| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/26/1994 | US5306952 Multilayer aluminum-containing interconnection structure of semiconductor device |
| 04/26/1994 | US5306951 Sidewall silicidation for improved reliability and conductivity |
| 04/26/1994 | US5306950 Substrate, contact layer of rare earth metal or silicide, diffusion barrier of iron or alloy, solder layer of tin and lead |
| 04/26/1994 | US5306949 Transistor module having external lead terminal with transient voltage suppression |
| 04/26/1994 | US5306948 Semiconductor device and semiconductor module having auxiliary high power supplying terminals |
| 04/26/1994 | US5306947 Semiconductor device and manufacturing method thereof |
| 04/26/1994 | US5306946 Semiconductor device having a passivation layer with silicon nitride layers |
| 04/26/1994 | US5306945 Feature for a semiconductor device to reduce mobile ion contamination |
| 04/26/1994 | US5306942 Semiconductor device having a shield which is maintained at a reference potential |
| 04/26/1994 | US5306936 Non-volatile semiconductor memory device having oxynitride film for preventing charge in floating gate from loss |
| 04/26/1994 | US5306866 Module for electronic package |
| 04/26/1994 | US5306756 Method and compositions for diffusion patterning |
| 04/26/1994 | US5306747 Encapsulation a semiconductor |
| 04/26/1994 | US5306670 Multi-chip integrated circuit module and method for fabrication thereof |
| 04/26/1994 | US5306667 Process for forming a novel buried interconnect structure for semiconductor devices |
| 04/26/1994 | US5306665 Manufacturing a wiring for a semiconductor device by a forwardly tapered stack of two conductor films |
| 04/26/1994 | US5306664 Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device |
| 04/26/1994 | US5306571 Metal-matrix-composite |
| 04/26/1994 | US5306546 Multi chip module substrate |
| 04/26/1994 | US5306333 Mixture of high viscosity, good wettability solvents |
| 04/26/1994 | US5306167 IC socket |
| 04/26/1994 | US5305947 Method for manufacturing semiconductor-mounting heat-radiative substrates and semiconductor package using the same |
| 04/26/1994 | US5305523 Method of direct transferring of electrically conductive elements into a substrate |
| 04/26/1994 | US5305519 Multilevel interconnect structure and method of manufacturing the same |
| 04/26/1994 | CA1328728C Alumina adapted for use as semiconductor memory cell package and process for preparing the same |
| 04/21/1994 | DE4334861A1 Shaping leads of integrated circuit package - displacing lead end along arcuate path using clamping mechanism with two jaws |
| 04/21/1994 | DE4244721A1 Elektrische Maschine mit fluidgekühlten Halbleiterelementen Electrical machine with fluid-cooled semiconductor elements |
| 04/20/1994 | EP0593330A1 3D-interconnection method for electronic component housings and resulting 3D component |
| 04/20/1994 | EP0593199A2 Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module |
| 04/20/1994 | EP0592938A1 Process for mounting and contacting electronic components on an insulating support |
| 04/20/1994 | EP0592783A2 Heat regulator for integrated circuits |
| 04/20/1994 | EP0592463A1 Assembly apparatus. |
| 04/19/1994 | US5305186 Power carrier with selective thermal performance |
| 04/19/1994 | US5305185 Coplanar heatsink and electronics assembly |
| 04/19/1994 | US5305184 Method and apparatus for immersion cooling or an electronic board |
| 04/19/1994 | US5305179 Surface-mounting type semiconductor package having an improved efficiency for heat dissipation |
| 04/19/1994 | US5305130 Connecting tape, film carrier type IC for driving a liquid crystal display panel and method for making wiring interconnections |
| 04/19/1994 | US5305043 Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous system |
| 04/19/1994 | US5304847 Aluminum-gold intermetallic layer overlying the aluminum substrate |
| 04/19/1994 | US5304846 Narrow channel finned heat sinking for cooling high power electronic components |
| 04/19/1994 | US5304845 Apparatus for an air impingement heat sink using secondary flow generators |
| 04/19/1994 | US5304844 Semiconductor device and method of producing the same |
| 04/19/1994 | US5304843 Semiconductor device using film carrier |
| 04/19/1994 | US5304842 Encapsulated semiconductor memory device |
| 04/19/1994 | US5304841 Lead frame |
| 04/19/1994 | US5304818 Lead frame |
| 04/19/1994 | US5304743 Multilayer IC semiconductor package |
| 04/19/1994 | US5304738 System for protecting leads of a semiconductor chip package during testing, burn-in and handling |
| 04/19/1994 | US5304737 Semiconductor package |
| 04/19/1994 | US5304735 Heat sink for an electronic pin grid array |
| 04/19/1994 | US5304518 Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate |
| 04/19/1994 | US5304517 Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering |
| 04/19/1994 | US5304508 Method of making electrically programmable link structures |
| 04/19/1994 | US5304460 Anisotropic conductor techniques |
| 04/19/1994 | US5304429 Stiffened by applying tensile force to stretch lead beyond its elastic limit |
| 04/19/1994 | US5304241 Electronic component sealing filler |
| 04/19/1994 | US5303862 Using a patterned adhesive |
| 04/19/1994 | US5303555 Electronics package with improved thermal management by thermoacoustic heat pumping |
| 04/14/1994 | WO1994008440A1 Variable size capture pads for multilayer ceramic substrates and connectors therefor |
| 04/14/1994 | WO1994008357A1 Power semiconductor integrated circuit package |
| 04/13/1994 | EP0592111A2 Multichip module integrated circuit device having maximum input/output capability |
| 04/13/1994 | EP0592078A1 Antifuse element and fabrication method |
| 04/13/1994 | EP0592077A1 Series linear antifuse array |
| 04/13/1994 | EP0592022A1 A direct chip attach module (DCAM) |
| 04/13/1994 | EP0592002A2 Microwave integrated circuit |
| 04/13/1994 | EP0591900A2 Resin-sealed semiconductor device |
| 04/13/1994 | EP0591668A1 Method of mounting semiconductor integrated circuits |
| 04/13/1994 | EP0591604A2 Via fill compositions |
| 04/13/1994 | EP0591535A1 Method of blasting ic frame and apparatus therefor |
| 04/13/1994 | EP0591414A1 Lead frame for integrated circuits or the like |
| 04/13/1994 | EP0591312A1 Structured conductor tracks and process for making them. |
| 04/13/1994 | EP0591174A1 Reworkable adhesive for electronic applications. |
| 04/13/1994 | CN2161998Y Radiator for integrated circuit |
| 04/13/1994 | CN1085343A Via fill compositions |
| 04/12/1994 | USRE34583 Method of forming a configuration of interconnections on a semiconductor device having a high integration density |
| 04/12/1994 | US5303402 Electrically isolated metal mask programming using a polysilicon fuse |
| 04/12/1994 | US5303199 Redundant memory device having a memory cell and electrically breakable circuit having the same dielectric film |
| 04/12/1994 | US5303120 Method of manufacturing inversion type IC's and IC module using same |
| 04/12/1994 | US5303119 Interconnection system for integrated circuits |
| 04/12/1994 | US5302891 For testing a semiconductor device in die form |
| 04/12/1994 | US5302856 Semiconductor rectifying device and full-wave rectifier fabricated using the same |
| 04/12/1994 | US5302855 Contact electrode structure for semiconductor device |
| 04/12/1994 | US5302853 Land grid array package |
| 04/12/1994 | US5302852 Semiconductor device package having a low profile structure and high strength |
| 04/12/1994 | US5302851 Poly(3,4*-oxydiphenylene pyromellitimide) |
| 04/12/1994 | US5302849 Plastic and grid array semiconductor device and method for making the same |
| 04/12/1994 | US5302778 Semiconductor insulation for optical devices |
| 04/12/1994 | US5302553 Method of forming a coated plastic package |
| 04/12/1994 | US5302548 Semiconductor device manufacturing method |
| 04/12/1994 | US5302547 Systems for patterning dielectrics by laser ablation |
| 04/12/1994 | US5302546 Programming of antifuses |
| 04/12/1994 | US5302491 Including electrically detectable identification information during fabrication |
| 04/12/1994 | US5302456 Anisotropic conductive material and method for connecting integrated circuit element by using the anisotropic conductive material |
| 04/12/1994 | US5302219 Method for obtaining via patterns in ceramic sheets |
| 04/12/1994 | US5302198 Coating solution for forming glassy layers |
| 04/12/1994 | US5301862 Solder coating apparatus |
| 04/07/1994 | DE4329260A1 Prodn. of wiring in semiconductor element - by applying diffusion barrier layer on substrate, heat treating and applying metal wiring layer |
| 04/07/1994 | DE4233403A1 Prodn. of multilayer hybrids - comprising green ceramic foils having conducting pathways and through-contacts with electrical connections between them |
| 04/07/1994 | DE4233073A1 Semiconductor modular structure prodn. - by convexly shaping and bonding in single hot pressing operation |
| 04/06/1994 | EP0590986A1 Lead-on-chip inner lead bonding lead frame, bonding method and apparatus |