| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/06/1994 | EP0590915A1 Chip on board assembly |
| 04/06/1994 | EP0590804A1 Vertically isolated monolithic bipolar high-power transistor with top collector |
| 04/06/1994 | EP0590781A1 Hermetic protection for integrated circuits, based on a ceramic layer |
| 04/06/1994 | EP0590780A1 Hermetic protection for integrated circuits, based on a ceramic layer |
| 04/06/1994 | EP0590652A2 Method of forming contact between diffused layer and wiring conductor semiconductor device |
| 04/06/1994 | EP0590636A1 Cooling structure for electronic circuit package |
| 04/06/1994 | EP0590324A1 Power and signal distribution in electronic packaging |
| 04/06/1994 | EP0590232A1 Semiconductor laser array and mounting method |
| 04/06/1994 | EP0590148A1 Method and apparatus for thin film formation, device, electro-magnetic apparatus, data recording/reproduction apparatus, signal processor, and method of producing molten crystal |
| 04/06/1994 | EP0299087B1 Semiconductor device and method of fabricating the same |
| 04/06/1994 | CN1024145C Semiconductor device metallization process |
| 04/05/1994 | US5301349 Single chip computer having ground wire formed immediately parallel a data bus and drivers formed directly under the data bus for high speed data transfer |
| 04/05/1994 | US5300815 Technique of increasing bond pad density on a semiconductor die |
| 04/05/1994 | US5300814 Semiconductor device having a semiconductor substrate with reduced step between memory cells |
| 04/05/1994 | US5300813 Refractory metal capped low resistivity metal conductor lines and vias |
| 04/05/1994 | US5300812 Plasticized polyetherimide adhesive composition and usage |
| 04/05/1994 | US5300811 Integrated circuit device and microprocessor constituted thereby |
| 04/05/1994 | US5300810 Electronic circuit and method with thermal management |
| 04/05/1994 | US5300809 Heat-conductive composite material |
| 04/05/1994 | US5300807 Thin film detector and method of manufacture |
| 04/05/1994 | US5300798 Semiconductor integrated circuit device |
| 04/05/1994 | US5300797 Coplanar twin-well integrated circuit structure |
| 04/05/1994 | US5300756 Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam |
| 04/05/1994 | US5300462 Multistep process; implanting metals then heat treating to form alloy areas |
| 04/05/1994 | US5300461 Process for fabricating sealed semiconductor chip using silicon nitride passivation film |
| 04/05/1994 | US5300459 Method for reducing thermal stress in an encapsulated integrated circuit package |
| 04/05/1994 | US5300458 Semiconductor component and method for the manufacture thereof |
| 04/05/1994 | US5300456 Metal-to-metal antifuse structure |
| 04/05/1994 | US5300455 Process for producing an electrically conductive diffusion barrier at the metal/silicon interface of a MOS transistor |
| 04/05/1994 | US5300307 Microstructure control of Al-Cu films for improved electromigration resistance |
| 04/05/1994 | US5300158 Protective coating having adhesion improving characteristics |
| 04/05/1994 | US5299941 Connecting terminal and a connecting terminal assembly |
| 04/05/1994 | US5299729 Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device |
| 04/05/1994 | US5299632 Fin device for an integrated circuit |
| 04/05/1994 | US5299450 Method for evaluating performance of aluminum alloy wiring film |
| 04/05/1994 | CA1328242C Process for manufacturing a superconductor and a method for producing a superconducting circuit |
| 03/31/1994 | WO1994007350A1 Hermetically sealed circuit modules having conductive cap anchors |
| 03/31/1994 | WO1994007349A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates |
| 03/31/1994 | WO1994007348A1 Dielectric vias within multilayer 3-dimensional structures/substrates |
| 03/31/1994 | WO1994007347A1 Field control and stability enhancement in multilayer, 3-dimensional structures |
| 03/31/1994 | WO1994007287A1 Improved semiconductor architecture and application therefor |
| 03/31/1994 | WO1994007266A1 A voltage programmable link having reduced capacitance |
| 03/31/1994 | WO1994007265A1 Liquid-coolant cooling element |
| 03/31/1994 | WO1994007264A1 A thin multichip module |
| 03/31/1994 | WO1994007263A1 Plastic semiconductor package with aluminum heat spreader |
| 03/31/1994 | WO1994006585A1 Method for making a ceramic metal composite |
| 03/31/1994 | DE4333373A1 Electronic appts. using power semiconductors - provides respective cooling medium flow jets for each power semiconductor heat sink element |
| 03/31/1994 | DE4232814A1 Metallic contact surfaces for semiconductor substrate - with opposing edges of adjacent contacts surfaces parallel to crystallographic grid direction of semiconductor |
| 03/31/1994 | DE4232745A1 Wire for ultrasonic bonding - has wire of ductile metal such as gold or copper coated with thin layer of harder material |
| 03/31/1994 | DE4232404A1 Testing integrated circuit chip on substrate - involves temporarily sticking substrate carrying chip onto adaptor during testing |
| 03/31/1994 | DE4232268A1 Surface mounted component with several input and output terminals - has input terminal divided into several groups, each at one component outer surface |
| 03/31/1994 | CA2145161A1 Method for making a ceramic metal composite |
| 03/31/1994 | CA2144881A1 Plastic semiconductor package with aluminum heat spreader |
| 03/31/1994 | CA2144088A1 Hermetically sealed circuit modules having conductive cap anchors |
| 03/31/1994 | CA2124197A1 Dielectric vias within multi-layer 3-dimensional structural/substrates |
| 03/30/1994 | EP0589813A1 Multilayer ceramic substrate with graded vias |
| 03/30/1994 | EP0589678A2 Hermetic protection for integrated circuits |
| 03/30/1994 | EP0589602A2 Potted electrical components and methods of making the same |
| 03/30/1994 | EP0589569A1 Lead frame with slots and a method for molding integrated circuit packages |
| 03/30/1994 | EP0589519A2 Electronic device manufacture |
| 03/30/1994 | EP0589241A2 Photosensitive dielectric sheet composition and multilayer interconnect circuits |
| 03/30/1994 | EP0589159A2 Method for contacting a semiconductor device |
| 03/30/1994 | EP0589143A2 Epoxy resin composition based on diglycidylether of biphenyldiol |
| 03/30/1994 | EP0588944A1 An improved miniature transponder device |
| 03/30/1994 | CN2160155Y Ebonite case structure of bridge rectifier |
| 03/29/1994 | US5299214 Heat radiating component and semiconductor device provided with the same |
| 03/29/1994 | US5299152 Anti-fuse memory device with switched capacitor setting method |
| 03/29/1994 | US5299150 Read only memory array |
| 03/29/1994 | US5299097 Electronic part mounting board and semiconductor device using the same |
| 03/29/1994 | US5299094 IC card including multiple substrates bearing electronic components |
| 03/29/1994 | US5299093 Electrical packaging structure and liquid crystal display device having the same |
| 03/29/1994 | US5299092 Plastic sealed type semiconductor apparatus |
| 03/29/1994 | US5299091 Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same |
| 03/29/1994 | US5299090 Pin-fin heat sink |
| 03/29/1994 | US5298793 Aluminum-nickel layer positioned between two alumnium layers |
| 03/29/1994 | US5298792 Integrated circuit device with bi-level contact landing pads |
| 03/29/1994 | US5298791 Thermally conductive electrical assembly |
| 03/29/1994 | US5298787 Semiconductor embedded layer technology including permeable base transistor |
| 03/29/1994 | US5298784 Electrically programmable antifuse using metal penetration of a junction |
| 03/29/1994 | US5298770 Power switching MOS transistor |
| 03/29/1994 | US5298548 Epoxy resin composition and semiconductor devices encapsulated therewith |
| 03/29/1994 | US5298536 Residues of one silicon-containing compound and at least one polycylic polyene compound linked through carbon-silicon bond |
| 03/29/1994 | US5298464 Method of mounting a tape automated bonded semiconductor in a housing using a compressor |
| 03/29/1994 | US5298462 Method of making metallization for semiconductor device |
| 03/29/1994 | US5298460 Substrate for packaging a semiconductor device |
| 03/29/1994 | US5298459 Method of manufacturing semiconductor device terminal having a gold bump electrode |
| 03/29/1994 | US5298328 Packing material and method of making same |
| 03/29/1994 | US5298304 Comprising protective film and two adhesive layers of polyamide and resole type resins; semiconductor manufacture |
| 03/29/1994 | US5298117 Metallic electrical interconnectors of multilayer elements using hydrogen fluoride, cupric chloride and chloride salt as etchant |
| 03/29/1994 | US5298114 Thin film circuit substrate and process for the manufacture thereof |
| 03/29/1994 | US5298110 Trench planarization techniques |
| 03/29/1994 | US5297969 Electrically connectable module with embedded electrical connectors electrically connected to conductive traces |
| 03/29/1994 | US5297618 Apparatus for removing a heatsink from an electronic module or package |
| 03/29/1994 | CA2044747C Electronic circuit module with power feed spring assembly |
| 03/24/1994 | DE4231828A1 Transistor power amplifier arrangement for matching circuit - has block of good thermally conducting material soldered onto ends of striplines connected to transistor connection pins |
| 03/24/1994 | DE4231705A1 Semiconductor device for ultra-flat package - has two separate connection regions on system carrier stuck to chip and connected over bridges to frame of system carrier |
| 03/24/1994 | DE4231141A1 Power component module for electronic control device - uses sidewall of control device housing as heat sink for dissipating waste heat generated by power components |
| 03/24/1994 | DE4231140A1 Electronic control appts. module - has power component mounted on circuit board with flexible section allowing it to contact heat sink element |
| 03/24/1994 | CA2106694A1 Hermetic protection of integrated circuits |
| 03/23/1994 | EP0588651A1 Ceramic microwave packages |