H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1994
12/13/1994	US5373192 Electromigration resistance metal interconnect
12/13/1994	US5373191 Semiconductor device and method of producing the same
12/13/1994	US5373190 Resin-sealed semiconductor device
12/13/1994	US5373188 Packaged semiconductor device including multiple semiconductor chips and cross-over lead
12/13/1994	US5373187 Package body for integrated circuit
12/13/1994	US5373169 Low-temperature process metal-to-metal antifuse employing silicon link
12/13/1994	US5373114 Circuit substrate
12/13/1994	US5373110 Multilayer circuit board with repaired I/O pin and process for repairing I/O pin on multilayer circuit board
12/13/1994	US5373105 Terminals for a resin-sealed semiconductor device
12/13/1994	US5373099 Fixing device for fixing electronic component against a wall of a heatsink
12/13/1994	US5372969 Patterning to form islands on surface, surrounding with supporting materials, selectively forming electroconductive vias and trenches, depositing interlevel layer, repeating
12/13/1994	US5372964 Method of producing pillar-shaped DRAM and ROM devices
12/13/1994	US5372956 Method for making direct contacts in high density MOS/CMOS processes
12/13/1994	US5372883 Die attach adhesive film, application method and devices incorporating the same
12/13/1994	US5372685 Sputtering chromium layer on polyimide substrate followed by layer of copper; integrated circuits; improved adhesion
12/13/1994	US5372296 Graphite lid seal fixture
12/13/1994	US5372239 Apparatus for conveying plate-form articles
12/13/1994	US5372186 Electrical apparatus
12/13/1994	US5371943 Method of manufacturing a semiconductor apparatus
12/08/1994	WO1994028581A1 Process for the production of a seal providing mechanical strength between a substrate and a chip hybridized by beads on the substrate
12/08/1994	WO1994027765A1 Method for making heat-dissipating elements for micro-electronic devices
12/07/1994	EP0627875A1 Process for manufacturing metal-ceramic substrate
12/07/1994	EP0627872A2 Process for manufacturing metallized ceramic substrates
12/07/1994	EP0627766A1 Semiconductor device and manufacturing method thereof
12/07/1994	EP0627765A1 Semiconductor device having a flip-chip semiconducteur element
12/07/1994	EP0627763A1 Process for improving the adhesion between dielectric layers at their interface in semiconductor devices manufacture
12/07/1994	EP0627760A1 Subdivisible substrate and method of making the same
12/07/1994	EP0627124A1 Fet chip with heat-extracting bridge
12/07/1994	EP0627104A1 Contacting device for a chip card
12/07/1994	EP0557278B1 A method of making a multilayer thin film structure
12/07/1994	CN2184980Y Radiator of integrate circuit wafer
12/06/1994	US5371654 Three dimensional high performance interconnection package
12/06/1994	US5371653 Circuit board, electronic circuit chip-mounted circuit board and circuit board apparatus
12/06/1994	US5371652 Spring clamp assembly with electrically insulating shoe
12/06/1994	US5371414 Simultaneous multiple antifuse programming method
12/06/1994	US5371411 Resin molded type semiconductor device having a conductor film
12/06/1994	US5371410 Integrated circuit metallization with zero contact enclosure requirements
12/06/1994	US5371408 Integrated circuit package with removable shield
12/06/1994	US5371407 Electronic circuit with diamond substrate and conductive vias
12/06/1994	US5371406 Semiconductor device
12/06/1994	US5371405 High-frequency high-power transistor
12/06/1994	US5371404 Thermally conductive integrated circuit package with radio frequency shielding
12/06/1994	US5371403 High performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal lines
12/06/1994	US5371402 Low capacitance, low resistance sidewall antifuse structure and process
12/06/1994	US5371392 Semiconductor apparatus and horizontal register for solid-state image pickup apparatus with protection circuit
12/06/1994	US5371390 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
12/06/1994	US5371386 Semiconductor device and method of assembling the same
12/06/1994	US5371352 Photodetector comprising a test element group of PN junctions and including a mask having at least one window spaced apart from the PN junctions
12/06/1994	US5371321 Package structure and method for reducing bond wire inductance
12/06/1994	US5371178 Rapidly curing adhesive and method
12/06/1994	US5371047 Using organic dielectric to eliminate damage caused by outgassing vapors
12/06/1994	US5371044 Method of uniformly encapsulating a semiconductor device in resin
12/06/1994	US5371043 Method for forming a power circuit package
12/06/1994	US5371041 Forming a conformal refractory metal silicide layer over refractory metal nitride layer which extends vertically into opening
12/06/1994	US5371029 Process for making a leadless chip resistor capacitor carrier using thick and thin film printing
12/06/1994	US5370923 Curving insulating structure placed in close spaced proximity with a conductive, interconnect structure
12/06/1994	US5370766 Forming conductive layer on substrate, forming patterned dielectric layer thereon, formed patterned thin film conductor above the dielectric layer to provide inductor
12/06/1994	US5370759 Method for producing multilayered ceramic substrate
12/06/1994	US5370517 Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device
12/06/1994	US5370178 Convertible cooling module for air or water cooling of electronic circuit components
12/06/1994	US5369879 Method of mounting a semiconductor device to a heat sink
12/01/1994	DE4417670A1 Improved TAB tape
11/1994
11/30/1994	EP0626727A2 Thin-film wiring layout for a non-planar thin-film structure
11/30/1994	EP0626726A2 Simultaneous multiple antifuse programming method
11/30/1994	EP0626725A2 Multi-layer lead-frame for a semiconductor device
11/30/1994	EP0626722A1 Semiconductor device and its manufacture
11/30/1994	CN1095862A Semiconductor chip module
11/30/1994	CN1095861A Package technique for miniature high voltage Si stack compound block
11/29/1994	US5369552 Multi-chip module with multiple compartments
11/29/1994	US5369550 Method and apparatus for cooling a molded-plastic integrated-circuit package
11/29/1994	US5369545 De-coupling capacitor on the top of the silicon die by eutectic flip bonding
11/29/1994	US5369304 Conductive diffusion barrier of titanium nitride in ohmic contact with a plurality of doped layers therefor
11/29/1994	US5369303 Self-aligned contact process
11/29/1994	US5369301 Pin-finned forged heat sink
11/29/1994	US5369300 Integrated circuits with dopes for electrical resistance
11/29/1994	US5369299 Tamper resistant integrated circuit structure
11/29/1994	US5369220 Wiring board having laminated wiring patterns
11/29/1994	US5369059 Method for constructing a reduced capacitance chip carrier
11/29/1994	US5369058 Warp-resistent ultra-thin integrated circuit package fabrication method
11/29/1994	US5369057 Method of making and sealing a semiconductor device having an air path therethrough
11/29/1994	US5369056 Thinning by removal of casings, supporting and thinning
11/29/1994	US5369055 Method for fabricating titanium silicide contacts
11/29/1994	US5369054 Circuits for ESD protection of metal-to-metal antifuses during processing
11/29/1994	US5369050 Method of fabricating semiconductor device
11/29/1994	US5368880 Eutectic bond and method of gold/titanium eutectic bonding of cadmium telluride to sapphire
11/29/1994	US5368805 Method for producing resin sealed type semiconductor device
11/29/1994	US5368542 Apparatus and method for separating microscopic units in a substantially continuous density gradient solution
11/29/1994	US5368497 IC socket
11/29/1994	US5368094 Bipartite heat sink positioning device for computer chips
11/29/1994	US5367766 Ultra high density integrated circuit packages method
11/29/1994	US5367765 Method of fabricating integrated circuit chip package
11/29/1994	US5367764 Method of making a multi-layer circuit assembly
11/29/1994	US5367763 TAB testing of area array interconnected chips
11/29/1994	CA1333241C Aluminum nitride sintered body formed with metallized layer and method of manufacturing the same
11/29/1994	CA1333214C Method for producing a sheet member containing at least one enclosed channel
11/24/1994	WO1994027320A1 Plastic encapsulated integrated circuit package and method of manufacturing the same
11/24/1994	WO1994027319A1 Power semiconductor device with stress buffer layer
11/24/1994	WO1994027318A1 Packaging and interconnect system for integrated circuits
11/24/1994	WO1994026461A1 Method and apparatus for automatically placing lids on component packages
11/24/1994	DE4412524A1 Wärmeabgebender Träger mit hochorientierter Diamantschicht Heat-emitting carrier with highly oriented diamond film

1 ... 2082 2083 2084 2085 2086 2087 2088 2089 2090 2091 2092 2093 2094 2095 2096 2097 2098 2099 2100 2101 2102 ... 2262