H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1994
11/23/1994	EP0625871A1 Electronic component heat sink attachment using a canted coil spring
11/23/1994	EP0625532A1 Precursor for ceramic coatings
11/23/1994	EP0625171A1 Electrically dissipative composite
11/23/1994	EP0593637A4 Low impedance bus for power electronics.
11/23/1994	EP0555407A4 Stacked configuration for integrated circuit devices
11/22/1994	USRE34794 Gull-wing zig-zag inline lead package having end-of-package anchoring pins
11/22/1994	US5367435 Electronic package structure and method of making same
11/22/1994	US5367434 Electrical module assembly
11/22/1994	US5367433 Package clip on heat sink
11/22/1994	US5367430 Monolithic multiple capacitor
11/22/1994	US5367253 Clamped carrier for testing of semiconductor dies
11/22/1994	US5367196 Coated with adhesion enhancing layer and encapsulated in molding resin; miniaturization
11/22/1994	US5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
11/22/1994	US5367194 Microchip assembly with electrical element in sealed cavity
11/22/1994	US5367193 Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die
11/22/1994	US5367192 Package for integrated devices
11/22/1994	US5367191 Leadframe and resin-sealed semiconductor device
11/22/1994	US5367124 Compliant lead for surface mounting a chip package to a substrate
11/22/1994	US5366933 Method for constructing a dual sided, wire bonded integrated circuit chip package
11/22/1994	US5366932 Semi-conductor chip packaging method and semi-conductor chip having interdigitated gate runners with gate bonding pads
11/22/1994	US5366931 Fabrication method for on-chip decoupling capacitor
11/22/1994	US5366930 Method for making highly integrated semiconductor connecting device using a conductive plug
11/22/1994	US5366928 Method of manufacturing a semiconductor device, in which a metal conductor track is provided on a surface of a semiconductor body
11/22/1994	US5366906 Wafer level integration and testing
11/22/1994	US5366850 Submicron planarization process with passivation on metal line
11/22/1994	US5366794 Tape carrier for semiconductor apparatus
11/22/1994	US5366692 Alloy connecting materials for semiconductors
11/22/1994	US5366688 Heat sink and method of fabricating
11/22/1994	US5366589 Integrated circuits, covering of passivation layer on insulation
11/22/1994	US5366573 Backside bonded to temporary carrier and positioned before curing, removing adhesive by solvent
11/22/1994	US5366380 Spring biased tapered contact elements for electrical connectors and integrated circuit packages
11/22/1994	US5366368 Multi-plunger manual transfer mold die
11/22/1994	US5366140 Patterned array of uniform metal microbeads
11/22/1994	US5365749 Computer component cooling system with local evaporation of refrigerant
11/22/1994	US5365654 Interlocking attachment assembly
11/17/1994	EP0625000A1 Gold paste for a ceramic circuit board
11/17/1994	EP0624921A1 Electrical connection arrangement and associated process of manufacture
11/17/1994	EP0624905A1 Multichip module
11/17/1994	EP0624904A2 A multi-layer wiring board and a manufacturing method thereof
11/17/1994	EP0624903A1 A modular integrated circuit structure
11/17/1994	EP0624902A1 Thixotropic conductive paste
11/17/1994	EP0624901A1 Semiconductor device with a passivation layer
11/17/1994	EP0624423A2 Method of separation of pieces from super hard material
11/17/1994	EP0624281A1 Low temperature co-fired ceramic (ltcc) high density interconnect package with circuitry within the cavity walls
11/17/1994	EP0608335A4 Structure for suppression of field inversion caused by charge build-up in the dielectric.
11/17/1994	EP0471003B1 Method of grounding an ultra high density pad array chip carrier
11/17/1994	DE4416735A1 Method for producing a gate electrode with a Polycide (Polycid) structure
11/17/1994	DE4416696A1 Halbleitervorrichtung und Herstellungsverfahren A semiconductor device and manufacturing method
11/17/1994	DE4316175A1 Soldered connection and soldering method
11/17/1994	DE4315581A1 Laser diodes with cooling system
11/17/1994	DE4315580A1 Arrangement comprising laser diodes and a cooling system, and method for its production
11/15/1994	US5365478 Semiconductor memory
11/15/1994	US5365474 Semiconductor memory device
11/15/1994	US5365424 High power laminated bus assembly for an electrical switching converter
11/15/1994	US5365409 Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe
11/15/1994	US5365406 Master-slice type semiconductor integrated circuit device
11/15/1994	US5365405 Multi-chip module
11/15/1994	US5365404 Jack-type semiconductor integrated circuit packages
11/15/1994	US5365402 Cooling apparatus of electronic device
11/15/1994	US5365400 Heat sinks and semiconductor cooling device using the heat sinks
11/15/1994	US5365399 Heat sinking apparatus for surface mountable power devices
11/15/1994	US5365113 Semiconductor device
11/15/1994	US5365112 Semiconductor integrated circuit device having an improved bonding pad structure
11/15/1994	US5365111 Stable local interconnect/active area silicide structure for VLSI applications
11/15/1994	US5365110 Improved reliability; power line formed of metal having higher melting point, higher electromigration resistance, and lower resistivity than those of signal line
11/15/1994	US5365108 Metal matrix composite semiconductor power switch assembly
11/15/1994	US5365107 Semiconductor device having tab tape
11/15/1994	US5365106 Resin mold semiconductor device
11/15/1994	US5365105 Sidewall anti-fuse structure and method for making
11/15/1994	US5365104 Oxynitride fuse protective/passivation film for integrated circuit having resistors
11/15/1994	US5365103 Punchthru ESD device along centerline of power pad
11/15/1994	US5365095 Semiconductor memory device and process
11/15/1994	US5365079 Thin film transistor and display device including same
11/15/1994	US5364910 Material for forming coating film
11/15/1994	US5364893 Composition of polyepoxide and phosphorous-containing polyepoxide
11/15/1994	US5364818 Sog with moisture resistant protective capping layer
11/15/1994	US5364706 Forms a neck having strength equal to or greater than that of other portions and forms a ball which does not crack on heating
11/15/1994	US5364284 Socket
11/15/1994	US5364276 Micropin array and production thereof
11/15/1994	US5363552 Method of heat sinking and mounting a solid-state device
11/10/1994	WO1994025987A1 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection
11/10/1994	WO1994025986A1 Semiconductor components with supply terminals for high integration density
11/10/1994	WO1994025985A1 Method and semiconductor device with increased maximum terminal voltage
11/10/1994	WO1994025984A1 Ic package and method of its manufacture
11/10/1994	WO1994025983A1 Semiconductor chip packaging method and semiconductor chip having interdigitated gate runners with gate bonding pads
11/10/1994	WO1994025982A1 Contact structure for vertical chip connections
11/10/1994	WO1994025981A1 Process for producing vertically connected semiconductor components
11/10/1994	WO1994025979A1 Integrated circuit with lead frame package having internal power and ground busses
11/10/1994	WO1994025810A1 High heat flux evaporative spray cooling
11/10/1994	DE4415375A1 Film carrier and method for its production
11/09/1994	EP0624055A2 Power supply structure for multichip package
11/09/1994	EP0623957A1 Lead frame manufacturing method
11/09/1994	EP0623956A2 A semiconductor device having no die supporting surface and method for making the same
11/09/1994	EP0623955A2 Semiconductor chip module
11/09/1994	EP0623954A1 Molded plastic packaging of electronic devices
11/09/1994	EP0623953A2 Flagless semiconductor device and method for making the same
11/09/1994	EP0623952A1 Cooling member for semiconductor components
11/09/1994	EP0623908A1 Individual identification label
11/09/1994	EP0623242A1 Backplane grounding for flip-chip integrated circuit
11/09/1994	EP0623241A1 Semiconductor device with terminal lead

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