Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1994
08/30/1994US5343360 Containing and cooling apparatus for an integrated circuit device having a thermal insulator
08/30/1994US5343358 Apparatus for cooling electronic devices
08/30/1994US5343076 Semiconductor device with an airtight space formed internally within a hollow package
08/30/1994US5343075 Composite stacked semiconductor device with contact plates
08/30/1994US5343074 Semiconductor device having voltage distribution ring(s) and method for making the same
08/30/1994US5343073 Lead frames having a chromium and zinc alloy coating
08/30/1994US5343072 Method and leadframe for making electronic components
08/30/1994US5343071 Semiconductor structures having dual surface via holes
08/30/1994US5342999 Apparatus for adapting semiconductor die pads and method therefor
08/30/1994US5342992 Pin grid array package with pin through plating
08/30/1994US5342807 Soft bond for semiconductor dies
08/30/1994US5342806 Method for fabricating a semiconductor device having a conductor structure with a plated layer
08/30/1994US5342674 For electronic computers
08/30/1994US5342213 IC socket
08/30/1994US5342206 Socket for direct electrical connection to an integrated circuit chip
08/30/1994US5341980 Method of fabricating electronic circuit device and apparatus for performing the same method
08/30/1994US5341979 Method of bonding a semiconductor substrate to a support substrate and structure therefore
08/30/1994US5341564 Method of fabricating integrated circuit module
08/25/1994DE4314913C1 Method for producing a semiconductor component having a contact structure for vertical contact-making with other semiconductor components
08/25/1994DE4314907C1 Method for producing semiconductor components making electrically conducting contact with one another vertically
08/25/1994DE4305147A1 Electrical apparatus having a device for the dissipation of heat from electrical components
08/24/1994EP0612106A1 Electronic device with reduced alpha particles soft error rate
08/24/1994EP0612105A1 Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure
08/24/1994EP0611975A1 Subassembly for optoelectronic devices
08/24/1994EP0611796A1 Halogen-free, highly filled epoxy resin casting compositions
08/24/1994EP0611739A2 Ceramic body
08/23/1994US5341267 Structures for electrostatic discharge protection of electrical and other components
08/23/1994US5341233 Liquid crystal module with tab assemblies connected through a flexible circuit board
08/23/1994US5341043 Series linear antifuse array
08/23/1994US5341027 Semiconductor chip having notches formed in peripheral edges thereof
08/23/1994US5341026 Semiconductor device having a titanium and a titanium compound multilayer interconnection structure
08/23/1994US5341025 IC package and LSI package using a lead frame formed of a copper-zirconium alloy
08/23/1994US5341024 Method of increasing the layout efficiency of dies on a wafer, and increasing the ratio of I/O area to active area per die
08/23/1994US5341016 Low resistance device element and interconnection structure
08/23/1994US5341015 Semiconductor device with reduced stress on gate electrode
08/23/1994US5341014 Semiconductor device and a method of fabricating the same
08/23/1994US5341012 CMOS device for use in connection with an active matrix panel
08/23/1994US5340851 Thermosetting resin compositions
08/23/1994US5340775 Depositing silicon chromium film on substrate, masking, etching, cleaning, depositing tungsten layer, then aluminum alloy, etching, annealing, depositing silicon dioxide passivation layer
08/23/1994US5340773 Forming aluminum film pattern thicker than metallic wiring to be formed on the substrate, using aluminum pattern as mask
08/23/1994US5340772 Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die
08/23/1994US5340771 Techniques for providing high I/O count connections to semiconductor dies
08/23/1994US5340767 Method of forming and selectively coupling a plurality of modules on an integrated circuit chip
08/23/1994US5340684 Photosensitive composition and resin-encapsulated semiconductor device
08/23/1994US5340296 Resilient interconnection bridge
08/23/1994US5339519 Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels
08/23/1994US5339518 Method for making a quad leadframe for a semiconductor device
08/18/1994WO1994018813A1 Housing for an electronic circuit
08/18/1994WO1994018707A1 Thermally conductive integrated circuit package with radio frequency shielding
08/18/1994WO1994018701A1 Stress-resistant semiconductor chip-circuit board interconnect
08/18/1994WO1994018700A1 Method of producing a radio frequency transponder with a molded environmentally sealed package
08/18/1994WO1994018698A1 METHOD FOR ELECTRICALLY CONDUCTIVE CONNECTING AND MECHANICAL FASTENING OF ICs ON CONDUCTING PATTERNS OF SUBSTRATES AND THE APPLICATION THEREOF
08/18/1994WO1994018433A1 Microminiature stirling cycle cryocoolers and engines
08/18/1994DE4304654A1 Method and arrangement for the temperature regulation of a component
08/18/1994CA2155208A1 Method of producing a radio frequency transponder with a molded environmentally sealed package
08/17/1994EP0611235A1 Heat exchanger for electronic components and electrical apparatus
08/17/1994EP0611198A1 Cooling device for electrical power components
08/17/1994EP0611129A2 Embedded substrate for integrated circuit modules
08/17/1994EP0611121A2 Systems for patterning dielectrics and structures therefrom
08/17/1994EP0611091A1 Process for making metallized vias in diamond substrates
08/17/1994EP0610971A1 Semiconductor device having an improved lead arrangement and method for manufacturing the same
08/17/1994EP0610969A2 Active matrix panel
08/17/1994EP0610949A2 Static semiconductor memory device having increased soft error immunity
08/17/1994EP0610927A2 SRAM memory structure and manufacturing method thereof
08/17/1994EP0610922A2 Semiconductor memory device
08/17/1994EP0610920A2 Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts
08/17/1994EP0610709A1 Process of manufacturing tri-dimensional circuit devices
08/17/1994EP0610631A1 Electrical connector
08/17/1994EP0610425A1 Process for preparing a polyimide film with a preselected value for cte.
08/17/1994EP0603198A4 Moisture relief for chip carriers.
08/17/1994CN1090946A 电子电路 Electronic circuit
08/16/1994USRE34696 Semiconductor device housing with electrodes in press contact with the opposite sides of chip
08/16/1994US5339462 Broadband mixer circuit and method
08/16/1994US5339260 Apparatus for checking size of a work
08/16/1994US5339216 Device and method for reducing thermal cycling in a semiconductor package
08/16/1994US5339215 Heat sink, method of manufacturing the same, and device of manufacturing the same
08/16/1994US5339212 Sidewall decoupling capacitor
08/16/1994US5338975 High density interconnect structure including a spacer structure and a gap
08/16/1994US5338974 RF power transistor package
08/16/1994US5338972 Lead frame with deformable buffer portions
08/16/1994US5338971 Electronic device structure with studs locating lead frame on backing plate
08/16/1994US5338970 Multi-layered integrated circuit package with improved high frequency performance
08/16/1994US5338967 Semiconductor device structure with plated heat sink and supporting substrate
08/16/1994US5338900 Structures for electrically conductive decals filled with inorganic insulator material
08/16/1994US5338899 Packaging of electronic devices
08/16/1994US5338897 Coaxial shield for a semiconductor device
08/16/1994US5338781 Flame retardant epoxy molding compound for encapsulating a semiconductor device
08/16/1994US5338726 Endothelin converting enzyme inhibitors
08/16/1994US5338704 Applying layer of conductive adhesive to lead portion of frame, solidifying, bonding second end of semiconductor wire to solidified adhesive
08/16/1994US5338702 Chromium as etch barrier
08/16/1994US5338625 Thin film battery and method for making same
08/16/1994US5338602 Article of manufacture
08/16/1994US5338424 Masks for applying dots on semiconductor wafers
08/16/1994US5338392 Forming integral conductive frame and wiring pattern, bonding to base surface, removing frame
08/16/1994US5337475 Filling the aperturs in self-supporting dielectric layer with a mixture of a glass-ceramic powder, a metal or alloy particle and binders, heating to burn off the binder, sintering to form electroconductive passageway
08/16/1994CA2007469C Secure integrated circuit chip with conductive shield
08/10/1994EP0646048A4 Electrically conductive compositions and methods for the preparation and use thereof.
08/10/1994EP0610149A1 Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering
08/10/1994EP0609977A1 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon
08/10/1994EP0609919A2 Active matrix panel