| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/24/1994 | US5315542 Bit line arrangement for integrated circuits |
| 05/24/1994 | US5315486 Hermetically packaged HDI electronic system |
| 05/24/1994 | US5315485 Variable size capture pads for multilayer ceramic substrates and connectors therefor |
| 05/24/1994 | US5315482 Semiconductor apparatus of module installing type |
| 05/24/1994 | US5315481 Packaging construction for semiconductor wafers |
| 05/24/1994 | US5315480 Conformal heat sink for electronic module |
| 05/24/1994 | US5315479 Air manifold for cooling electronic components |
| 05/24/1994 | US5315239 Circuit module connections |
| 05/24/1994 | US5315182 Semiconductor integrated circuit having annular power supply with plural lines |
| 05/24/1994 | US5315156 For use in high frequency power gain circuits |
| 05/24/1994 | US5315155 Electronic package with stress relief channel |
| 05/24/1994 | US5315154 Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
| 05/24/1994 | US5315153 Packages for semiconductor integrated circuit |
| 05/24/1994 | US5315152 Lead frame with improved adhesiveness property against plastic and plastic sealing type semiconductor packaging using said lead frame |
| 05/24/1994 | US5315150 Semiconductor device and method of manufacturing the same |
| 05/24/1994 | US5315146 Semiconductor memory device having specific layout configuration of n-MOS memory cells |
| 05/24/1994 | US5315145 Charge monitoring device for use in semiconductor wafer fabrication for unipolar operation and charge monitoring |
| 05/24/1994 | US5314847 Applying flame formed of mixture of hydrogen and oxygen gases so only substrate surface is heated |
| 05/24/1994 | US5314845 Vapor deposition by flowing gaseous mixture of oxygen source and tetraethylorthosilicate across wafer surface under reduced pressure, then repeating with lower pressure |
| 05/24/1994 | US5314842 Resin-sealed type semiconductor device and method for manufacturing the same |
| 05/24/1994 | US5314840 Forming a low electrical resistant connection of good mechanical and thermal properties by heating adjacent bodies of aluminum and germanium and alloying |
| 05/24/1994 | US5314837 Method of making a registration mark on a semiconductor |
| 05/24/1994 | US5314709 Unzippable polymer mask for screening operations |
| 05/24/1994 | US5314606 Leadless ceramic package with improved solderabilty |
| 05/24/1994 | US5313693 Device for the mounting of very wide-band microwave integrated circuits |
| 05/24/1994 | CA1329739C Multilayer ceramic coatings from silicate esters and metal oxides |
| 05/24/1994 | CA1329738C Multilayer ceramics from silicate esters |
| 05/24/1994 | CA1329736C Multilayer ceramic coatings from metal oxides for protection of electronic devices |
| 05/19/1994 | DE4338432A1 Plastics encapsulated IC module mfr. - comprises forming external electrodes by photolithography and cleaning by polishing of hardened resin barrier layer |
| 05/19/1994 | DE4238113A1 Semiconductor chip mounting arrangement for fragile semiconductor element - includes silicon rubber encapsulation on all sides of chip within plastics package |
| 05/18/1994 | EP0597745A1 Fusible circuit for integrated circuit |
| 05/18/1994 | EP0597634A2 Method of opening windows in dielectric layers of an integrated circuit |
| 05/18/1994 | EP0597425A2 Structure for cooling an integrated circuit |
| 05/18/1994 | EP0597323A1 Insulating mounting device for heat generating semi-conductor components |
| 05/18/1994 | EP0597144A1 Hybrid power electronic device |
| 05/18/1994 | EP0597087A1 Computer-aided design methods and apparatus for multilevel interconnect technologies |
| 05/18/1994 | EP0597055A1 Electronic tag |
| 05/18/1994 | EP0597052A1 Transport robot for a machining or processing line for lead frames. |
| 05/18/1994 | EP0597015A1 Anti-fuse structures and methods for making same. |
| 05/18/1994 | EP0172192B1 Process for forming slots of different types in self-aligned relationship using a mask |
| 05/17/1994 | US5313416 Semiconductor memory control device and method of mounting same in high density |
| 05/17/1994 | US5313368 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon |
| 05/17/1994 | US5313367 Semiconductor device having a multilayer interconnection structure |
| 05/17/1994 | US5313366 Direct chip attach module (DCAM) |
| 05/17/1994 | US5313365 Encapsulated electronic package |
| 05/17/1994 | US5313363 Low impedance interconnection assembly for high frequency switching power semiconductor devices and low inductance modular capacitor |
| 05/17/1994 | US5313362 Packaging structure of small-sized computer |
| 05/17/1994 | US5313361 Ceramic substrate |
| 05/17/1994 | US5313102 Noncracking |
| 05/17/1994 | US5313101 Aluminum, titanium, and their intermetallic compound layers |
| 05/17/1994 | US5313100 Layers of aluminum or alloy, tungsten or silicide, and titanium nitride |
| 05/17/1994 | US5313099 Heat sink assembly for solid state devices |
| 05/17/1994 | US5313098 Packaging arrangement for power semiconductor devices |
| 05/17/1994 | US5313096 IC chip package having chip attached to and wire bonded within an overlying substrate |
| 05/17/1994 | US5313095 Multiple-chip semiconductor device and a method of manufacturing the same |
| 05/17/1994 | US5313094 Thermal dissipation of integrated circuits using diamond paths |
| 05/17/1994 | US5313091 Package for a high power electrical component |
| 05/17/1994 | US5313084 Interconnect structure for an integrated circuit |
| 05/17/1994 | US5312878 Naphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resin |
| 05/17/1994 | US5312776 Method of preventing the corrosion of metallic wirings |
| 05/17/1994 | US5312775 Stabilizing electrical resistance in contact hole at interface between upper and lower layers of aluminum connectors |
| 05/17/1994 | US5312772 Method of manufacturing interconnect metallization comprising metal nitride and silicide |
| 05/17/1994 | US5312716 Process for producing a semiconductor |
| 05/17/1994 | US5312698 Aluminum nitride substrate and method for producing same |
| 05/17/1994 | US5312674 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 05/17/1994 | US5312508 Attaching crimped wire mesh to an object requiring heat transfer |
| 05/17/1994 | US5312456 Micromechanical barb and method for making the same |
| 05/17/1994 | US5311931 Mist supercooling of a heated surface |
| 05/17/1994 | US5311928 Heat dissipator |
| 05/11/1994 | WO1994010703A1 Chip interconnection having a breathable etch stop layer |
| 05/11/1994 | WO1994010451A1 Low profile fan body with heat transfer characteristics |
| 05/11/1994 | WO1994010098A1 Dielectric powder composition |
| 05/11/1994 | EP0596824A1 Semiconductor device and wafer structure having a planar buried interconnect prepared by wafer bonding |
| 05/11/1994 | EP0596613A2 Optical fibre coupling modules |
| 05/11/1994 | EP0596596A1 Mounting for a high frequency integrated circuit |
| 05/11/1994 | EP0596593A1 Plasma etch process |
| 05/11/1994 | EP0596592A2 Method for the elimination of metal voids in metal lines of a semiconductor device |
| 05/11/1994 | EP0596582A1 Bonded ceramic-metal composite substrate and circuit board constructed therewith |
| 05/11/1994 | EP0596474A2 Circuit arrangement for controlled switch-off of a metal-oxide semiconductor field effect transistor |
| 05/11/1994 | EP0596364A2 Method of producing semiconductor device having buried contact structure |
| 05/11/1994 | EP0596253A1 Semiconductor device having multilayered metalization and method of manufacturing the same |
| 05/11/1994 | EP0596075A1 Non-conductive end layer for integrated stack of ic chips |
| 05/11/1994 | EP0592463A4 Assembly apparatus |
| 05/11/1994 | DE4337675A1 Semiconductor chip package with stepped connecting element surfaces - has wire bonds from chip to upper steps of elements with encapsulation completely enveloping chip on lower steps |
| 05/11/1994 | DE4237080A1 Multilayer film integrated circuit for microprocessor chip - has vapour-deposited thin film circuits laid out on flexible strip for rolling with interlayer of insulating material |
| 05/11/1994 | CN1086632A Simple sealing material for electric appliance |
| 05/11/1994 | CA2102653A1 Epoxy resin compositions and resin-encapsulated semiconductor devices |
| 05/10/1994 | US5311407 Printed circuit based for mounted semiconductors and other electronic components |
| 05/10/1994 | US5311406 Microstrip printed wiring board and a method for making same |
| 05/10/1994 | US5311404 Electrical interconnection substrate with both wire bond and solder contacts |
| 05/10/1994 | US5311403 Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate |
| 05/10/1994 | US5311402 Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
| 05/10/1994 | US5311401 Stacked chip assembly and manufacturing method therefor |
| 05/10/1994 | US5311399 High power ceramic microelectronic package |
| 05/10/1994 | US5311395 Surface mount heat sink |
| 05/10/1994 | US5311391 Electrostatic discharge protection circuit with dynamic triggering |
| 05/10/1994 | US5311341 Connection structure between a tab film and a liquid crystal panel |
| 05/10/1994 | US5311148 Thermally optimized interdigitated transistor |
| 05/10/1994 | US5311061 Alignment key for a semiconductor device having a seal against ionic contamination |
| 05/10/1994 | US5311059 Semiconductor device package |