Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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08/30/1994 | US5343360 Containing and cooling apparatus for an integrated circuit device having a thermal insulator |
08/30/1994 | US5343358 Apparatus for cooling electronic devices |
08/30/1994 | US5343076 Semiconductor device with an airtight space formed internally within a hollow package |
08/30/1994 | US5343075 Composite stacked semiconductor device with contact plates |
08/30/1994 | US5343074 Semiconductor device having voltage distribution ring(s) and method for making the same |
08/30/1994 | US5343073 Lead frames having a chromium and zinc alloy coating |
08/30/1994 | US5343072 Method and leadframe for making electronic components |
08/30/1994 | US5343071 Semiconductor structures having dual surface via holes |
08/30/1994 | US5342999 Apparatus for adapting semiconductor die pads and method therefor |
08/30/1994 | US5342992 Pin grid array package with pin through plating |
08/30/1994 | US5342807 Soft bond for semiconductor dies |
08/30/1994 | US5342806 Method for fabricating a semiconductor device having a conductor structure with a plated layer |
08/30/1994 | US5342674 For electronic computers |
08/30/1994 | US5342213 IC socket |
08/30/1994 | US5342206 Socket for direct electrical connection to an integrated circuit chip |
08/30/1994 | US5341980 Method of fabricating electronic circuit device and apparatus for performing the same method |
08/30/1994 | US5341979 Method of bonding a semiconductor substrate to a support substrate and structure therefore |
08/30/1994 | US5341564 Method of fabricating integrated circuit module |
08/25/1994 | DE4314913C1 Method for producing a semiconductor component having a contact structure for vertical contact-making with other semiconductor components |
08/25/1994 | DE4314907C1 Method for producing semiconductor components making electrically conducting contact with one another vertically |
08/25/1994 | DE4305147A1 Electrical apparatus having a device for the dissipation of heat from electrical components |
08/24/1994 | EP0612106A1 Electronic device with reduced alpha particles soft error rate |
08/24/1994 | EP0612105A1 Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure |
08/24/1994 | EP0611975A1 Subassembly for optoelectronic devices |
08/24/1994 | EP0611796A1 Halogen-free, highly filled epoxy resin casting compositions |
08/24/1994 | EP0611739A2 Ceramic body |
08/23/1994 | US5341267 Structures for electrostatic discharge protection of electrical and other components |
08/23/1994 | US5341233 Liquid crystal module with tab assemblies connected through a flexible circuit board |
08/23/1994 | US5341043 Series linear antifuse array |
08/23/1994 | US5341027 Semiconductor chip having notches formed in peripheral edges thereof |
08/23/1994 | US5341026 Semiconductor device having a titanium and a titanium compound multilayer interconnection structure |
08/23/1994 | US5341025 IC package and LSI package using a lead frame formed of a copper-zirconium alloy |
08/23/1994 | US5341024 Method of increasing the layout efficiency of dies on a wafer, and increasing the ratio of I/O area to active area per die |
08/23/1994 | US5341016 Low resistance device element and interconnection structure |
08/23/1994 | US5341015 Semiconductor device with reduced stress on gate electrode |
08/23/1994 | US5341014 Semiconductor device and a method of fabricating the same |
08/23/1994 | US5341012 CMOS device for use in connection with an active matrix panel |
08/23/1994 | US5340851 Thermosetting resin compositions |
08/23/1994 | US5340775 Depositing silicon chromium film on substrate, masking, etching, cleaning, depositing tungsten layer, then aluminum alloy, etching, annealing, depositing silicon dioxide passivation layer |
08/23/1994 | US5340773 Forming aluminum film pattern thicker than metallic wiring to be formed on the substrate, using aluminum pattern as mask |
08/23/1994 | US5340772 Method of increasing the layout efficiency of dies on a wafer and increasing the ratio of I/O area to active area per die |
08/23/1994 | US5340771 Techniques for providing high I/O count connections to semiconductor dies |
08/23/1994 | US5340767 Method of forming and selectively coupling a plurality of modules on an integrated circuit chip |
08/23/1994 | US5340684 Photosensitive composition and resin-encapsulated semiconductor device |
08/23/1994 | US5340296 Resilient interconnection bridge |
08/23/1994 | US5339519 Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels |
08/23/1994 | US5339518 Method for making a quad leadframe for a semiconductor device |
08/18/1994 | WO1994018813A1 Housing for an electronic circuit |
08/18/1994 | WO1994018707A1 Thermally conductive integrated circuit package with radio frequency shielding |
08/18/1994 | WO1994018701A1 Stress-resistant semiconductor chip-circuit board interconnect |
08/18/1994 | WO1994018700A1 Method of producing a radio frequency transponder with a molded environmentally sealed package |
08/18/1994 | WO1994018698A1 METHOD FOR ELECTRICALLY CONDUCTIVE CONNECTING AND MECHANICAL FASTENING OF ICs ON CONDUCTING PATTERNS OF SUBSTRATES AND THE APPLICATION THEREOF |
08/18/1994 | WO1994018433A1 Microminiature stirling cycle cryocoolers and engines |
08/18/1994 | DE4304654A1 Method and arrangement for the temperature regulation of a component |
08/18/1994 | CA2155208A1 Method of producing a radio frequency transponder with a molded environmentally sealed package |
08/17/1994 | EP0611235A1 Heat exchanger for electronic components and electrical apparatus |
08/17/1994 | EP0611198A1 Cooling device for electrical power components |
08/17/1994 | EP0611129A2 Embedded substrate for integrated circuit modules |
08/17/1994 | EP0611121A2 Systems for patterning dielectrics and structures therefrom |
08/17/1994 | EP0611091A1 Process for making metallized vias in diamond substrates |
08/17/1994 | EP0610971A1 Semiconductor device having an improved lead arrangement and method for manufacturing the same |
08/17/1994 | EP0610969A2 Active matrix panel |
08/17/1994 | EP0610949A2 Static semiconductor memory device having increased soft error immunity |
08/17/1994 | EP0610927A2 SRAM memory structure and manufacturing method thereof |
08/17/1994 | EP0610922A2 Semiconductor memory device |
08/17/1994 | EP0610920A2 Method of preparing naphthol-modified phenolic resin and epoxy resin molding material for sealing electronic parts |
08/17/1994 | EP0610709A1 Process of manufacturing tri-dimensional circuit devices |
08/17/1994 | EP0610631A1 Electrical connector |
08/17/1994 | EP0610425A1 Process for preparing a polyimide film with a preselected value for cte. |
08/17/1994 | EP0603198A4 Moisture relief for chip carriers. |
08/17/1994 | CN1090946A 电子电路 Electronic circuit |
08/16/1994 | USRE34696 Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
08/16/1994 | US5339462 Broadband mixer circuit and method |
08/16/1994 | US5339260 Apparatus for checking size of a work |
08/16/1994 | US5339216 Device and method for reducing thermal cycling in a semiconductor package |
08/16/1994 | US5339215 Heat sink, method of manufacturing the same, and device of manufacturing the same |
08/16/1994 | US5339212 Sidewall decoupling capacitor |
08/16/1994 | US5338975 High density interconnect structure including a spacer structure and a gap |
08/16/1994 | US5338974 RF power transistor package |
08/16/1994 | US5338972 Lead frame with deformable buffer portions |
08/16/1994 | US5338971 Electronic device structure with studs locating lead frame on backing plate |
08/16/1994 | US5338970 Multi-layered integrated circuit package with improved high frequency performance |
08/16/1994 | US5338967 Semiconductor device structure with plated heat sink and supporting substrate |
08/16/1994 | US5338900 Structures for electrically conductive decals filled with inorganic insulator material |
08/16/1994 | US5338899 Packaging of electronic devices |
08/16/1994 | US5338897 Coaxial shield for a semiconductor device |
08/16/1994 | US5338781 Flame retardant epoxy molding compound for encapsulating a semiconductor device |
08/16/1994 | US5338726 Endothelin converting enzyme inhibitors |
08/16/1994 | US5338704 Applying layer of conductive adhesive to lead portion of frame, solidifying, bonding second end of semiconductor wire to solidified adhesive |
08/16/1994 | US5338702 Chromium as etch barrier |
08/16/1994 | US5338625 Thin film battery and method for making same |
08/16/1994 | US5338602 Article of manufacture |
08/16/1994 | US5338424 Masks for applying dots on semiconductor wafers |
08/16/1994 | US5338392 Forming integral conductive frame and wiring pattern, bonding to base surface, removing frame |
08/16/1994 | US5337475 Filling the aperturs in self-supporting dielectric layer with a mixture of a glass-ceramic powder, a metal or alloy particle and binders, heating to burn off the binder, sintering to form electroconductive passageway |
08/16/1994 | CA2007469C Secure integrated circuit chip with conductive shield |
08/10/1994 | EP0646048A4 Electrically conductive compositions and methods for the preparation and use thereof. |
08/10/1994 | EP0610149A1 Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering |
08/10/1994 | EP0609977A1 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon |
08/10/1994 | EP0609919A2 Active matrix panel |