Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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10/25/1994 | US5358598 Etching ti reduce thickness |
10/25/1994 | US5358032 LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted |
10/25/1994 | US5358017 Method, system and apparatus for forming leads for semiconductors packages |
10/25/1994 | US5357674 Method of manufacturing a printed circuit board |
10/25/1994 | US5357673 Semiconductor device encapsulation method |
10/25/1994 | US5357672 Method and system for fabricating IC packages from laminated boards and heat spreader |
10/25/1994 | EP0678232A4 Plated compliant lead. |
10/25/1994 | CA1332695C Method of making an article comprising a heteroepitaxial structure, and article produced thereby |
10/20/1994 | DE4411973A1 KGD arrangement |
10/20/1994 | DE4411210A1 Arrangement having a substrate and at least one chip |
10/20/1994 | DE4311839A1 Microcooling device for an electronic component |
10/19/1994 | EP0620599A1 Lightly-doped drain MOSFET with improved breakdown characteristics |
10/19/1994 | EP0620596A1 Monolithic diode grid |
10/19/1994 | EP0620595A1 Semiconductor integrated circuit device having parallel signal wirings variable in either width or interval |
10/19/1994 | EP0620594A2 Semiconductor device having mounting terminals |
10/19/1994 | EP0620593A1 Semiconductor device with smaller package |
10/19/1994 | EP0620592A1 Integrated circuit package |
10/19/1994 | EP0620591A1 Silicone over-mould of a flip-chip device |
10/19/1994 | EP0620590A1 Leadframe processing for molded package arrangements |
10/19/1994 | EP0620589A1 Leadframe structure for molded package arrangements |
10/19/1994 | EP0620073A1 Dispensing system for electrically conductive liquid |
10/19/1994 | EP0619935A1 Multi-layer circuit construction methods and structures with customization features and components for use therein |
10/19/1994 | EP0619919A1 Multichip module cooling system |
10/19/1994 | CN1093861A Base board of circuit |
10/18/1994 | US5357404 EMI shield, and assembly using same |
10/18/1994 | US5357403 Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns |
10/18/1994 | US5357401 Electronic circuit arrangement |
10/18/1994 | US5357400 Tape automated bonding semiconductor device and production process thereof |
10/18/1994 | US5357397 Electric field emitter device for electrostatic discharge protection of integrated circuits |
10/18/1994 | US5357140 Semiconductor device capable of laminating a plurality of wiring layers which are more than four layers |
10/18/1994 | US5357139 Plastic encapsulated semiconductor device and lead frame |
10/18/1994 | US5357138 Coaxial wiring pattern structure in a multilayered wiring board |
10/18/1994 | US5357136 Semiconductor device with anchored interconnection layer |
10/18/1994 | US5357129 Solid state imaging device having high-sensitivity and low-noise characteristics by reducing electrostatic capacity of interconnection |
10/18/1994 | US5357122 Three-dimensional optical-electronic integrated circuit device with raised sections |
10/18/1994 | US5357077 Apparatus for marking semiconductor devices |
10/18/1994 | US5357005 Reactive surface functionalization |
10/18/1994 | US5356838 Stacked semiconductor chips |
10/18/1994 | US5356836 Aluminum plug process |
10/18/1994 | US5356835 Method for forming low resistance and low defect density tungsten contacts to silicon semiconductor wafer |
10/18/1994 | US5356661 Heat transfer insulated parts and manufacturing method thereof |
10/18/1994 | US5356659 Forming aluminum layer over dielectric, followed by vapor depositing of a metal on aluminum |
10/18/1994 | US5356526 Including a titanium/palladium alloy layer |
10/18/1994 | US5356513 Polishstop planarization method and structure |
10/18/1994 | US5355942 Cooling multi-chip modules using embedded heat pipes |
10/18/1994 | CA1332518C Duct testing |
10/13/1994 | WO1994023475A1 Spring biased tapered contact element |
10/13/1994 | WO1994023454A1 A pedestal lead frame for supporting a semiconductor chip |
10/13/1994 | WO1994023452A1 Plastic encapsulated integrated circuit package with fully slotted dambar |
10/13/1994 | WO1994023451A1 Semiconductor chip assemblies and components with pressure contact |
10/13/1994 | WO1994023450A1 Liquid metal heat conducting member and integrated circuit package incorporating same |
10/13/1994 | WO1994023449A1 Heat sink apparatus |
10/13/1994 | WO1994023448A1 Package for semiconductor chip |
10/13/1994 | WO1994023447A1 Warp-resistent ultra-thin integrated circuit package fabrication method |
10/13/1994 | CA2158255A1 Liquid metal heat conducting member and integrated circuit package incorporating same |
10/13/1994 | CA2158253A1 Spring biased tapered contact element |
10/13/1994 | CA2135894A1 Heat sink apparatus |
10/12/1994 | EP0619607A2 Method for improved adhesion of polymeric adhesive and encapsulating material |
10/12/1994 | EP0619606A2 Electronic equipment |
10/12/1994 | EP0619605A1 Combination of an electronic semiconductor device and a heat sink |
10/12/1994 | EP0619604A2 Heat sink for a semiconductor device |
10/12/1994 | EP0619282A2 Diamond/carbon/carbon composite useful as an integral dielectric heat sink and method for making same |
10/12/1994 | EP0619161A2 Improved organic vehicle and electronic paste |
10/12/1994 | EP0613590A4 Die mounting with uniaxial conductive adhesive. |
10/12/1994 | CN2179635Y Pressure connecting 3-phase semi-bridge rotary commutating module |
10/11/1994 | US5355283 Ball grid array with via interconnection |
10/11/1994 | US5355281 Electrical device having a bonded ceramic-copper heat transfer medium |
10/11/1994 | US5355105 Multi-layer flexible printed circuit and method of making same |
10/11/1994 | US5355102 Electronic system |
10/11/1994 | US5355023 Semiconductor device having conducting layers connected through contact holes |
10/11/1994 | US5355020 Semiconductor device having a multi-layer metal contact |
10/11/1994 | US5355019 Devices with tape automated bonding |
10/11/1994 | US5355018 Stress-free semiconductor leadframe |
10/11/1994 | US5355017 Semiconductor package |
10/11/1994 | US5355016 Shielded EPROM package |
10/11/1994 | US5355010 Semiconductor device with a dual type polycide layer comprising a uniformly p-type doped silicide |
10/11/1994 | US5355008 Diamond shaped gate mesh for cellular MOS transistor array |
10/11/1994 | US5355004 Semiconductor integrated circuit device having wiring for clock signal supply |
10/11/1994 | US5354955 Direct jump engineering change system |
10/11/1994 | US5354717 Method for making a substrate structure with improved heat dissipation |
10/11/1994 | US5354711 Process for etching and depositing integrated circuit interconnections and contacts |
10/11/1994 | US5354704 Forming static random access memory cell by ion implanting first dopant to form buried local interconnection lines below surface of semiconductor substrate, forming centrally located polysilicon word line with symmetrical pull down transistors |
10/11/1994 | US5354695 Membrane dielectric isolation IC fabrication |
10/11/1994 | US5354599 Dielectric vias within multi-layer 3-dimensional structures/substrates |
10/11/1994 | US5354422 Nickel or nickel-base alloy plating layers on both sides of an iron-based or copper-based material; single layer thickness; photoresist layer; etching |
10/11/1994 | US5354387 Void-free surface resistant to loss of boron in subsequent etching steps |
10/11/1994 | US5354206 Spring balanced socket |
10/11/1994 | US5353867 Heat exchanger, a method of manufacturing same, and applications |
10/11/1994 | US5353863 Pentium CPU cooling device |
10/11/1994 | US5353499 Method of manufacturing a multilayered wiring board |
10/11/1994 | US5353498 Method for fabricating an integrated circuit module |
10/06/1994 | DE4408236A1 Radiation-hardenable metal naphthenate |
10/06/1994 | DE4312927A1 Verfahren und Vorrichtung zur Dissipation von Wärmeenergie Method and apparatus for dissipation of thermal energy |
10/06/1994 | DE4302816A1 Arrangement for cooling pressure-contactable power wafer-type semiconductors |
10/05/1994 | EP0618762A1 Circuit arrangement |
10/05/1994 | EP0618620A1 Semiconductor fuse structures |
10/05/1994 | EP0618619A1 Ultra-thick thick films for thermal management and current-carrying capabilities in hybrid circuits |
10/05/1994 | EP0618618A1 Apparatus for containing and cooling an integrated circuit device |
10/05/1994 | EP0618617A2 Process for metallized vias in polyimide |
10/05/1994 | EP0618615A1 Method of defect determination and defect engineering on product wafers of advanced submicron technologies |