| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/26/1994 | US5332079 Apparatus for conveying plate-form articles |
| 07/26/1994 | US5331733 Method for manufacturing a connection device for a semiconductor device |
| 07/21/1994 | WO1994016544A1 Process for manufacturing integrated microcircuits |
| 07/21/1994 | WO1994016487A2 Self powered integrated circuit modules |
| 07/21/1994 | WO1994016460A1 Integrated microcircuit |
| 07/21/1994 | DE3943683C2 Ceramic metal composite substrate |
| 07/20/1994 | EP0606813A2 Process for corrosion free multi-layer metal conductors |
| 07/20/1994 | EP0606761A2 Semiconductor device and process for production thereof |
| 07/20/1994 | EP0606758A1 SOI transistor DRAM device and method of producing the same |
| 07/20/1994 | EP0606725A1 Article comprising compression bonded parts |
| 07/20/1994 | EP0606525A1 TAB type semiconductor device |
| 07/20/1994 | EP0606522A2 Semiconductor device and methods for producing and mounting the semiconductor device |
| 07/20/1994 | EP0606355A1 Method and compositions for diffusion patterning |
| 07/20/1994 | EP0606216A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias. |
| 07/20/1994 | CN1025508C Copper etch process using haldes |
| 07/19/1994 | US5331515 Module with leads from multiple chips shorted together only at edge contact locations |
| 07/19/1994 | US5331514 Integrated-circuit package |
| 07/19/1994 | US5331513 Method of mounting electronic part on circuit substrate and circuit substrate including electronic parts mounted thereon |
| 07/19/1994 | US5331511 Electrically and thermally enhanced integrated-circuit package |
| 07/19/1994 | US5331510 Electronic equipment and computer with heat pipe |
| 07/19/1994 | US5331507 Clip for mounting a heat sink on an electronic device package |
| 07/19/1994 | US5331235 Multi-chip semiconductor package |
| 07/19/1994 | US5331205 Semiconductor device |
| 07/19/1994 | US5331204 Integrated circuit package in which impendance between signal pads and signal lines is matched by reducing the size of a ground plane |
| 07/19/1994 | US5331203 High density interconnect structure including a chamber |
| 07/19/1994 | US5331201 Semiconductor device having inner lead arrangement with enhanced stability |
| 07/19/1994 | US5331200 Lead-on-chip inner lead bonding lead frame method and apparatus |
| 07/19/1994 | US5331195 Fuse construction of a semiconductor device |
| 07/19/1994 | US5331191 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same |
| 07/19/1994 | US5331172 Ionized metal cluster beam systems and methods |
| 07/19/1994 | US5331116 Structure and method for forming contact structures in integrated circuits |
| 07/19/1994 | US5331039 Water-based binder composition and its use for the production of coating or sealing compositions |
| 07/19/1994 | US5330934 Method of fabricating a semiconductor device having miniaturized contact electrode and wiring structure |
| 07/19/1994 | US5330919 Method for electrically testing a semiconductor die using a test apparatus having an independent conductive plane |
| 07/19/1994 | US5330851 Multilayer deposits |
| 07/19/1994 | US5330629 Aluminum metallization technique for semicondutor integrated circuits |
| 07/19/1994 | US5330616 Forming a carbon film on a substrate, masking and etching by electric power using an oxygen containing etchant |
| 07/19/1994 | US5330612 Method of fabricating nano-size thin wires and devices made of such thin wires |
| 07/19/1994 | US5330611 Wear resistant semiconductor |
| 07/19/1994 | US5330359 Socket for stacking integrated circuit chips |
| 07/19/1994 | US5329996 Porous layer heat exchanger |
| 07/19/1994 | US5329994 Jet impingement heat exchanger |
| 07/19/1994 | US5329993 Integral heat pipe, heat exchanger and clamping plate |
| 07/14/1994 | DE4300516A1 Power semiconductor module with insulating substrate |
| 07/13/1994 | EP0606118A2 Method of producing a plastic card |
| 07/13/1994 | EP0605987A2 Surface mountable integrated circuit package with integrated battery mount |
| 07/13/1994 | EP0605958A1 Solid state imaging device having high-sensitivity and low-noise characteristics by reducing electrostatic capacity of interconnection |
| 07/13/1994 | EP0605806A2 Process for producing crackstops on semiconductor devices and devices containing the crackstops |
| 07/13/1994 | EP0605677A1 Silicon or silica substrate with a modified surface and process for producing the same |
| 07/13/1994 | EP0605421A1 Low dielectric constant substrate and method of making |
| 07/13/1994 | EP0586558A4 Multichip interconnect module including superconductive materials |
| 07/13/1994 | EP0259490B1 A method of producing a semiconductor device |
| 07/13/1994 | CN1089396A Composite microwave circuit module assembly and its connection structure |
| 07/12/1994 | US5329426 Clip-on heat sink |
| 07/12/1994 | US5329423 Compressive bump-and-socket interconnection scheme for integrated circuits |
| 07/12/1994 | US5329419 Integrated circuit package having a cooling mechanism |
| 07/12/1994 | US5329237 Method and system for decoupling inoperative passive elements on a semiconductor chip |
| 07/12/1994 | US5329228 Test chip for semiconductor fault analysis |
| 07/12/1994 | US5329170 Balanced circuitry for reducing inductive noise of external chip interconnections |
| 07/12/1994 | US5329162 Semiconductor device having a conductor layer provided over a semiconductor substrate |
| 07/12/1994 | US5329161 Molybdenum boride barrier layers between aluminum and silicon at contact points in semiconductor devices |
| 07/12/1994 | US5329160 Semiconductor package with metalized portions |
| 07/12/1994 | US5329159 Semiconductor device employing an aluminum clad leadframe |
| 07/12/1994 | US5329158 Surface mountable semiconductor device having self loaded solder joints |
| 07/12/1994 | US5329157 Semiconductor packaging technique yielding increased inner lead count for a given die-receiving area |
| 07/12/1994 | US5329156 Feed bus for RF power transistors |
| 07/12/1994 | US5329154 Compound semiconductor integrated circuit having improved electrode bonding arrangements |
| 07/12/1994 | US5329153 Antifuse with nonstoichiometric tin layer and method of manufacture thereof |
| 07/12/1994 | US5329152 Ablative etch resistant coating for laser personalization of integrated circuits |
| 07/12/1994 | US5329068 Semiconductor device |
| 07/12/1994 | US5328870 Method for forming plastic molded package with heat sink for integrated circuit devices |
| 07/12/1994 | US5328865 Method for making cusp-free anti-fuse structures |
| 07/12/1994 | US5328751 Ceramic circuit board with a curved lead terminal |
| 07/12/1994 | US5328715 Process for making metallized vias in diamond substrates |
| 07/12/1994 | US5328552 Leadframe processing for molded package arrangements |
| 07/12/1994 | US5328078 Connection method and connection device for electrical connection of small portions |
| 07/07/1994 | WO1994015366A1 Semiconductor device |
| 07/07/1994 | WO1994015361A1 Fet chip with heat-extracting bridge |
| 07/07/1994 | WO1994015344A1 Water-based polymer thick film conductive ink |
| 07/07/1994 | WO1994015313A1 Contacting device for a chip card |
| 07/07/1994 | DE4400200A1 Semiconductor device with improved wiring structure |
| 07/07/1994 | CA2117460A1 Fet chip with heat-extracting bridge |
| 07/06/1994 | EP0605399A2 Multilayered wiring board and method for manufacturing the same |
| 07/06/1994 | EP0605205A1 Chemical vapor deposition apparatus |
| 07/06/1994 | EP0605090A1 Curing silica precursors by exposure to nitrous oxide |
| 07/05/1994 | US5327326 Large scale integrated package structure |
| 07/05/1994 | US5327325 Three-dimensional integrated circuit package |
| 07/05/1994 | US5327104 Piezoelectric oscillator formed in resin package containing, IC chip and piezoelectric oscillator element |
| 07/05/1994 | US5327013 Solder bumping of integrated circuit die |
| 07/05/1994 | US5327012 Semiconductor device having a double-layer interconnection structure |
| 07/05/1994 | US5327011 Semiconductor device with enhanced via or contact hole connection between an interconnect layer and a connecting region |
| 07/05/1994 | US5327010 IC card having adhesion-preventing sheets |
| 07/05/1994 | US5327009 Miniaturized integrated circuit package |
| 07/05/1994 | US5327008 Semiconductor device having universal low-stress die support and method for making the same |
| 07/05/1994 | US5327004 Solid-state imaging device with an electrically connected light shield layer |
| 07/05/1994 | US5326990 Semiconductor integrated circuit |
| 07/05/1994 | US5326932 Semiconductor package |
| 07/05/1994 | US5326709 Wafer testing process of a semiconductor device comprising a redundancy circuit |
| 07/05/1994 | US5326671 Triazine polymers |
| 07/05/1994 | US5326623 Multilayer circuits with ceramic substrates, patterns bonded with titanium and conductors |