to-air heat exchanger for electronic devices |
| 03/15/1994 | US5293754 Liquid coolant circulating system |
| 03/15/1994 | CA2106025A1 Packaged integrated circuits |
| 03/15/1994 | CA1327710C Cooling system for ic package |
| 03/10/1994 | DE4330070A1 Semiconductor module for power transistor, IGBT, GTO etc. - has thickness of main support plate over 2.5 times max. thickness of inner support plates |
| 03/10/1994 | DE4327652A1 Standard IC macro-cell design for clocked logic Sea Of Gates gate array - has set of power supply lines arranged near to, and on both sides of clock signal line to reduce cross=talk to signal lines |
| 03/10/1994 | DE4326985A1 Fluid-cooled electronic component - has transversal element in path of cooling medium flow ensuring distribution across rear of semiconductor element |
| 03/10/1994 | DE4233143A1 Improving micro-chip power density - applying substance with high electrical insulation and dielectric constant to chip structure |
| 03/09/1994 | EP0586163A2 Method and configuration for reducing electrical noise in integrated circuit devices |
| 03/09/1994 | EP0586149A1 Hermetic protection for integrated circuits, based on a ceramic layer |
| 03/09/1994 | EP0585876A1 Aluminum nitride sintered body and method of preparing the same |
| 03/09/1994 | EP0585640A2 Method of making contact for semiconductor device |
| 03/09/1994 | EP0585601A1 Integrated circuit security system and method with implanted interconnections |
| 03/09/1994 | EP0585578A1 Semiconductor device with reduced floating inductance and method of fabricating same |
| 03/09/1994 | EP0585376A1 Integrated circuit chip carrier |
| 03/09/1994 | CN1083626A Surface mountable clock oscillator module and method for fabrication such modules |
| 03/08/1994 | US5293511 Package for a semiconductor device |
| 03/08/1994 | US5293509 Sintered body of aluminum nitride |
| 03/08/1994 | US5293504 Multilayer ceramic substrate with capped vias |
| 03/08/1994 | US5293503 Semiconductor device having multilayer metal interconnection |
| 03/08/1994 | US5293502 Integrated circuit package |