| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 10/05/1994 | EP0618614A2 Heat-resistant adhesive for the fabrication of a semiconductor package |
| 10/05/1994 | EP0618613A1 Connections arrangement for semiconductor devices |
| 10/05/1994 | EP0618595A1 Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure |
| 10/05/1994 | EP0618548A1 Method and device for manufacturing a memory card |
| 10/05/1994 | EP0618308A1 Electroless gold plating bath |
| 10/05/1994 | EP0617842A1 Thermal transfer posts for high density multichip substrates and formation method |
| 10/05/1994 | EP0481998B1 Uv-cured adhesive for semiconductor-chip assembly |
| 10/05/1994 | EP0314707B1 Wire bonds and electrical contacts of an integrated circuit device |
| 10/05/1994 | CN2178942Y Structure improved diode |
| 10/04/1994 | US5353196 Method of assembling electrical packaging structure and liquid crystal display device having the same |
| 10/04/1994 | US5353195 Integral power and ground structure for multi-chip modules |
| 10/04/1994 | US5353194 Modular power circuit assembly |
| 10/04/1994 | US5353193 High power dissipating packages with matched heatspreader heatsink assemblies |
| 10/04/1994 | US5353138 Display device and support plate with transverse electrode arrangement |
| 10/04/1994 | US5352998 Microwave integrated circuit having a passive circuit substrate mounted on a semiconductor circuit substrate |
| 10/04/1994 | US5352991 Power amplifier assembly |
| 10/04/1994 | US5352927 Self-aligned contact studs for semiconductor structures |
| 10/04/1994 | US5352926 Semiconductor package |
| 10/04/1994 | US5352925 Semiconductor device with electromagnetic shield |
| 10/04/1994 | US5352852 Charge coupled device package with glass lid |
| 10/04/1994 | US5352851 Edge-mounted, surface-mount integrated circuit device |
| 10/04/1994 | US5352762 Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion |
| 10/04/1994 | US5352633 Semiconductor lead frame lead stabilization |
| 10/04/1994 | US5352632 Multichip packaged semiconductor device and method for manufacturing the same |
| 10/04/1994 | US5352630 Having resistivity against cracking and planarization without voids |
| 10/04/1994 | US5352629 Isostatic pressing and heating of a chip having a solder preform placed on a solder-wettable substrate window |
| 10/04/1994 | US5352621 Conducting layer for preventing capacitaive coupling of word line and bit line |
| 10/04/1994 | US5352482 Oxidizing surface of heat resistant, electroconductive substrate, applying dielectric paste containing crystallized glass, then applying electroconductive paste, heating and consolidation |
| 10/04/1994 | US5352326 Applying photoresist to metal coated substrate, imaging, developing, exposing to actinic radiation of selected wavelengths, etching to remove uncovered metal |
| 10/04/1994 | US5352318 Semiconductor device to substrate or circuit plate by face down bonding mode |
| 10/04/1994 | US5352131 IC socket |
| 10/04/1994 | US5352124 Socket for IC package |
| 10/04/1994 | US5351873 Device for assembling semiconductor chips between two heat sinks |
| 10/04/1994 | US5351748 Tubular pin fin heat sink for electronic components |
| 10/04/1994 | US5351499 Refrigerant composition and binary refrigeration system using it |
| 10/04/1994 | US5351393 Method of mounting a surface-mountable IC to a converter board |
| 10/02/1994 | CA2120452A1 Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure |
| 09/29/1994 | WO1994022282A1 Polymer plug for electronic packages |
| 09/29/1994 | WO1994022168A1 Ball grid array electronic package |
| 09/29/1994 | WO1994022028A1 Method and apparatus for lithographic artifact determination |
| 09/29/1994 | WO1994021833A1 Fine palladium alloy wire for semiconductor element wire bonding |
| 09/29/1994 | WO1994021744A1 Three-layer polyimidesiloxane adhesive tape |
| 09/29/1994 | WO1994021707A1 Naphthalene-ring resin, resin composition, and cured product thereof |
| 09/29/1994 | DE4401616A1 Ceramic multilayer wiring board |
| 09/28/1994 | EP0617467A2 High frequency module and method of producing the same |
| 09/28/1994 | EP0617466A2 Improved multi-layer packaging |
| 09/28/1994 | EP0617465A1 A semiconductor device and package |
| 09/28/1994 | EP0617464A2 Semiconductor device having X-shaped die support member and method for making the same |
| 09/28/1994 | EP0617463A1 Process of making a contact hole |
| 09/28/1994 | EP0617460A1 Borosilicate electronic coatings |
| 09/28/1994 | EP0617332A1 Manufacturing process for a lead-frame forming material |
| 09/28/1994 | EP0617309A1 Active matrix panel |
| 09/28/1994 | EP0616724A1 Pyroelectric sensor and production method therefor. |
| 09/28/1994 | CN1092906A Nested transistor electrodes and its making technology |
| 09/27/1994 | US5351001 Microwave component test method and apparatus |
| 09/27/1994 | US5350948 Semiconductor device |
| 09/27/1994 | US5350947 Film carrier semiconductor device |
| 09/27/1994 | US5350946 Semiconductor device with correct case placement feature |
| 09/27/1994 | US5350943 Semiconductor assembly, in particular a remote control reception module |
| 09/27/1994 | US5350886 Mounting substrate |
| 09/27/1994 | US5350715 Chip identification scheme |
| 09/27/1994 | US5350713 Design and sealing method for semiconductor packages |
| 09/27/1994 | US5350712 Integrated circuits |
| 09/27/1994 | US5350711 Method of fabricating high temperature refractory metal nitride contact and interconnect structure |
| 09/27/1994 | US5350710 Device for preventing antenna effect on circuit |
| 09/27/1994 | US5350662 Maskless process for forming refractory metal layer in via holes of GaAs chips |
| 09/27/1994 | US5350487 Treatment with base, rinsing and recovering |
| 09/27/1994 | US5349831 Apparatus for cooling heat generating members |
| 09/27/1994 | US5349823 Integrated refrigerated computer module |
| 09/27/1994 | CA2011647C Rectifier structure |
| 09/27/1994 | CA1332176C Electronic package comprising aluminum nitride and aluminum nitride-borosilicate glass composite |
| 09/21/1994 | EP0616430A2 Buffer circuit |
| 09/21/1994 | EP0616367A1 Lead structure and lead connecting method for semiconductor device |
| 09/21/1994 | EP0616366A2 Heat sink and mounting structure for heat sink |
| 09/21/1994 | EP0616365A1 MOS-controlled power semiconductor device |
| 09/21/1994 | EP0616364A1 Apparatus for and method of manufacturing semiconductor wafer |
| 09/21/1994 | EP0616238A1 Package for a semiconductor device |
| 09/21/1994 | EP0616052A1 A method and an apparatus for selectively electroplating apertured metal or metallized products |
| 09/21/1994 | EP0615964A2 Aluminium nitride ceramics and method for preparing the same |
| 09/21/1994 | EP0588944A4 An improved miniature transponder device |
| 09/21/1994 | EP0409918B1 Liquid cooled multi-chip integrated circuit module |
| 09/21/1994 | EP0407620B1 Electric insulation type heat pipe cooler |
| 09/21/1994 | EP0396641B1 Acceleration-resistant packaging for integrated circuits and process for manufacturing it |
| 09/21/1994 | EP0335919B1 System and method for securing integrated circuits from unauthorized copying |
| 09/21/1994 | EP0319575B1 Fabrication of interlayer conductive paths in integrated circuits |
| 09/21/1994 | CN1092448A Three-layer polyimidesiloxane adhesive tape |
| 09/20/1994 | US5349542 Method for sizing widths of power busses in integrated circuits |
| 09/20/1994 | US5349501 Electronic device adaptive to mounting on a printed wiring board |
| 09/20/1994 | US5349500 Direct application of unpackaged integrated circuit to flexible printed circuit |
| 09/20/1994 | US5349499 Immersion cooling coolant and electronic device using this coolant |
| 09/20/1994 | US5349498 Integral extended surface cooling of power modules |
| 09/20/1994 | US5349495 System for securing and electrically connecting a semiconductor chip to a substrate |
| 09/20/1994 | US5349317 High frequency signal transmission tape |
| 09/20/1994 | US5349240 Semiconductor device package having a sealing silicone gel with spherical fillers |
| 09/20/1994 | US5349239 Vertical type construction transistor |
| 09/20/1994 | US5349238 Three layered, etching |
| 09/20/1994 | US5349237 Integrated circuit package including a heat pipe |
| 09/20/1994 | US5349235 High density vertically mounted semiconductor package |
| 09/20/1994 | US5349233 Lead frame and semiconductor module using the same having first and second islands and three distinct pluralities of leads and semiconductor module using the lead frame |
| 09/20/1994 | US5349229 Local interconnect for integrated circuits |