| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/10/1994 | US5311058 Integrated circuit power distribution system |
| 05/10/1994 | US5311057 Lead-on-chip semiconductor device and method for making the same |
| 05/10/1994 | US5311056 Semiconductor device having a bi-level leadframe |
| 05/10/1994 | US5311053 Interconnection network |
| 05/10/1994 | US5311043 Bidirectional semiconductor switch with hybrid construction |
| 05/10/1994 | US5311041 Thin film transistor having an inverted stagger type structure |
| 05/10/1994 | US5311039 PROM and ROM memory cells |
| 05/10/1994 | US5311007 Cover for solid-state image sensing device with a concave-shaped cross-section |
| 05/10/1994 | US5310967 Applying conductive lines to integrated circuits |
| 05/10/1994 | US5310966 Wiring boards and manufacturing methods thereof |
| 05/10/1994 | US5310965 Multi-level wiring structure having an organic interlayer insulating film |
| 05/10/1994 | US5310702 Method of preventing short-circuiting of bonding wires |
| 05/10/1994 | US5310701 Supporting a substrate, bonding metal wires to semiconductors and joining to substrate |
| 05/10/1994 | US5310700 Vapor deposition of insulating and conducting layers, masking and etching |
| 05/10/1994 | US5310699 Method of manufacturing a bump electrode |
| 05/10/1994 | US5310695 Interconnect structure in semiconductor device and method for making the same |
| 05/10/1994 | US5310602 Self-aligned process for capping copper lines |
| 05/10/1994 | US5310520 Circuit system, a composite material for use therein, and a method of making the material |
| 05/10/1994 | US5310440 Convection transfer system |
| 05/10/1994 | US5309986 Heat pipe |
| 05/10/1994 | US5309983 Low profile integrated heat sink and fan assembly |
| 05/10/1994 | US5309979 Self clamping heat sink assembly |
| 05/10/1994 | CA1329426C Solid-state high power amplifier arrangement |
| 05/05/1994 | DE4336354A1 Integrated circuit package cooling device - has Peltier element formed from two thin metal layers with finger type structures which mesh together |
| 05/05/1994 | DE4327290A1 Master-slice type integrated circuit - has several semiconductor regions which are mutually insulated, set in first longitudinal direction, and connected to several supply lines |
| 05/05/1994 | DE4310446C1 Power semiconductor circuit module - has mirror symmetrical configuration of power semiconductor carrier plates and heat sink elements |
| 05/05/1994 | DE4301915A1 Multi-chip package semiconductor device - has conductive frame for semiconductor chips with several conductors and cross-conductors |
| 05/04/1994 | EP0595752A1 Interconnect structure having improved metallization |
| 05/04/1994 | EP0595600A1 Semiconductor device package |
| 05/04/1994 | EP0595549A2 Radio frequency baggage tags |
| 05/04/1994 | EP0595502A1 Semiconductor optical apparatus having an improved precision for the optical beam position |
| 05/04/1994 | EP0595346A1 Composite microwave module assembly and its connection structure |
| 05/04/1994 | EP0595343A2 Method of forming solder film |
| 05/04/1994 | EP0595298A1 A semiconductor device having a hollow around a gate electrode and a method for producing the same |
| 05/04/1994 | EP0595021A1 Improved lead frame package for electronic devices |
| 05/04/1994 | EP0594654A1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits. |
| 05/04/1994 | EP0594652A1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits. |
| 05/04/1994 | CN2164115Y Luminescent diode indicator |
| 05/04/1994 | CN1086373A Power module |
| 05/03/1994 | USRE34598 Integrated circuit |
| 05/03/1994 | US5309326 Circuit module having stacked circuit boards |
| 05/03/1994 | US5309322 Leadframe strip for semiconductor packages and method |
| 05/03/1994 | US5309321 Thermally conductive screen mesh for encapsulated integrated circuit packages |
| 05/03/1994 | US5309319 Integral cooling system for electric components |
| 05/03/1994 | US5309318 Thermally enhanced semiconductor chip package |
| 05/03/1994 | US5309027 Encapsulated semiconductor package having protectant circular insulators |
| 05/03/1994 | US5309026 Integrated circuit package having stress reducing recesses |
| 05/03/1994 | US5309025 Semiconductor bond pad structure and method |
| 05/03/1994 | US5309024 Multilayer package |
| 05/03/1994 | US5309023 Contact structure for interconnection in semiconductor devices and manufacturing method thereof |
| 05/03/1994 | US5309021 Semiconductor device having particular power distribution interconnection arrangement |
| 05/03/1994 | US5309020 Packaged semiconductor device assembly including two interconnected packaged semiconductor devices mounted on a common substrate |
| 05/03/1994 | US5309019 Low inductance lead frame for a semiconductor package |
| 05/03/1994 | US5309018 Lead frame having deformable supports |
| 05/03/1994 | US5309017 Assembly lead frame with common lead arrangement for semiconductor devices |
| 05/03/1994 | US5309016 Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads |
| 05/03/1994 | US5309015 Clock wiring and semiconductor integrated circuit device having the same |
| 05/03/1994 | US5309014 Transistor package |
| 05/03/1994 | US5309011 Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein |
| 05/03/1994 | US5308929 Multilayer structure |
| 05/03/1994 | US5308920 Heat radiating device |
| 05/03/1994 | US5308797 Leads for semiconductor chip assembly and method |
| 05/03/1994 | US5308796 Using silicide as catalyst for selective plating |
| 05/03/1994 | US5308795 Above via metal-to-metal antifuse |
| 05/03/1994 | US5308794 Aluminum-germanium alloys for VLSI metallization |
| 05/03/1994 | US5308793 Oxidation resistant protective coating |
| 05/03/1994 | US5308686 Substrate having a multiple metal protected conductive layer and method of manufacturing the same |
| 05/03/1994 | US5308682 Alignment check pattern for multi-level interconnection |
| 05/03/1994 | US5308440 Multilayer semiconductor with metal layer and air bridges |
| 05/03/1994 | US5307929 Lead arrangement for integrated circuits and method of assembly |
| 05/03/1994 | US5307559 Method of providing a capacitor within a semiconductor device package |
| 04/28/1994 | WO1994009514A1 Electronics module |
| 04/28/1994 | WO1994009513A1 Interconnection structure for integrated circuits and method for making same |
| 04/28/1994 | WO1994009512A1 Metal electronic package with reduced seal width |
| 04/28/1994 | WO1994009511A1 Semiconductor component |
| 04/28/1994 | WO1994009510A1 Process and device for forming the connection leads of integrated circuits |
| 04/28/1994 | DE4336003A1 Semiconductor device with connection structure - has surface section of conductive region in substrate surface with surface roughness greater than that of substrate |
| 04/28/1994 | DE4335997A1 Semiconductor memory device with buried bit-line, for DRAM - has word line as transfer gate, bit line as data line, and two field regions on semiconductor substrate |
| 04/28/1994 | DE4235919A1 Thin film circuit manufacturing method - gilding remaining copper surfaces after removal of exposed parts of first relatively thin copper layer |
| 04/28/1994 | CA2145076A1 Metal electronic package with reduced seal width |
| 04/27/1994 | EP0594521A2 Supersaturation method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith |
| 04/27/1994 | EP0594441A2 Semiconductor device |
| 04/27/1994 | EP0594395A2 Semiconductor power module |
| 04/27/1994 | EP0594300A1 Method for forming a metal contact |
| 04/27/1994 | EP0594299A2 Multi-layered lead frame assembly and method for integrated circuits |
| 04/27/1994 | EP0594298A1 Integrated circuit doped dielectric, preventing contamination by mobile ions |
| 04/27/1994 | EP0594286A2 Electronic parts with metal wiring and manufacturing method thereof |
| 04/27/1994 | EP0593966A1 Three dimensional high performance interconnection package |
| 04/27/1994 | EP0593777A1 Refrigerant composition and binary refrigerating system using the composition |
| 04/27/1994 | EP0593666A1 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 04/27/1994 | EP0593637A1 Low impedance bus for power electronics |
| 04/27/1994 | EP0593529A1 Programmable interconnect structures and programmable integrated circuits |
| 04/27/1994 | CN2163445Y Round rectifying bridge base pin processing apparatus |
| 04/26/1994 | US5307503 Shielded circuit module with terminal pins arrayed on four sides for connection to a computer board |
| 04/26/1994 | US5307240 Chiplid, multichip semiconductor package design concept |
| 04/26/1994 | US5307239 Electromechanical module with small footprint and post-solder attachable/removable heat sink frame |
| 04/26/1994 | US5307237 Integrated circuit packaging with improved heat transfer and reduced signal degradation |
| 04/26/1994 | US5307236 Heatsink for contact with multiple electronic components mounted on a circuit board |
| 04/26/1994 | US5306967 Apparatus for improving signal transmission along parallel lines |
| 04/26/1994 | US5306961 Low-power integrated circuit with selectable battery modes |