| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/20/1994 | US5349174 Image sensor with transparent capacitive regions |
| 09/20/1994 | US5349155 Insulating material for wiring substrate and method of producing multi-layered wiring substrate |
| 09/20/1994 | US5349029 Epoxy resin compositions with improved heat resistance |
| 09/20/1994 | US5348901 Doping, oxiding, masking, siliciding |
| 09/20/1994 | US5348792 Multilayered wiring board with wiring configurations to reduce crosstalk |
| 09/20/1994 | US5348607 High density interconnect thermoplastic die attach material and solvent die attach processing |
| 09/20/1994 | US5348483 IC socket |
| 09/20/1994 | US5347710 Parallel processor and method of fabrication |
| 09/20/1994 | US5347709 Method of making lead frame |
| 09/20/1994 | CA2024123C Integrated circuit with balanced connecting circuit |
| 09/15/1994 | WO1994020987A1 Heat sink assembly for solid state devices |
| 09/15/1994 | WO1994020986A1 Device and method for reducing thermal cycling in a semiconductor package |
| 09/15/1994 | WO1994020985A1 Bonded wafer process incorporating diamond insulator |
| 09/15/1994 | WO1994020983A1 Bumpless bonding process having multilayer metallization |
| 09/15/1994 | WO1994020979A1 Device for indexing magazine compartments and wafer-shaped objects in the compartments |
| 09/15/1994 | WO1994020224A1 Flame retardant epoxy molding compound |
| 09/15/1994 | DE4408557A1 Power semiconductor arrangement |
| 09/15/1994 | DE4407548A1 Modular electrical connector |
| 09/15/1994 | DE4307182A1 Passivation layer for protecting function-supporting layers of components and method for its production |
| 09/14/1994 | EP0615290A2 Electronic structures having a joining geometry providing reduced capacitive loading |
| 09/14/1994 | EP0615289A2 Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board |
| 09/14/1994 | EP0615285A2 Attaching an electronic circuit to a substrate |
| 09/14/1994 | EP0615283A1 Interconnection structure of electronic parts comprising solder bumps with metal core members |
| 09/14/1994 | EP0615000A1 Coatings using filled hydrogen silsequioxane |
| 09/14/1994 | EP0614998A1 Diamond covered member and process for producing the same |
| 09/14/1994 | EP0614574A1 Printed circuit board including an integrated circuit protection system |
| 09/14/1994 | CN1092013A Method of splitting ceramic substrate and splitting device |
| 09/13/1994 | US5347429 Plastic-molded-type semiconductor device |
| 09/13/1994 | US5347426 Electronic device including a passive electronic component |
| 09/13/1994 | US5347160 Power semiconductor integrated circuit package |
| 09/13/1994 | US5347159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate |
| 09/13/1994 | US5347158 Semiconductor device having a particular terminal arrangement |
| 09/13/1994 | US5347145 Pad arrangement for a semiconductor device |
| 09/13/1994 | US5347100 Semiconductor device, process for the production thereof and apparatus for microwave plasma treatment |
| 09/13/1994 | US5347091 Multilayer circuit card connector |
| 09/13/1994 | US5347086 Coaxial die and substrate bumps |
| 09/13/1994 | US5346861 Semiconductor chip assemblies and methods of making same |
| 09/13/1994 | US5346860 Method for fabricating an interconnect structure in an integrated circuit |
| 09/13/1994 | US5346859 Method for fabricating a full press-pack type semiconductor device |
| 09/13/1994 | US5346858 Semiconductor non-corrosive metal overcoat |
| 09/13/1994 | US5346844 Method for fabricating semiconductor memory device |
| 09/13/1994 | US5346751 Electronic package using closed pore composites |
| 09/13/1994 | US5346748 Fluorescent display panel containing chip of integrated circuit with discrepancy markers to aid in lead bonding |
| 09/13/1994 | US5346743 Resin encapsulation type semiconductor device |
| 09/13/1994 | US5346633 Method for surface treatment of a body, surface treatment agent, surface treated body, surface treated members, and apparatus being furnished with same |
| 09/13/1994 | US5345668 Method for detecting MIS-orientation of semiconductor packages |
| 09/13/1994 | CA1331914C Micro-electronics devices and methods of manufacturing same |
| 09/11/1994 | CA2118785A1 Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board |
| 09/08/1994 | DE4407298A1 Light-emitting semiconductor device |
| 09/07/1994 | EP0614330A1 Cooler for heat generation device |
| 09/07/1994 | EP0614329A1 Method for hermically sealing an enclosure particularly with microelectronic circuits and enclosure thus obtained |
| 09/07/1994 | EP0614221A1 Integrated transmission line structure |
| 09/07/1994 | EP0614220A2 Multichip module |
| 09/07/1994 | EP0614219A1 Semiconductor chip packaging technology |
| 09/07/1994 | EP0614217A1 A process for forming an intermetallic layer and a device formed by the process |
| 09/07/1994 | EP0613610A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates. |
| 09/07/1994 | EP0613609A1 Dielectric vias within multilayer 3-dimensional structures/substrates |
| 09/07/1994 | EP0613608A1 Field control and stability enhancement in multilayer, 3-dimensional structures. |
| 09/07/1994 | EP0613590A1 Die mounting with uniaxial conductive adhesive. |
| 09/07/1994 | EP0613581A1 Direct-hardening sealing compounds |
| 09/07/1994 | EP0502884B1 Method and device for semiconductor fabrication fault analasys |
| 09/07/1994 | CN1091867A Inverter apparatus |
| 09/07/1994 | CN1025904C Supply pin rearrangement for an I.C. |
| 09/06/1994 | USH1358 Diamond/silver composites |
| 09/06/1994 | US5345394 Method for generating power slits |
| 09/06/1994 | US5345365 Interconnection system for high performance electronic hybrids |
| 09/06/1994 | US5345363 Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads |
| 09/06/1994 | US5345205 Compact high density interconnected microwave system |
| 09/06/1994 | US5345108 Semiconductor device having multi-layer electrode wiring |
| 09/06/1994 | US5345107 Cooling apparatus for electronic device |
| 09/06/1994 | US5345106 Electronic circuit component with heat sink mounted on a lead frame |
| 09/06/1994 | US5345105 Structure for shielding conductors |
| 09/06/1994 | US5345098 Master slice integrated circuit device |
| 09/06/1994 | US5345096 Turn-off high-power semiconductor component with low inductive housing |
| 09/06/1994 | US5345039 Film carrier |
| 09/06/1994 | US5345038 Multi-layer ceramic packages |
| 09/06/1994 | US5344899 Phenolic resin, method for producing the resin and epoxy resin composition for encapsulation |
| 09/06/1994 | US5344890 Room-temperature curable epoxy resin composition |
| 09/06/1994 | US5344795 Molding first ends of heat exchanger into plastic housing while second ends are removably sealed to support block |
| 09/06/1994 | US5344794 Method of making a semiconductor chip |
| 09/06/1994 | US5343940 Flexible heat transfer device |
| 09/06/1994 | US5343615 Semiconductor device and a process for making same having improved leads |
| 09/06/1994 | CA2030826C Composite circuit board with thick embedded conductor and method of manufacturing the same |
| 09/01/1994 | WO1994019827A1 Method for manufacturing anti-fuse structures |
| 09/01/1994 | WO1994019826A1 Filling of vias and contacts employing an aluminum-germanium alloy |
| 09/01/1994 | WO1994019594A1 High power dissipating packages with matched heatspreader heatsink assemblies |
| 09/01/1994 | WO1994016487A3 Self powered integrated circuit modules |
| 09/01/1994 | CA2153680A1 Filling of vias and contacts employing an aluminum-germanium alloy |
| 08/31/1994 | EP0613335A1 Socket apparatus for IC package testing |
| 08/31/1994 | EP0613333A1 Mounting/connecting method of an electronic component with patterning electrodes |
| 08/31/1994 | EP0613332A1 Interconnect for microchip carrier |
| 08/31/1994 | EP0613180A2 Semiconductor device having wiring electrodes |
| 08/31/1994 | EP0613179A1 Heat sink |
| 08/31/1994 | EP0613178A2 Integrated circuits protected from the environment by ceramic and barrier metal layers |
| 08/31/1994 | EP0613177A2 Method for fabricating tungsten local interconnections in high density CMOS circuits |
| 08/31/1994 | EP0613052A2 Photolithography test structures |
| 08/31/1994 | EP0612825A1 Use of highly fluorinated compositions as a heat-carrier |
| 08/31/1994 | EP0612439A1 High-voltage insulating disk |
| 08/31/1994 | CN1091552A Method for forming a contact plug of a semiconduct or device |
| 08/30/1994 | US5343362 Heat sink assembly |