H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1994
11/09/1994	EP0469920B1 Method of manufacturing insulated substrate for semiconductor devices and patterned metal plate used therefor
11/09/1994	EP0340466B1 Semiconductor device comprising leads
11/09/1994	CN1094849A Method for manufacturing semiconductor device with plastic package
11/09/1994	CN1094847A Semiconductor device and method of fabricating the same
11/08/1994	US5363280 Printed circuit board or card thermal mass design
11/08/1994	US5363279 Semiconductor package for a semiconductor chip having centrally located bottom bond pads
11/08/1994	US5363278 Surface of ceramic substrate oxidized prior to bonding
11/08/1994	US5363275 Modular component computer system
11/08/1994	US5362986 Vertical chip mount memory package with packaging substrate and memory chip pairs
11/08/1994	US5362984 Semiconductor device with jumping wire
11/08/1994	US5362976 High frequency semiconductor device having optical guide package structure
11/08/1994	US5362926 Circuit substrate for mounting a semiconductor element
11/08/1994	US5362775 Seals for semiconductors or moldings
11/08/1994	US5362686 Vapor deposition of dielectric film using pressurized gaseous mixture containing organic silane and nitriding gas yields strong moisture resistant coating
11/08/1994	US5362680 Technique for enhancing adhesion capability of heat spreaders in molded packages
11/08/1994	US5362679 Plastic package with solder grid array
11/08/1994	US5362676 Depositing nonconductive film(which can be converted to conductor by heating or applying voltage) on dielectric as part of connector
11/08/1994	US5362656 Method of making an electronic assembly having a flexible circuit wrapped around a substrate
11/08/1994	US5362551 Crystallized glass with through-hole filled with copper; high density circuit boards
11/08/1994	US5362550 Thin film circuit board and its manufacturing process
11/08/1994	US5362547 Film carrier
11/08/1994	US5362370 Method for the electrolytic removal of plastic mold flash or bleed from the metal surfaces of semiconductor devices or similar electronic components
11/08/1994	US5361970 Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
11/08/1994	US5361491 Process for producing an IC-mounting flexible circuit board
11/08/1994	US5361490 Method for making tape automated bonding (TAB) semiconductor device
11/08/1994	US5361486 System of machining devices
11/05/1994	CA2121960A1 Method and apparatus for providing electrical access to devices in a multi-chip module
11/03/1994	DE4414729A1 Material for a line frame and line frame for semiconductor components
11/03/1994	DE4411858A1 Conductive contact structure for two conductors
11/02/1994	EP0622983A1 Electronic component heat sink attachment using a low force spring
11/02/1994	EP0622846A1 Fabrication and laser deletion of microfuses
11/02/1994	EP0622845A2 Apparatus and method for tape automated bonding beam lead insulation
11/02/1994	EP0622833A1 Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same
11/02/1994	EP0622760A1 External storage device and external storage device unit and method of producing external storage device
11/02/1994	EP0622717A1 Temperature stable circuit for recycling discharge current during the driving of an inductive load
11/02/1994	EP0622405A1 Flame retardant silicone compositions
11/02/1994	EP0622125A1 Fluid treatment apparatus
11/02/1994	EP0621982A1 Lead frame and semiconductor device using same
11/02/1994	EP0621981A1 Lead frames with improved adhesion
11/02/1994	EP0621907A1 Method for cleaning articles
11/02/1994	EP0549626B1 Moisture-setting alkoxysilane-terminated polyurethanes
11/02/1994	CN2181754Y Plane type surge-proof silicon device
11/01/1994	US5361272 Semiconductor architecture and application thereof
11/01/1994	US5361189 External lead terminal adaptor and semiconductor device
11/01/1994	US5361188 Cooling apparatus of electronic equipment
11/01/1994	US5360996 Formed over silicon surface to protect against spiking by aluminum layer subsequently formed over barrier
11/01/1994	US5360995 Barrier layer covered by aluminum lead, intermetallic layer, antireflection capping layer, insulator with opening, barrier layer, aluminum lead, intermetallic layer, antireflection capping layer and having conductive plug in opening
11/01/1994	US5360994 Preventing reaction between silicon and aluminum
11/01/1994	US5360993 Cooling unit capable of speedily cooling an integrated circuit chip
11/01/1994	US5360992 Two piece assembly for the selection of pinouts and bond options on a semiconductor device
11/01/1994	US5360991 Integrated circuit devices with solderable lead frame
11/01/1994	US5360988 Semiconductor integrated circuit device and methods for production thereof
11/01/1994	US5360985 Press-contact type semiconductor device
11/01/1994	US5360948 Via programming for multichip modules
11/01/1994	US5360946 Flex tape protective coating
11/01/1994	US5360942 Multi-chip electronic package module utilizing an adhesive sheet
11/01/1994	US5360837 Semiconductor device-encapsulating epoxy resin composition
11/01/1994	US5360767 Method for assigning pins to connection points
11/01/1994	US5360766 Semiconductors
11/01/1994	US5360747 Method of reducing dice testing with on-chip identification
11/01/1994	US5360348 Integrated circuit device test socket
11/01/1994	US5359768 Method for mounting very small integrated circuit package on PCB
11/01/1994	CA2029118C Hearth arrangement for melting furnace
10/1994
10/27/1994	WO1994024838A1 Contacting of electrically conducting films in a film system
10/27/1994	WO1994024704A1 Area bonding conductive adhesive preforms
10/27/1994	WO1994024703A1 Electronic apparatus with improved thermal expansion match
10/27/1994	WO1994024702A1 Metal cover for ceramic package and method of making same
10/27/1994	WO1994024699A1 Semiconductor device
10/27/1994	WO1994024698A1 Semiconductor device
10/27/1994	WO1994024694A1 Interconnection of integrated circuit chip and substrate
10/27/1994	WO1994024323A1 Gold-alloy bonding wire
10/27/1994	WO1994024322A1 Gold alloy wire for bonding semiconductor device
10/27/1994	DE4313544A1 Mounting for semiconductor components of a light barrier in a coin machine
10/26/1994	EP0621747A2 Printed circuit board or card thermal mass design
10/26/1994	EP0621635A1 Power transistor module
10/26/1994	EP0621633A2 Leadframe for integrated circuits
10/26/1994	EP0621630A1 Polishstop planarization method and structure
10/26/1994	EP0621245A1 Multilayer glass ceramic substrate and method of fabricating the same
10/26/1994	EP0506675B1 Process for determining the position of a pn transition
10/25/1994	US5359496 Hermetic high density interconnected electronic system
10/25/1994	US5359493 Three dimensional multi-chip module with integral heat sink
10/25/1994	US5359488 Packaging system for a standard electronic module
10/25/1994	US5359227 Lead frame assembly and method for wiring same
10/25/1994	US5359226 Static memory with self aligned contacts and split word lines
10/25/1994	US5359225 Thin, high leadcount package
10/25/1994	US5359224 Insulated lead frame for integrated circuits and method of manufacture thereof
10/25/1994	US5359223 Lead frame used for semiconductor integrated circuits and method of tape carrier bonding of lead frames
10/25/1994	US5359222 TCP type semiconductor device capable of preventing crosstalk
10/25/1994	US5359170 Apparatus for bonding external leads of an integrated circuit
10/25/1994	US5358906 Method of making integrated circuit package containing inner leads with knurled surfaces
10/25/1994	US5358905 Semiconductor device having die pad locking to substantially reduce package cracking
10/25/1994	US5358904 Semiconductor device
10/25/1994	US5358901 Forming first metal-containing layer on semiconductor substrate, then reacting this layer with second metal-containing gas yields intermetallic of first and second metals
10/25/1994	US5358878 Forming mask which covers active zone at surface of multilayer structure, etching isotropically to substrate, underetching under mask to shape mesa, depositing dielectric uniformly, etching dielectric, removing mask
10/25/1994	US5358826 A metal barrier is interposed between the metals to prevent diffusion from one metal to an adjoining portion of other metal; multilayered; sputtering, vapor deposition, etching, photolithography
10/25/1994	US5358795 Low thermal expansion metal sheet clad on one surface with high thermal expansion foil and having through-holes formed in thickness welded to metal sheet of high expansion so as to protrude and expose to foil surface
10/25/1994	US5358775 Fluoropolymeric electrical substrate material exhibiting low thermal coefficient of dielectric constant
10/25/1994	US5358733 Stress release metallization for VLSI circuits
10/25/1994	US5358621 Method of manufacturing semiconductor devices
10/25/1994	US5358616 Filling of vias and contacts employing an aluminum-germanium alloy

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