| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/14/1994 | US5321296 Semiconductor device having an interconnection layer of a polysilicon layer and a metallic layer |
| 06/14/1994 | US5321211 Integrated circuit via structure |
| 06/14/1994 | US5321210 Dielectric substrate, laminated blocks of alternating wiring layers and polyimide layers bonded to each other, electrical connections of solder pools and metal bumps on facing surfaces |
| 06/14/1994 | US5321204 Structure of charged coupled device |
| 06/14/1994 | US5320983 Spin-on glass processing technique for the fabrication of semiconductor devices |
| 06/14/1994 | US5320980 Interconnection structure in semiconductor device and the method thereof |
| 06/14/1994 | US5320973 Method of fabricating a thin-film transistor and wiring matrix device |
| 06/14/1994 | US5320894 Used in electronic equipment; isulating layers are made up of synthetic resin, plurity of via holes provided therein with to connect power interconnections selectively |
| 06/14/1994 | US5320559 Connector for leadless IC package |
| 06/14/1994 | US5320551 For receiving an electrical part |
| 06/09/1994 | WO1994013016A1 Low temperature co-fired ceramic (ltcc) high density interconnect package with circuitry within the cavity walls |
| 06/09/1994 | WO1994013015A1 Lead frame manufacturing method |
| 06/09/1994 | WO1994013014A1 Disc-formed, heat producing electronic element |
| 06/09/1994 | WO1994013013A1 Cooler integrated substrate for power electronics elements |
| 06/09/1994 | WO1994013012A1 Device for cooling sheet elements for power electronics |
| 06/09/1994 | WO1994013011A1 Means for fixing electronics elements in sheet form |
| 06/09/1994 | WO1994012282A1 Cooling method and apparatus |
| 06/09/1994 | DE4340718A1 Ceramic electronic component with cladding film on electrodes - has cladding films on wire electrodes and cladding films on other electrodes consisting of same material |
| 06/09/1994 | DE4339174A1 Semiconductor housing with exposed connection elements - has upper section of housing body wider than lower section to expose inner connections on both side sections of lower surface of upper section |
| 06/09/1994 | DE4240843A1 Power semiconductor component heat sink arrangement - has silicon chip on upper copper or molybdenum layer with arrangement fixed to base plate by lower copper or molybdenum layer |
| 06/09/1994 | CA2129047A1 Low temperature co-fired ceramic (ltcc) high density interconnect package with circuitry within the cavity walls |
| 06/08/1994 | EP0600850A1 DRAM cell structure with capacitor over bit line and method of making the same |
| 06/08/1994 | EP0600750A2 Circuit assembly having interposer lead frame |
| 06/08/1994 | EP0600694A1 Improved transistor device layout |
| 06/08/1994 | EP0600672A2 A trimming and forming machine and a die-punch set for the same |
| 06/08/1994 | EP0600590A1 Cooling electronic circuit assemblies |
| 06/08/1994 | EP0600505A1 Method of manufacturing a semiconductor device comprising a titanium silicide layer |
| 06/08/1994 | EP0600501A1 Resin molded semiconductor device |
| 06/08/1994 | EP0600488A2 Lead frame capacitor and capacitively-coupled isolator circuit using same |
| 06/08/1994 | EP0600436A2 Semiconductor device, circuit and method of manufacture |
| 06/08/1994 | EP0600423A1 Contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions |
| 06/08/1994 | EP0585376A4 Integrated circuit chip carrier |
| 06/08/1994 | CN1024957C Apparatus for providing electrical conduits in compact arrays of electronic circuitry utilizing cooling devices |
| 06/07/1994 | US5319247 Multiple layers of silicon oxide to provide flattened surface |
| 06/07/1994 | US5319246 Semiconductor device having multi-layer film structure |
| 06/07/1994 | US5319245 Local interconnect for integrated circuits |
| 06/07/1994 | US5319244 Triazine thin film adhesives |
| 06/07/1994 | US5319243 Electronic assembly with first and second substrates |
| 06/07/1994 | US5319242 Semiconductor package having an exposed die surface |
| 06/07/1994 | US5319241 Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution |
| 06/07/1994 | US5319238 Programmable interconnect structures and programmable integrated circuits |
| 06/07/1994 | US5319237 Power semiconductor component |
| 06/07/1994 | US5319224 Integrated circuit device having a geometry to enhance fabrication and testing and manufacturing method thereof |
| 06/07/1994 | US5319158 Coil integrated semi-conductor device and method of making the same |
| 06/07/1994 | US5319005 With phenol-aralkyl resin, inorganic filler, and cured product of vinyl and hydrogen-containing polysiloxanes |
| 06/07/1994 | US5318926 Chips having a cavity which exposes the lead frame |
| 06/07/1994 | US5318924 Nitridation of titanium-tungsten interconnects |
| 06/07/1994 | US5318923 Method for forming a metal wiring layer in a semiconductor device |
| 06/07/1994 | US5318857 Low temperature ozonolysis of silicon and ceramic oxide precursor polymers to ceramic coatings |
| 06/07/1994 | US5318855 Electronic assembly with flexible film cover for providing electrical and environmental protection |
| 06/07/1994 | US5318456 Socket |
| 06/07/1994 | US5317805 Method of making microchanneled heat exchangers utilizing sacrificial cores |
| 06/07/1994 | US5317801 Method of manufacture of multilayer circuit board |
| 06/01/1994 | EP0599592A1 Self-aligned via |
| 06/01/1994 | EP0599591A1 Emitter follower transistor with improved thermal resistance characteristics |
| 06/01/1994 | EP0599390A2 Semiconductor device provided with a number of programmable elements |
| 06/01/1994 | EP0599388A1 Semiconductor device provided with a programmable element |
| 06/01/1994 | EP0599317A1 Palanarized interlayer insulating film formed of stacked BPSG film and ozone-teos NSG film in semiconductor device, and method for forming the same |
| 06/01/1994 | EP0599194A1 Flat-card-shaped electronic module |
| 06/01/1994 | EP0598914A1 Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board |
| 06/01/1994 | EP0598795A1 High performance passivation for semiconductor devices |
| 06/01/1994 | DE4340419A1 Mfg. semiconductor component with first film on substrate - includes forming etching mask with aperture on films, leaving part of film free |
| 06/01/1994 | DE4306957C1 Semiconductor wafer magazine compartment indexing apparatus - has opto-electronic sensor determining position of both wafer and compartment w.r.t. reference plane having fixed relationship to handling plane |
| 06/01/1994 | DE4239857A1 Power semiconductor module with semiconductor chip having two main surfaces - has conductive tracks contacted by terminals on second main surfaces via flat contact strips |
| 06/01/1994 | DE4239761A1 Electronic hybrid circuit with treated substrate layer - has contacting bases in region of cover hermetically sealed with conductive or dielectric paste |
| 06/01/1994 | CN1087446A Manufacturing method of a semiconductor device |
| 05/31/1994 | US5317479 Plated compliant lead |
| 05/31/1994 | US5317478 Hermetic sealing of flexprint electronic packages |
| 05/31/1994 | US5317196 Encapsulant method and apparatus |
| 05/31/1994 | US5317195 Semiconductor device improved in light shielding property and light shielding package |
| 05/31/1994 | US5317194 Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink |
| 05/31/1994 | US5317193 Contact via for semiconductor device |
| 05/31/1994 | US5317192 Semiconductor contact via structure having amorphous silicon side walls |
| 05/31/1994 | US5317189 Axial lead frame |
| 05/31/1994 | US5317188 Means for and methods of testing automated tape bonded semiconductor devices |
| 05/31/1994 | US5317185 Semiconductor device having structures to reduce stress notching effects in conductive lines and method for making the same |
| 05/31/1994 | US5317176 Power transistor having multifinger contacts |
| 05/31/1994 | US5317107 Shielded stripline configuration semiconductor device and method for making the same |
| 05/31/1994 | US5316971 Methods for programming antifuses having at least one metal electrode |
| 05/31/1994 | US5316966 Method of providing mask alignment marks |
| 05/31/1994 | US5316788 Applying solder to high density substrates |
| 05/31/1994 | US5316787 Forming integrated circuits by lamination and forming apertures, hydrolysis and baking |
| 05/31/1994 | US5316540 Apparatus and method for separating microscopic units in a substantially continuous density gradient solution |
| 05/31/1994 | US5316080 Heat transfer device |
| 05/31/1994 | US5316077 Heat sink for electrical circuit components |
| 05/31/1994 | US5316075 Liquid jet cold plate for impingement cooling |
| 05/31/1994 | CA1329952C Multi-layer superconducting circuit substrate and process for manufacturing same |
| 05/27/1994 | CA2028696A1 Low temperature ozonolysis of silicon and ceramic oxide precursor polymers to ceramic coatings |
| 05/27/1994 | CA2007726A1 Low temperature process for the formation of ceramic coatings |
| 05/26/1994 | WO1994012009A1 Device for bending leads of a lead frame |
| 05/26/1994 | WO1994011902A1 Lead frame and semiconductor device using same |
| 05/25/1994 | EP0598563A2 Semiconductor conversion device |
| 05/25/1994 | EP0598497A1 Metal-core-type multi-layer lead frame |
| 05/25/1994 | EP0598399A2 Aluminum nitride sintered body, method for manufacturing the same, and ceramic circuit board |
| 05/25/1994 | EP0598302A1 Epoxy resin compositions and resin-encapsulated semiconductor devices |
| 05/25/1994 | EP0598168A1 Formation of direct contacts in high-density MOS/CMOS processes |
| 05/25/1994 | EP0577779A4 Multichip integrated circuit module and method of fabrication |
| 05/25/1994 | EP0577754A4 Three-dimensional multichip module systems and methods of fabrication |
| 05/25/1994 | CN1024731C Semiconductor device comprising support and manufacturing method thereof |
| 05/25/1994 | CN1024730C Method of manufacturing semiconductor devices having alignment mark |