| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 08/10/1994 | EP0609918A2 A method for forming a bump electrode structure of a semiconductor device |
| 08/10/1994 | EP0609774A1 Printed circuit board or card for direct chip attachment and fabrication thereof |
| 08/10/1994 | EP0609635A1 Tungsten liner process for simultaneous formation of integral contact studs and interconnect lines |
| 08/10/1994 | EP0609528A1 Low inductance semiconductor package |
| 08/10/1994 | EP0609501A2 Aluminium based metallization for semiconductor device |
| 08/10/1994 | EP0609432A1 Power semiconductor packaging |
| 08/10/1994 | EP0609264A1 Universal interconnect matrix array |
| 08/10/1994 | CN1090672A A dynamic random access memory made by using silic on-on-insulator and a method for making the same |
| 08/09/1994 | US5337219 Electronic package |
| 08/09/1994 | US5337216 Multichip semiconductor small outline integrated circuit package structure |
| 08/09/1994 | US5337027 Microwave HDI phase shifter |
| 08/09/1994 | US5336931 Anchoring method for flow formed integrated circuit covers |
| 08/09/1994 | US5336930 Backside support for thin wafers |
| 08/09/1994 | US5336929 Semiconductor structure and method for fabricating the same |
| 08/09/1994 | US5336928 Hermetically sealed packaged electronic system |
| 08/09/1994 | US5336927 Lead frame having electrically insulating tapes adhered to the inner leads |
| 08/09/1994 | US5336925 High resolution, photosensitivity, stability |
| 08/09/1994 | US5336752 Reacting a phenol and the Diels-Alder product of a diene using an acid catalyst; deactivating and removing the catalyst by treating with a hydrotalcite |
| 08/09/1994 | US5336711 Polyesterurethane copolymers |
| 08/09/1994 | US5336650 Method of making tape carrier semiconductor device |
| 08/09/1994 | US5336649 Removable adhesives for attachment of semiconductor dies |
| 08/09/1994 | US5336640 Method of manufacturing a semiconductor device having an insulating layer composed of a BPSG film and a plasma-CVD silicon nitride film |
| 08/09/1994 | US5336639 Method for securing a semiconductor chip to a leadframe |
| 08/09/1994 | US5336628 Method for fabricating semiconductor memory device |
| 08/09/1994 | US5336564 Miniature keeper bar |
| 08/09/1994 | US5336547 Electronic components mounting/connecting package and its fabrication method |
| 08/09/1994 | US5336532 Low temperature process for the formation of ceramic coatings |
| 08/09/1994 | US5336456 Method of producing a scribelined layout structure for plastic encapsulated circuits |
| 08/09/1994 | US5336444 Fritless metallurgical paste containing copper and iron, nickel or cobalt dispersed in organic medium |
| 08/09/1994 | US5336364 Method of manufacturing insulation substrate for semiconductor device and metal pattern plate used therefor |
| 08/09/1994 | US5336301 Conductive copper paste |
| 08/09/1994 | US5335722 Cooling assembly for an integrated circuit |
| 08/09/1994 | US5335702 Cutting and forming device for lead frame for the semiconductor device |
| 08/09/1994 | CA2016755C Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays |
| 08/09/1994 | CA1331279C Magnesium titanate ceramic and dual dielectric substrate using same |
| 08/04/1994 | WO1994017649A1 Mounting assembly for power semiconductors |
| 08/04/1994 | WO1994017568A1 Self aligning surface mount electrical component |
| 08/04/1994 | WO1994017558A1 Monolithic passive component |
| 08/04/1994 | WO1994017553A1 Three dimensional integrated circuit and method of fabricating same |
| 08/04/1994 | WO1994017552A1 Plastic packages for microwave frequency applications |
| 08/04/1994 | WO1994017549A1 Off-chip conductor structure and fabrication method for large integrated microcircuits |
| 08/04/1994 | WO1994017548A1 Method for forming deep conductive feedthroughs and an interconnect layer that includes feedthroughs formed in accordance with the method |
| 08/04/1994 | WO1994017536A1 Via fill paste and method of using the same |
| 08/04/1994 | DE4303734A1 Chip carrier for surface mount devices |
| 08/04/1994 | CA2152359A1 Mounting assembly for power semiconductors |
| 08/03/1994 | EP0609074A2 Assembly structure of a flat type device |
| 08/03/1994 | EP0609062A1 Mass simultaneous sealing and electrical connection of electronic devices |
| 08/03/1994 | EP0608827A2 A piezoelectric device and a package |
| 08/03/1994 | EP0608628A2 Method of manufacturing semiconductor device having multilevel interconnection structure |
| 08/03/1994 | EP0608621A1 Circuit system, a composite material for use therein, and a method of making the material |
| 08/03/1994 | EP0608603A1 Improved copper-based metallizations for hybrid integrated circuits |
| 08/03/1994 | EP0608551A1 Method of forming ohmic contact by sputtering a TiN layer for LSI circuit and LSI circuit |
| 08/03/1994 | EP0608440A1 Semiconductor device having a plurality of chips having identical circuit arrangements sealed in package |
| 08/03/1994 | EP0608335A1 Structure for suppression of field inversion caused by charge build-up in the dielectric |
| 08/03/1994 | CN1090399A Photosensitive dielectric sheet composition and multilayer interconnect circuits |
| 08/02/1994 | US5334875 Stacked semiconductor memory device and semiconductor memory module containing the same |
| 08/02/1994 | US5334874 Electronic device package |
| 08/02/1994 | US5334873 Semiconductor packages with centrally located electrode pads |
| 08/02/1994 | US5334872 Encapsulated semiconductor device having a hanging heat spreading plate electrically insulated from the die pad |
| 08/02/1994 | US5334866 Integrated circuit device with functions selectable by changing interconnection pattern |
| 08/02/1994 | US5334858 Semiconductor device of tab structure, capable of ensuring ease of testing of same in final form |
| 08/02/1994 | US5334857 Semiconductor device with test-only contacts and method for making the same |
| 08/02/1994 | US5334829 Package for solid state imager with heating means to repair imager lattice defect |
| 08/02/1994 | US5334804 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 08/02/1994 | US5334803 Semiconductor device and method of producing the same |
| 08/02/1994 | US5334802 Method and configuration for reducing electrical noise in integrated circuit devices |
| 08/02/1994 | US5334674 Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions |
| 08/02/1994 | US5334555 Controlling flow rate of silane gas and level of high frequency electricity yields film which gives preferred ultra violet absorption and transmission rates |
| 08/02/1994 | US5334552 Forming wiring layer over dielectric film on substrate surface covering with silicon dioxide film, then forming fluorine-containing silicon dioxide and flattening films, dry etching of flattening film |
| 08/02/1994 | US5334543 Method of making reverse lightly doped drain (LDD) for buried N+ conductor |
| 08/02/1994 | US5334422 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 08/02/1994 | US5334346 Consisting of nickel, silicon, phosphorus, magnesium and copper; high tensile strength, ductility, heat resistance |
| 08/02/1994 | US5334306 Metallized paths on diamond surfaces |
| 08/02/1994 | US5334059 Solder-bearing lead |
| 08/02/1994 | US5333460 Compact and serviceable packaging of a self-contained cryocooler system |
| 08/02/1994 | CA1331245C Thermally conductive ceramic/polymer composites |
| 08/02/1994 | CA1331116C Silicone encapsulated devices |
| 07/28/1994 | DE4301865A1 Cooling box for electric component |
| 07/27/1994 | EP0608051A2 Resin-sealed semiconductor device |
| 07/27/1994 | EP0607846A1 One piece plastic part, especially injection molded part |
| 07/27/1994 | EP0607845A1 One piece insulating part, especially injection molded part |
| 07/27/1994 | EP0607746A2 compact and serviceable packagaging of a self-contined cryocooler system |
| 07/27/1994 | EP0607732A2 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
| 07/27/1994 | EP0607730A1 Method of direct transferring of electrically conductive elements into a substrate |
| 07/27/1994 | EP0607656A1 Device having thin film overlay for interconnecting bond pads of a semiconductor device to a lead frame or flex circuit and method of making same |
| 07/27/1994 | EP0607255A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion. |
| 07/27/1994 | EP0593666A4 Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting |
| 07/27/1994 | EP0493411B1 Method and apparatus for aligning mating form tools |
| 07/27/1994 | CN1090091A Semiconductor device and method for manufacturing the same |
| 07/26/1994 | US5332924 Semiconductor device and production method thereof |
| 07/26/1994 | US5332922 Multi-chip semiconductor package |
| 07/26/1994 | US5332921 Resin-seal type semiconductor device |
| 07/26/1994 | US5332913 Buried interconnect structure for semiconductor devices |
| 07/26/1994 | US5332868 Method and structure for suppressing stress-induced defects in integrated circuit conductive lines |
| 07/26/1994 | US5332864 Integrated circuit package having an interposer |
| 07/26/1994 | US5332770 Polycarbonyls, polythioethers |
| 07/26/1994 | US5332695 Method of manufacturing semi conductor device mounted on a heat sink |
| 07/26/1994 | US5332693 Method for manufacturing aluminum wired layer for interconnecting device to device in a semiconductor device |
| 07/26/1994 | US5332692 Method of manufacturing a semiconductor device having a polycide structure |
| 07/26/1994 | US5332629 Heat sink material |