Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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11/23/1994 | EP0625871A1 Electronic component heat sink attachment using a canted coil spring |
11/23/1994 | EP0625532A1 Precursor for ceramic coatings |
11/23/1994 | EP0625171A1 Electrically dissipative composite |
11/23/1994 | EP0593637A4 Low impedance bus for power electronics. |
11/23/1994 | EP0555407A4 Stacked configuration for integrated circuit devices |
11/22/1994 | USRE34794 Gull-wing zig-zag inline lead package having end-of-package anchoring pins |
11/22/1994 | US5367435 Electronic package structure and method of making same |
11/22/1994 | US5367434 Electrical module assembly |
11/22/1994 | US5367433 Package clip on heat sink |
11/22/1994 | US5367430 Monolithic multiple capacitor |
11/22/1994 | US5367253 Clamped carrier for testing of semiconductor dies |
11/22/1994 | US5367196 Coated with adhesion enhancing layer and encapsulated in molding resin; miniaturization |
11/22/1994 | US5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
11/22/1994 | US5367194 Microchip assembly with electrical element in sealed cavity |
11/22/1994 | US5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die |
11/22/1994 | US5367192 Package for integrated devices |
11/22/1994 | US5367191 Leadframe and resin-sealed semiconductor device |
11/22/1994 | US5367124 Compliant lead for surface mounting a chip package to a substrate |
11/22/1994 | US5366933 Method for constructing a dual sided, wire bonded integrated circuit chip package |
11/22/1994 | US5366932 Semi-conductor chip packaging method and semi-conductor chip having interdigitated gate runners with gate bonding pads |
11/22/1994 | US5366931 Fabrication method for on-chip decoupling capacitor |
11/22/1994 | US5366930 Method for making highly integrated semiconductor connecting device using a conductive plug |
11/22/1994 | US5366928 Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body |
11/22/1994 | US5366906 Wafer level integration and testing |
11/22/1994 | US5366850 Submicron planarization process with passivation on metal line |
11/22/1994 | US5366794 Tape carrier for semiconductor apparatus |
11/22/1994 | US5366692 Alloy connecting materials for semiconductors |
11/22/1994 | US5366688 Heat sink and method of fabricating |
11/22/1994 | US5366589 Integrated circuits, covering of passivation layer on insulation |
11/22/1994 | US5366573 Backside bonded to temporary carrier and positioned before curing, removing adhesive by solvent |
11/22/1994 | US5366380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
11/22/1994 | US5366368 Multi-plunger manual transfer mold die |
11/22/1994 | US5366140 Patterned array of uniform metal microbeads |
11/22/1994 | US5365749 Computer component cooling system with local evaporation of refrigerant |
11/22/1994 | US5365654 Interlocking attachment assembly |
11/17/1994 | EP0625000A1 Gold paste for a ceramic circuit board |
11/17/1994 | EP0624921A1 Electrical connection arrangement and associated process of manufacture |
11/17/1994 | EP0624905A1 Multichip module |
11/17/1994 | EP0624904A2 A multi-layer wiring board and a manufacturing method thereof |
11/17/1994 | EP0624903A1 A modular integrated circuit structure |
11/17/1994 | EP0624902A1 Thixotropic conductive paste |
11/17/1994 | EP0624901A1 Semiconductor device with a passivation layer |
11/17/1994 | EP0624423A2 Method of separation of pieces from super hard material |
11/17/1994 | EP0624281A1 Low temperature co-fired ceramic (ltcc) high density interconnect package with circuitry within the cavity walls |
11/17/1994 | EP0608335A4 Structure for suppression of field inversion caused by charge build-up in the dielectric. |
11/17/1994 | EP0471003B1 Method of grounding an ultra high density pad array chip carrier |
11/17/1994 | DE4416735A1 Method for producing a gate electrode with a Polycide (Polycid) structure |
11/17/1994 | DE4416696A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method |
11/17/1994 | DE4316175A1 Soldered connection and soldering method |
11/17/1994 | DE4315581A1 Laser diodes with cooling system |
11/17/1994 | DE4315580A1 Arrangement comprising laser diodes and a cooling system, and method for its production |
11/15/1994 | US5365478 Semiconductor memory |
11/15/1994 | US5365474 Semiconductor memory device |
11/15/1994 | US5365424 High power laminated bus assembly for an electrical switching converter |
11/15/1994 | US5365409 Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe |
11/15/1994 | US5365406 Master-slice type semiconductor integrated circuit device |
11/15/1994 | US5365405 Multi-chip module |
11/15/1994 | US5365404 Jack-type semiconductor integrated circuit packages |
11/15/1994 | US5365402 Cooling apparatus of electronic device |
11/15/1994 | US5365400 Heat sinks and semiconductor cooling device using the heat sinks |
11/15/1994 | US5365399 Heat sinking apparatus for surface mountable power devices |
11/15/1994 | US5365113 Semiconductor device |
11/15/1994 | US5365112 Semiconductor integrated circuit device having an improved bonding pad structure |
11/15/1994 | US5365111 Stable local interconnect/active area silicide structure for VLSI applications |
11/15/1994 | US5365110 Improved reliability; power line formed of metal having higher melting point, higher electromigration resistance, and lower resistivity than those of signal line |
11/15/1994 | US5365108 Metal matrix composite semiconductor power switch assembly |
11/15/1994 | US5365107 Semiconductor device having tab tape |
11/15/1994 | US5365106 Resin mold semiconductor device |
11/15/1994 | US5365105 Sidewall anti-fuse structure and method for making |
11/15/1994 | US5365104 Oxynitride fuse protective/passivation film for integrated circuit having resistors |
11/15/1994 | US5365103 Punchthru ESD device along centerline of power pad |
11/15/1994 | US5365095 Semiconductor memory device and process |
11/15/1994 | US5365079 Thin film transistor and display device including same |
11/15/1994 | US5364910 Material for forming coating film |
11/15/1994 | US5364893 Composition of polyepoxide and phosphorous-containing polyepoxide |
11/15/1994 | US5364818 Sog with moisture resistant protective capping layer |
11/15/1994 | US5364706 Forms a neck having strength equal to or greater than that of other portions and forms a ball which does not crack on heating |
11/15/1994 | US5364284 Socket |
11/15/1994 | US5364276 Micropin array and production thereof |
11/15/1994 | US5363552 Method of heat sinking and mounting a solid-state device |
11/10/1994 | WO1994025987A1 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection |
11/10/1994 | WO1994025986A1 Semiconductor components with supply terminals for high integration density |
11/10/1994 | WO1994025985A1 Method and semiconductor device with increased maximum terminal voltage |
11/10/1994 | WO1994025984A1 Ic package and method of its manufacture |
11/10/1994 | WO1994025983A1 Semiconductor chip packaging method and semiconductor chip having interdigitated gate runners with gate bonding pads |
11/10/1994 | WO1994025982A1 Contact structure for vertical chip connections |
11/10/1994 | WO1994025981A1 Process for producing vertically connected semiconductor components |
11/10/1994 | WO1994025979A1 Integrated circuit with lead frame package having internal power and ground busses |
11/10/1994 | WO1994025810A1 High heat flux evaporative spray cooling |
11/10/1994 | DE4415375A1 Film carrier and method for its production |
11/09/1994 | EP0624055A2 Power supply structure for multichip package |
11/09/1994 | EP0623957A1 Lead frame manufacturing method |
11/09/1994 | EP0623956A2 A semiconductor device having no die supporting surface and method for making the same |
11/09/1994 | EP0623955A2 Semiconductor chip module |
11/09/1994 | EP0623954A1 Molded plastic packaging of electronic devices |
11/09/1994 | EP0623953A2 Flagless semiconductor device and method for making the same |
11/09/1994 | EP0623952A1 Cooling member for semiconductor components |
11/09/1994 | EP0623908A1 Individual identification label |
11/09/1994 | EP0623242A1 Backplane grounding for flip-chip integrated circuit |
11/09/1994 | EP0623241A1 Semiconductor device with terminal lead |