| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/1995 | US5378859 Film wiring board |
| 01/03/1995 | US5378660 Barrier layers and aluminum contacts |
| 01/03/1995 | US5378657 Method for making an aluminum clad leadframe and a semiconductor device employing the same |
| 01/03/1995 | US5378656 Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same |
| 01/03/1995 | US5378653 Method of forming aluminum based pattern |
| 01/03/1995 | US5378652 Method of making a through hole in multi-layer insulating films |
| 01/03/1995 | US5378581 Integrated circuits |
| 01/03/1995 | US5378498 Antistatic solution for microlithic measurement |
| 01/03/1995 | US5378313 Hybrid circuits and a method of manufacture |
| 01/03/1995 | US5378310 Chromium barrier prevents copper diffusion and side etching |
| 01/03/1995 | US5378307 Fluid treatment apparatus |
| 01/03/1995 | US5377961 Electrodynamic pump for dispensing molten solder |
| 01/03/1995 | US5377745 Cooling device for central processing unit |
| 01/03/1995 | CA2126822A1 Multichip module substrate structure |
| 01/03/1995 | CA2021682C Chip-carrier with alpha ray shield |
| 12/28/1994 | EP0631316A2 Semiconductor device comprising an alignment mark, method of manufacturing the same and aligning method |
| 12/28/1994 | EP0631315A1 Semiconductor integrated circuit package of the "Lead on chip" type (LOC) |
| 12/28/1994 | EP0631314A1 Multiple-metal-level integrated device and fabrication process thereof |
| 12/28/1994 | EP0631313A1 Semiconductor device containing a through hole |
| 12/28/1994 | EP0631312A1 Single inline package |
| 12/28/1994 | EP0631311A2 Pinned ceramic chip carrier |
| 12/28/1994 | EP0631310A1 Polyimide-insulated cube package of stacked semiconductor device chips |
| 12/28/1994 | EP0630867A1 Non-lead sealing glasses |
| 12/28/1994 | EP0630522A1 Microchannel cooling of face down bonded chips |
| 12/28/1994 | EP0630521A1 Three dimensional, multi-chip module |
| 12/28/1994 | EP0549619B1 Process for manufacturing circuits |
| 12/28/1994 | EP0511301B1 Method for reducing shrinkage during firing of green ceramic bodies |
| 12/27/1994 | US5377124 Field programmable printed circuit board |
| 12/27/1994 | US5377081 Surface mountable electronic part |
| 12/27/1994 | US5377078 Apparatus mounting a power semiconductor to a heat sink |
| 12/27/1994 | US5377077 Ultra high density integrated circuit packages method and apparatus |
| 12/27/1994 | US5377072 Single metal-plate bypass capacitor |
| 12/27/1994 | US5376909 Device packaging |
| 12/27/1994 | US5376902 Interconnection structure for crosstalk reduction to improve off-chip selectivity |
| 12/27/1994 | US5376879 Method and apparatus for evaluating electrostatic discharge conditions |
| 12/27/1994 | US5376825 Integrated circuit package for flexible computer system alternative architectures |
| 12/27/1994 | US5376824 Method and an encapsulation for encapsulating electrical or electronic components or assemblies |
| 12/27/1994 | US5376820 Semiconductor fuse structure |
| 12/27/1994 | US5376819 Integrated circuit having an on chip thermal circuit requiring only one dedicated integrated circuit pin and method of operation |
| 12/27/1994 | US5376815 Semiconductor device having bipolar-mos composite element pellet suitable for pressure contacted structure |
| 12/27/1994 | US5376756 Wire support and guide |
| 12/27/1994 | US5376590 Semiconductor device and method of fabricating the same |
| 12/27/1994 | US5376589 Method of fabricating similar indexed dissociated chips |
| 12/27/1994 | US5376588 Method for making high pin count package for semiconductor device |
| 12/27/1994 | US5376587 Method for making cooling structures for directly cooling an active layer of a semiconductor chip |
| 12/27/1994 | US5376586 Method of curing thin films of organic dielectric material |
| 12/27/1994 | US5376574 Capped modular microwave integrated circuit and method of making same |
| 12/27/1994 | US5376446 Electrically dissipative composite |
| 12/27/1994 | US5376435 Microelectronic interlayer dielectric structure |
| 12/27/1994 | US5376403 Blend of solder powder, blocked crosslinking agent with fluxing properties and a reactive monomer or polymer |
| 12/27/1994 | US5376226 Method of making connector for integrated circuit chips |
| 12/27/1994 | US5375710 IC carrier |
| 12/27/1994 | US5375655 Heat sink apparatus |
| 12/27/1994 | US5375652 Heat radiating apparatus for semiconductor device |
| 12/27/1994 | US5375630 Process for forming lead frame of quad flat semiconductor package |
| 12/27/1994 | US5375321 Selectively etching one side of double-clad, dielectric substrate to form connectors subsequently positioned near the bottom of the grooves by folding and pressing |
| 12/22/1994 | WO1994029901A1 Securing device for semiconductor circuit components |
| 12/22/1994 | WO1994029900A1 Heat dissipative means for integrated circuit chip package |
| 12/22/1994 | WO1994029897A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| 12/22/1994 | WO1994029887A1 Molded electric part and its manufacture |
| 12/22/1994 | WO1994029092A1 Method and apparatus for producing ceramic-based electronic components |
| 12/22/1994 | CA2162499A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| 12/22/1994 | CA2118994A1 Polyimide-insulated cube package of stacked semiconductor device chips |
| 12/21/1994 | EP0630176A1 Electrical assembly |
| 12/21/1994 | EP0630175A1 Electrical assembly cooling device |
| 12/21/1994 | EP0630049A1 Semi-conductor die assembly |
| 12/21/1994 | EP0630048A1 Method of testing dice |
| 12/21/1994 | EP0630047A1 Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device |
| 12/21/1994 | EP0630046A2 Cooling apparatus for integrated circuit chips |
| 12/21/1994 | EP0630045A1 Finned diamond heatsink and process for the production of the same |
| 12/21/1994 | EP0629595A2 Hot pressing ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates |
| 12/21/1994 | EP0629466A1 High temperature, lead-free, tin based solder composition |
| 12/21/1994 | EP0629464A1 Lead-free, tin, antimony, bismuth, copper solder alloy |
| 12/21/1994 | CN2185925Y Separating heat pipe type air cooled heat sink |
| 12/20/1994 | US5375229 System and method for adding a control function to a semiconductor equipment system |
| 12/20/1994 | US5375042 Semiconductor package employing substrate assembly having a pair of thin film circuits disposed one on each of oppositely facing surfaces of a thick film circuit |
| 12/20/1994 | US5375041 Electronic assembly |
| 12/20/1994 | US5375003 Method of connecting a tab film and a liquid crystal display panel |
| 12/20/1994 | US5374893 Apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon |
| 12/20/1994 | US5374849 Conductive layer connection structure of semiconductor device |
| 12/20/1994 | US5374848 Thermal stress resistant semiconductor device mounting arrangement |
| 12/20/1994 | US5374843 Field effect transistor |
| 12/20/1994 | US5374837 Thin film transistor array substrate acting as an active matrix substrate |
| 12/20/1994 | US5374833 Integrated circuit |
| 12/20/1994 | US5374832 Antifuse having TiW oxide film between two metal layers |
| 12/20/1994 | US5374786 Ceramic wall hybrid package with washer and solid metal through wall leads |
| 12/20/1994 | US5374592 Method for forming an aluminum metal contact |
| 12/20/1994 | US5374590 Fabrication and laser deletion of microfuses |
| 12/20/1994 | US5374197 IC socket |
| 12/20/1994 | US5373627 Method of forming multi-chip module with high density interconnections |
| 12/15/1994 | DE4420026A1 Semiconductor storage device |
| 12/15/1994 | DE4240506A1 Method for producing interconnections over trench regions of interconnected semiconductor circuits, solder resist being used for the structuring |
| 12/14/1994 | EP0629002A1 Semiconductor device and ferroelectric capacitor |
| 12/14/1994 | EP0629000A1 High density and reliability integrated circuit assembly and method of making |
| 12/14/1994 | EP0628999A1 Sealed feedthrough for a thickfilm ceramic substrate and method of making the same |
| 12/14/1994 | EP0628998A1 Wiring layer for semi conductor device and method for manufacturing the same |
| 12/14/1994 | EP0628997A2 Semiconductor device with small die pad and method of making same |
| 12/13/1994 | US5373418 Electrical device for mounting electrical components with enhanced thermal radiating properties |
| 12/13/1994 | US5373417 Liquid-cooled circuit package with micro-bellows for controlling expansion |
| 12/13/1994 | US5373232 Method of and articles for accurately determining relative positions of lithographic artifacts |