| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/11/2013 | CN103296011A Semiconductor packaging body with electromagnetic interference shielding effect, and manufacture method thereof |
| 09/11/2013 | CN103296010A Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body |
| 09/11/2013 | CN103296009A Shielding structure with EBG, 3D packaging structure and preparing method of shielding structure with EBG and 3D packaging structure |
| 09/11/2013 | CN103296008A TSV or TGV pinboard, 3D packaging and manufacture method thereof |
| 09/11/2013 | CN103296007A Protective layer for conductive pad and forming method thereof |
| 09/11/2013 | CN103296006A Diffusion blocking layer and metal interconnection structure and manufacturing method thereof |
| 09/11/2013 | CN103296005A Redundancy interconnection structure for interconnection among silicon chips |
| 09/11/2013 | CN103296004A Anti-fuse element and manufacturing method thereof |
| 09/11/2013 | CN103296003A Capacitor structure and forming method thereof |
| 09/11/2013 | CN103296002A Electronic device and method for manufacturing same |
| 09/11/2013 | CN103296001A 半导体器件 Semiconductor devices |
| 09/11/2013 | CN103296000A Trench capacitor and method of forming the same |
| 09/11/2013 | CN103295999A Lead wire welding disc and integrated circuit |
| 09/11/2013 | CN103295998A Package with interposer frame and method of making the same |
| 09/11/2013 | CN103295997A Electrical connections for chip scale packaging |
| 09/11/2013 | CN103295996A Package substrate and manufacturing method thereof |
| 09/11/2013 | CN103295995A Semiconductor device and manufacturing method of the same |
| 09/11/2013 | CN103295994A Packaging structure, substrate structure and manufacturing method thereof |
| 09/11/2013 | CN103295993A Copper-platinum alloy wire for connecting in semiconductor apparatus |
| 09/11/2013 | CN103295992A 半导体装置 Semiconductor device |
| 09/11/2013 | CN103295991A Two-solder semiconductor chip, apparatus for self-aligning solder bumps in semiconductor assembly, and two-solder method |
| 09/11/2013 | CN103295990A Semiconductor device and method of manufacturing semiconductor device |
| 09/11/2013 | CN103295989A Flip chip package |
| 09/11/2013 | CN103295988A System-in-package with integrated socket |
| 09/11/2013 | CN103295987A 半导体存储卡 The semiconductor memory card |
| 09/11/2013 | CN103295986A Mechanisms of forming connectors for package on package |
| 09/11/2013 | CN103295985A Chip package and method for forming the same |
| 09/11/2013 | CN103295984A 冷却装置 Cooling device |
| 09/11/2013 | CN103295983A Radiator assembly of electronic component |
| 09/11/2013 | CN103295982A Coppered ceramic radiator for electronic packaging module |
| 09/11/2013 | CN103295981A Power conversion device |
| 09/11/2013 | CN103295980A Single tube IGBT encapsulation full-bridge module and encapsulation method thereof |
| 09/11/2013 | CN103295979A Package structure and method for manufacturing the same |
| 09/11/2013 | CN103295978A Semiconductor package and fabrication method thereof |
| 09/11/2013 | CN103295977A 半导体装置 Semiconductor device |
| 09/11/2013 | CN103295976A Chip arrangements and methods for forming a chip arrangement |
| 09/11/2013 | CN103295975A Resin seal material and manufacture method thereof |
| 09/11/2013 | CN103295974A High-power device with composite passive film |
| 09/11/2013 | CN103295973A Semiconductor module system with undercut connection |
| 09/11/2013 | CN103295972A 半导体模块 Semiconductor Modules |
| 09/11/2013 | CN103295971A Structure and manufacturing method for reducing stress of chip |
| 09/11/2013 | CN103295970A Array substrate and manufacturing method thereof and display device |
| 09/11/2013 | CN103295925A Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (ewlp-mlp) |
| 09/11/2013 | CN103295924A System-in-package type semiconductor device |
| 09/11/2013 | CN103295922A Manufacturing method of semiconductor device, and semiconductor device |
| 09/11/2013 | CN103295920A Noninsulated type power module and packaging process thereof |
| 09/11/2013 | CN103295916A Semiconductor device and method of manufacturing the same |
| 09/11/2013 | CN103295915A Manufacturing method of TSV adapter plate and TSV adapter plate |
| 09/11/2013 | CN103295543A Noncrystalline silicon gate driver |
| 09/11/2013 | CN103292677A Methods of extracting fin heights and overlap capacitance and structures for performing the same |
| 09/11/2013 | CN102479772B Test structure for monitoring source and drain polycrystalline silicon etching |
| 09/11/2013 | CN102478620B Method for characterizing radio frequency isolation in radio frequency process |
| 09/11/2013 | CN102474068B Semiconductor laser apparatus |
| 09/11/2013 | CN102456539B Preparation method for silicon germanium (SiGe) monitoring chip and monitoring method adopting chip |
| 09/11/2013 | CN102437134B Ultra-small packing body and production method thereof |
| 09/11/2013 | CN102403344B Parasitic PNP bipolar transistor in silicon germanium BiCMOS (bipolar complementary metal oxide semiconductor) process |
| 09/11/2013 | CN102403261B 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof |
| 09/11/2013 | CN102386130B Forming method of dual-stress liner semiconductor device |
| 09/11/2013 | CN102315198B Structure with alignment mark and manufacture method for stacking device |
| 09/11/2013 | CN102290388B Electronic control device, heat pipe radiator and manufacturing method of heat pipe radiator |
| 09/11/2013 | CN102214620B Semiconductor substrate having copper/diamond composite material and method of making same |
| 09/11/2013 | CN102210020B Technique for interconnecting integrated circuits |
| 09/11/2013 | CN102194794B Plasma damage detection structure as well as detection method and formation method thereof |
| 09/11/2013 | CN102130175B 垂直式晶体管结构 Vertical transistor structure |
| 09/11/2013 | CN102122637B Detection structure, detection method and method for forming detection structure |
| 09/11/2013 | CN102098872B Pad structure and manufacturing method thereof |
| 09/11/2013 | CN102097404B Wafer level chip scale packaging structure with low substrate resistance and manufacturing method thereof |
| 09/11/2013 | CN102074551B Semiconductor device packages and manufacturing method thereof |
| 09/11/2013 | CN102057483B Multilayer wiring board |
| 09/11/2013 | CN102054821B Packaging structure with internal shield and manufacturing method thereof |
| 09/11/2013 | CN102005418B Semiconductor device and method for manufacturing same |
| 09/11/2013 | CN101958314B Manufacture method and usage of folded system-in-package |
| 09/11/2013 | CN101887935B Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices |
| 09/11/2013 | CN101853818B Packaging substrate structure with recess and manufacturing method thereof |
| 09/11/2013 | CN101677096B 半导体器件 Semiconductor devices |
| 09/11/2013 | CN101572267B Organic electroluminescence device |
| 09/11/2013 | CN101438402B Method, apparatus and system for carbon nanotube wick structures |
| 09/11/2013 | CN101388370B Semiconductor device |
| 09/10/2013 | US8531839 Liquid cooled data center with alternating coolant supply lines |
| 09/10/2013 | US8531805 Gated diode having at least one lightly-doped drain (LDD) implant blocked and circuits and methods employing same |
| 09/10/2013 | US8531046 Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside |
| 09/10/2013 | US8531045 Component packaging and assembly |
| 09/10/2013 | US8531044 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition |
| 09/10/2013 | US8531043 Planar encapsulation and mold cavity package in package system |
| 09/10/2013 | US8531041 Semiconductor component having a plated through-hole and method for the production thereof |
| 09/10/2013 | US8531040 Controlled area solder bonding for dies |
| 09/10/2013 | US8531039 Micro pin grid array with pin motion isolation |
| 09/10/2013 | US8531038 Top layers of metal for high performance IC's |
| 09/10/2013 | US8531036 Via/contact and damascene structures |
| 09/10/2013 | US8531035 Interconnect barrier structure and method |
| 09/10/2013 | US8531034 Semiconductor package and package on package having the same |
| 09/10/2013 | US8531033 Contact plug structure, semiconductor device, and method for forming contact plug |
| 09/10/2013 | US8531032 Thermally enhanced structure for multi-chip device |
| 09/10/2013 | US8531030 IC device having electromigration resistant feed line structures |
| 09/10/2013 | US8531029 Electron beam induced deposition of interface to carbon nanotube |
| 09/10/2013 | US8531028 Method for manufacturing electronic component, and electronic component |
| 09/10/2013 | US8531027 Press-pack module with power overlay interconnection |
| 09/10/2013 | US8531026 Diamond particle mololayer heat spreaders and associated methods |
| 09/10/2013 | US8531025 Thermal paste containment for semiconductor modules |
| 09/10/2013 | US8531024 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace |