| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/05/1994 | US5326414 Polymer support with conductor paths and polymer covers, fixing cover to support after coating with layer |
| 07/05/1994 | US5326390 Substituted polysaccharide, hydrogen bonding, inorganic oxide |
| 07/05/1994 | US5326271 IC socket |
| 07/05/1994 | US5325913 Module cooling system |
| 07/05/1994 | US5325574 Method of forming a quartz oscillator temperature sensor |
| 06/30/1994 | DE4343706A1 Heat-resistant electronic constructional element |
| 06/30/1994 | DE4314910A1 Package for integrated circuit with pattern of coupling contacts |
| 06/29/1994 | EP0604205A2 Lead frame and method for manufacturing it |
| 06/29/1994 | EP0604061A1 Semiconductor fabrication |
| 06/29/1994 | EP0604038A2 Plasticized polyetherimide adhesive compositions |
| 06/29/1994 | EP0604036A2 Method for depositing aluminum layers on insulating oxide substrates |
| 06/29/1994 | EP0604005A1 Device packaged in a high interconnect density land grid array package having electrical and optical interconnects |
| 06/29/1994 | EP0603928A1 Hybrid circuit |
| 06/29/1994 | EP0603860A2 Integral extended surface cooling of power modules |
| 06/29/1994 | EP0603623A2 Joining of layers and multi-layer circuit boards |
| 06/29/1994 | EP0603461A2 Formation of 3-Dimensional silicon silicide structures |
| 06/29/1994 | EP0603296A1 Solder bump fabrication method and solder bumps formed thereby. |
| 06/29/1994 | EP0603198A1 Moisture relief for chip carriers |
| 06/29/1994 | EP0561806B1 Electrical device, in particular a switching and control device for motor vehicles |
| 06/29/1994 | CN1025261C Semiconductor integrated circuit chip having identification circuit therein |
| 06/28/1994 | US5325384 Structure and method for mounting laser diode arrays |
| 06/28/1994 | US5325268 Interconnector for a multi-chip module or package |
| 06/28/1994 | US5325265 High performance integrated circuit chip package |
| 06/28/1994 | US5325072 High-frequency power amplifier device and high-frequency module including the same |
| 06/28/1994 | US5324987 Electronic apparatus with improved thermal expansion match |
| 06/28/1994 | US5324985 Packaged semiconductor device |
| 06/28/1994 | US5324981 Semiconductor device |
| 06/28/1994 | US5324970 Interconnection structure in semiconductor device |
| 06/28/1994 | US5324936 Hybrid optical/electrical circuit module with thermal insulation |
| 06/28/1994 | US5324916 System and method for dynamic power compensation |
| 06/28/1994 | US5324892 Method of fabricating an electronic interconnection |
| 06/28/1994 | US5324890 Direct bond copper-output footprint |
| 06/28/1994 | US5324888 Metal electronic package with reduced seal width |
| 06/28/1994 | US5324690 Semiconductor device having a ternary boron nitride film and a method for forming the same |
| 06/28/1994 | US5324687 Method for thinning of integrated circuit chips for lightweight packaged electronic systems |
| 06/28/1994 | US5324683 Method of forming a semiconductor structure having an air region |
| 06/28/1994 | US5324681 Method of making a 3-dimensional programmable antifuse for integrated circuits |
| 06/28/1994 | US5324570 Microelectronics package |
| 06/28/1994 | US5324569 Composite transversely plastic interconnect for microchip carrier |
| 06/28/1994 | US5324370 Firing hybrid laminate |
| 06/28/1994 | US5323845 Heat sink clip assembly |
| 06/28/1994 | US5323535 Electrical connecting member and method of manufacturing the same |
| 06/28/1994 | US5323533 Method of producing coaxial connections for an electronic component, and component package |
| 06/23/1994 | WO1994014227A1 High power laminated bus assembly for an electrical switching converter |
| 06/23/1994 | WO1994014201A1 Electrical interconnect structures |
| 06/23/1994 | WO1994014194A1 Void-free thermally enhanced plastic package |
| 06/23/1994 | WO1994014193A1 Electronic package sealed with a dispensable adhesive |
| 06/23/1994 | WO1994014190A1 Surface structure for soldering and non-flux soldering method using the same |
| 06/23/1994 | DE4342702A1 Verfahren zur Erzeugung eines Durchkontaktstiftes in einem Halbleiterbauelement A method for producing a through-contact pin in a semiconductor device |
| 06/23/1994 | DE4242676A1 New polymeric porphyrin compounds useful in electrical and optical uses |
| 06/23/1994 | DE4242566A1 Verfahren zur Montage von Halbleiterbauelementen in Gehäusen durch mechanisches Klemmen Method for mounting of semiconductor components in housings, by mechanical clamps |
| 06/23/1994 | DE3990432C1 Bonding wire for connecting electrode of semiconductor element |
| 06/23/1994 | CA2150913A1 Electrical interconnect structures |
| 06/23/1994 | CA2150569A1 Electronic package sealed with a dispensable adhesive |
| 06/22/1994 | EP0603158A2 Advanced multilayer molded plastic package using mesic technology |
| 06/22/1994 | EP0603105A1 Antifuse element with electrical or optical programming |
| 06/22/1994 | EP0603104A1 Large scale IC personalization method employing air dielectric structure for extended conductor |
| 06/22/1994 | EP0603048A1 Heat dissipation system for an electronic component and a hermetically sealed casing in such a system |
| 06/22/1994 | EP0602836A1 Self-aligned vertical antifuse |
| 06/22/1994 | EP0602662A1 Hollow plastic molded package for semiconductor device and process for manufacturing same |
| 06/22/1994 | EP0602609A1 Electrical interconnects having a supported bulge configuration |
| 06/22/1994 | EP0602338A1 Semiconductor devices and electronic system incorporating them |
| 06/22/1994 | EP0602328A2 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 06/22/1994 | EP0602298A1 Process for dissipating heat from a semiconductor package |
| 06/22/1994 | EP0602278A1 High frequency bipolar transistor |
| 06/22/1994 | EP0602271A1 Wafer testing process of a semiconductor device having a redundancy circuit |
| 06/22/1994 | EP0602257A1 Printed circuits with local higher wiring density and method for manufacturing such printed circuits |
| 06/22/1994 | EP0602252A1 Ceramic green sheet |
| 06/21/1994 | US5323294 Liquid metal heat conducting member and integrated circuit package incorporating same |
| 06/21/1994 | US5323292 Integrated multi-chip module having a conformal chip/heat exchanger interface |
| 06/21/1994 | US5323150 Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices |
| 06/21/1994 | US5323058 Semiconductor device including package with improved base-to-cop seal |
| 06/21/1994 | US5323051 Semiconductor wafer level package |
| 06/21/1994 | US5323047 Structure formed by a method of patterning a submicron semiconductor layer |
| 06/21/1994 | US5323045 Semiconductor SRAM with low resistance power line |
| 06/21/1994 | US5323035 Interconnection structure for integrated circuits and method for making same |
| 06/21/1994 | US5322816 Etching by undercutting through dielectric, substrate layers, depositing an electrical conductive material through the opening and coupling |
| 06/21/1994 | US5322815 Method for producing semiconductor device with multilayer leads |
| 06/21/1994 | US5322812 Improved method of fabricating antifuses in an integrated circuit device and resulting structure |
| 06/21/1994 | US5322593 Bonding separately formed polyimide layered wiring structures together, removing one base by cutting, forming via holes in exposed polyimide layer |
| 06/21/1994 | US5322574 Method of manufacturing a high strength, high conductivity copper-silver alloy |
| 06/21/1994 | US5322204 Electronic substrate multiple location conductor attachment technology |
| 06/21/1994 | US5321886 Applying conductive lines to integrated circuits |
| 06/21/1994 | US5321884 Multilayered flexible circuit package |
| 06/17/1994 | CA2111507A1 Electronic component heat energy dispersal system and associated enclosure |
| 06/16/1994 | DE4342047A1 Semiconductor component with silylazide layer among diffusion barriers - improves step coverage characteristic by rendering diffusion barrier layer arrangement more amenable to metallisation |
| 06/16/1994 | DE4324817A1 High frequency IC component assembly - has cover hermetically sealing and shielding chips with flat part parallel to chip surfaces and side walls which encircle chips |
| 06/16/1994 | DE4242097A1 EM compatibility protection for hybrid components - is provided by chip capacitor filter on ceramic carrier for suppression of direct irradiation and cable-conducted interference |
| 06/16/1994 | DE4241869A1 New polypyridino-anil derivs. from aromatic-diamine - useful, esp. after doping, as electrically conducting materials |
| 06/15/1994 | EP0601516A1 Cooling device |
| 06/15/1994 | EP0601509A1 Semiconductor devices and method of manufacturing the same |
| 06/15/1994 | EP0601323A1 Integrated circuit chip composite |
| 06/15/1994 | EP0596075A4 Non-conductive end layer for integrated stack of ic chips |
| 06/15/1994 | EP0305515B1 Devices and systems based on novel superconducting material |
| 06/15/1994 | CN1088001A High-yield spatial light modulator with light blocking layer |
| 06/14/1994 | US5321582 Electronic component heat sink attachment using a low force spring |
| 06/14/1994 | US5321322 Programmable interconnect architecture without active devices |
| 06/14/1994 | US5321307 Hermetically sealed metal stem or header for semiconductor device |
| 06/14/1994 | US5321305 LED manufacturing frame and method of using the same for manufacturing LEDs |
| 06/14/1994 | US5321300 Laser-broken fuse |