Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1994
10/25/1994US5358598 Etching ti reduce thickness
10/25/1994US5358032 LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted
10/25/1994US5358017 Method, system and apparatus for forming leads for semiconductors packages
10/25/1994US5357674 Method of manufacturing a printed circuit board
10/25/1994US5357673 Semiconductor device encapsulation method
10/25/1994US5357672 Method and system for fabricating IC packages from laminated boards and heat spreader
10/25/1994EP0678232A4 Plated compliant lead.
10/25/1994CA1332695C Method of making an article comprising a heteroepitaxial structure, and article produced thereby
10/20/1994DE4411973A1 KGD arrangement
10/20/1994DE4411210A1 Arrangement having a substrate and at least one chip
10/20/1994DE4311839A1 Microcooling device for an electronic component
10/19/1994EP0620599A1 Lightly-doped drain MOSFET with improved breakdown characteristics
10/19/1994EP0620596A1 Monolithic diode grid
10/19/1994EP0620595A1 Semiconductor integrated circuit device having parallel signal wirings variable in either width or interval
10/19/1994EP0620594A2 Semiconductor device having mounting terminals
10/19/1994EP0620593A1 Semiconductor device with smaller package
10/19/1994EP0620592A1 Integrated circuit package
10/19/1994EP0620591A1 Silicone over-mould of a flip-chip device
10/19/1994EP0620590A1 Leadframe processing for molded package arrangements
10/19/1994EP0620589A1 Leadframe structure for molded package arrangements
10/19/1994EP0620073A1 Dispensing system for electrically conductive liquid
10/19/1994EP0619935A1 Multi-layer circuit construction methods and structures with customization features and components for use therein
10/19/1994EP0619919A1 Multichip module cooling system
10/19/1994CN1093861A Base board of circuit
10/18/1994US5357404 EMI shield, and assembly using same
10/18/1994US5357403 Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns
10/18/1994US5357401 Electronic circuit arrangement
10/18/1994US5357400 Tape automated bonding semiconductor device and production process thereof
10/18/1994US5357397 Electric field emitter device for electrostatic discharge protection of integrated circuits
10/18/1994US5357140 Semiconductor device capable of laminating a plurality of wiring layers which are more than four layers
10/18/1994US5357139 Plastic encapsulated semiconductor device and lead frame
10/18/1994US5357138 Coaxial wiring pattern structure in a multilayered wiring board
10/18/1994US5357136 Semiconductor device with anchored interconnection layer
10/18/1994US5357129 Solid state imaging device having high-sensitivity and low-noise characteristics by reducing electrostatic capacity of interconnection
10/18/1994US5357122 Three-dimensional optical-electronic integrated circuit device with raised sections
10/18/1994US5357077 Apparatus for marking semiconductor devices
10/18/1994US5357005 Reactive surface functionalization
10/18/1994US5356838 Stacked semiconductor chips
10/18/1994US5356836 Aluminum plug process
10/18/1994US5356835 Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer
10/18/1994US5356661 Heat transfer insulated parts and manufacturing method thereof
10/18/1994US5356659 Forming aluminum layer over dielectric, followed by vapor depositing of a metal on aluminum
10/18/1994US5356526 Including a titanium/palladium alloy layer
10/18/1994US5356513 Polishstop planarization method and structure
10/18/1994US5355942 Cooling multi-chip modules using embedded heat pipes
10/18/1994CA1332518C Duct testing
10/13/1994WO1994023475A1 Spring biased tapered contact element
10/13/1994WO1994023454A1 A pedestal lead frame for supporting a semiconductor chip
10/13/1994WO1994023452A1 Plastic encapsulated integrated circuit package with fully slotted dambar
10/13/1994WO1994023451A1 Semiconductor chip assemblies and components with pressure contact
10/13/1994WO1994023450A1 Liquid metal heat conducting member and integrated circuit package incorporating same
10/13/1994WO1994023449A1 Heat sink apparatus
10/13/1994WO1994023448A1 Package for semiconductor chip
10/13/1994WO1994023447A1 Warp-resistent ultra-thin integrated circuit package fabrication method
10/13/1994CA2158255A1 Liquid metal heat conducting member and integrated circuit package incorporating same
10/13/1994CA2158253A1 Spring biased tapered contact element
10/13/1994CA2135894A1 Heat sink apparatus
10/12/1994EP0619607A2 Method for improved adhesion of polymeric adhesive and encapsulating material
10/12/1994EP0619606A2 Electronic equipment
10/12/1994EP0619605A1 Combination of an electronic semiconductor device and a heat sink
10/12/1994EP0619604A2 Heat sink for a semiconductor device
10/12/1994EP0619282A2 Diamond/carbon/carbon composite useful as an integral dielectric heat sink and method for making same
10/12/1994EP0619161A2 Improved organic vehicle and electronic paste
10/12/1994EP0613590A4 Die mounting with uniaxial conductive adhesive.
10/12/1994CN2179635Y Pressure connecting 3-phase semi-bridge rotary commutating module
10/11/1994US5355283 Ball grid array with via interconnection
10/11/1994US5355281 Electrical device having a bonded ceramic-copper heat transfer medium
10/11/1994US5355105 Multi-layer flexible printed circuit and method of making same
10/11/1994US5355102 Electronic system
10/11/1994US5355023 Semiconductor device having conducting layers connected through contact holes
10/11/1994US5355020 Semiconductor device having a multi-layer metal contact
10/11/1994US5355019 Devices with tape automated bonding
10/11/1994US5355018 Stress-free semiconductor leadframe
10/11/1994US5355017 Semiconductor package
10/11/1994US5355016 Shielded EPROM package
10/11/1994US5355010 Semiconductor device with a dual type polycide layer comprising a uniformly p-type doped silicide
10/11/1994US5355008 Diamond shaped gate mesh for cellular MOS transistor array
10/11/1994US5355004 Semiconductor integrated circuit device having wiring for clock signal supply
10/11/1994US5354955 Direct jump engineering change system
10/11/1994US5354717 Method for making a substrate structure with improved heat dissipation
10/11/1994US5354711 Process for etching and depositing integrated circuit interconnections and contacts
10/11/1994US5354704 Forming static random access memory cell by ion implanting first dopant to form buried local interconnection lines below surface of semiconductor substrate, forming centrally located polysilicon word line with symmetrical pull down transistors
10/11/1994US5354695 Membrane dielectric isolation IC fabrication
10/11/1994US5354599 Dielectric vias within multi-layer 3-dimensional structures/substrates
10/11/1994US5354422 Nickel or nickel-base alloy plating layers on both sides of an iron-based or copper-based material; single layer thickness; photoresist layer; etching
10/11/1994US5354387 Void-free surface resistant to loss of boron in subsequent etching steps
10/11/1994US5354206 Spring balanced socket
10/11/1994US5353867 Heat exchanger, a method of manufacturing same, and applications
10/11/1994US5353863 Pentium CPU cooling device
10/11/1994US5353499 Method of manufacturing a multilayered wiring board
10/11/1994US5353498 Method for fabricating an integrated circuit module
10/06/1994DE4408236A1 Radiation-hardenable metal naphthenate
10/06/1994DE4312927A1 Verfahren und Vorrichtung zur Dissipation von Wärmeenergie Method and apparatus for dissipation of thermal energy
10/06/1994DE4302816A1 Arrangement for cooling pressure-contactable power wafer-type semiconductors
10/05/1994EP0618762A1 Circuit arrangement
10/05/1994EP0618620A1 Semiconductor fuse structures
10/05/1994EP0618619A1 Ultra-thick thick films for thermal management and current-carrying capabilities in hybrid circuits
10/05/1994EP0618618A1 Apparatus for containing and cooling an integrated circuit device
10/05/1994EP0618617A2 Process for metallized vias in polyimide
10/05/1994EP0618615A1 Method of defect determination and defect engineering on product wafers of advanced submicron technologies