Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1995
01/24/1995US5384090 Fine wire for forming bump electrodes using a wire bonder
01/24/1995US5383787 Integrated circuit package with direct access to internal signals
01/24/1995US5383340 Two-phase cooling system for laptop computers
01/19/1995WO1995002313A1 Heat dissipating sheet
01/19/1995DE4424549A1 Verfahren zum Gehäusen eines Leistungshalbleiterbauelements und durch dieses Verfahren hergestelltes Gehäuse A method of housings of a power semiconductor device manufactured by this method and housing
01/19/1995DE4338277A1 Liquid-cooled convertor module having circuitry components for power semiconductors which can be turned off
01/19/1995DE4322932A1 Liquid cooling body with insulating discs, electrical contact plates and an insulation ring
01/18/1995EP0634890A1 Packaging structure for microwave circuit
01/18/1995EP0634794A2 Heat-conductive composite material
01/18/1995EP0634793A1 A low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die
01/18/1995EP0634792A2 Resin-sealed semiconductor device containing porous fluororesin
01/18/1995EP0634788A2 Method of manufacturing semiconductor device utilizing selective CVD method
01/18/1995EP0634053A1 METHOD AND STRUCTURE FOR SUPPRESSING CHARGE LOSS IN EEPROMs/EPROMs AND INSTABILITIES IN SRAM LOAD RESISTORS
01/17/1995US5383136 Electrical test structure and method for measuring the relative locations of conducting features on an insulating substrate
01/17/1995US5383094 Connection lead stucture for surface mountable printed circuit board components
01/17/1995US5383093 Hybrid integrated circuit apparatus
01/17/1995US5383092 Device for mounting a plurality of transistors
01/17/1995US5383018 Apparatus and method for calibration of patterned wafer scanners
01/17/1995US5382832 Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding
01/17/1995US5382831 Integrated circuit metal film interconnect having enhanced resistance to electromigration
01/17/1995US5382830 Semiconductor module with multi-plane conductive path
01/17/1995US5382829 Packaged microwave semiconductor device
01/17/1995US5382827 Functional substrates for packaging semiconductor chips
01/17/1995US5382826 Stacked high voltage transistor unit
01/17/1995US5382759 Massive parallel interconnection attachment using flexible circuit
01/17/1995US5382758 Diamond substrates having metallized vias
01/17/1995US5382546 Semiconductor device and method of fabricating same, as well as lead frame used therein and method of fabricating same
01/17/1995US5382545 Interconnection process with self-aligned via plug
01/17/1995US5382315 Direct-write deposition, semiconductors
01/17/1995US5382310 Packaging medical image sensors
01/17/1995US5381946 Method of forming differing volume solder bumps
01/17/1995US5381944 Low temperature reactive bonding
01/17/1995US5381859 Heat sink and the producing method thereof
01/17/1995US5381848 Casting of raised bump contacts on a substrate
01/17/1995US5381641 BGA funnel
01/17/1995US5381599 Polyesters
01/12/1995WO1995001651A1 Moisture barrier for plastic package with heat spreader
01/12/1995DE4322933A1 Liquid-cooling body with hydraulic coolant connection
01/12/1995DE4322715A1 Component unit with a solder joint having a low amount of bubbles
01/12/1995DE4322647A1 Radiator (chiller)
01/11/1995EP0633609A2 Composite board, and method of fabricating a composite board
01/11/1995EP0633608A1 Pin-finned heat sink and process for producing the same
01/11/1995EP0633579A2 Improved pinless connector
01/10/1995US5381344 Apparatus and method for obtaining a list of numbers of wafers for integrated circuit testing
01/10/1995US5381316 Electronic part assembly using a shape memory alloy element
01/10/1995US5381305 Clip for clamping heat sink module to electronic module
01/10/1995US5381047 Semiconductor integrated circuit having multiple silicon chips
01/10/1995US5381046 Static random access memories
01/10/1995US5381042 Packaged integrated circuit including heat slug having an exposed surface
01/10/1995US5381041 Self clamping heat sink
01/10/1995US5381039 Hermetic semiconductor device having jumper leads
01/10/1995US5381038 Semiconductor device having passivation protrusions defining electrical bonding area
01/10/1995US5381037 Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies
01/10/1995US5381036 Lead-on chip semiconductor device having peripheral bond pads
01/10/1995US5381035 Predictable programming voltage, integrated circuits, multilayer
01/10/1995US5381034 Integrated circuit
01/10/1995US5381031 Semiconductor device with reduced high voltage termination area and high breakdown voltage
01/10/1995US5381030 Semiconductor memory device with improved step protection and manufacturing method thereof
01/10/1995US5380956 Multi-chip cooling module and method
01/10/1995US5380952 Integrated circuit package with stabilizer bar
01/10/1995US5380681 Three-dimensional multichip package and methods of fabricating
01/10/1995US5380680 Method for forming a metal contact of a semiconductor device
01/10/1995US5380567 Coating electronic device with hydrogen silsesquioxane resin solution, evaporating solvent to deposit preceramic coating, heating to 500-800 degrees C. in inert gas atmosphere
01/10/1995US5380210 High density area array modular connector
01/10/1995US5379942 Method for producing a semiconductor modular structure
01/10/1995US5379830 Heat pipe and radiating device
01/05/1995WO1995001087A1 Method and apparatus for non-conductively interconnecting integrated circuits
01/05/1995WO1995000973A1 Electrically and thermally enhanced package using a separate silicon substrate
01/05/1995WO1995000972A1 Multilayer ltcc tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
01/05/1995DE4422216A1 Multilayer metallic printed circuit board and a cast component
01/05/1995DE4421077A1 Semiconductor housing and method for the production thereof
01/05/1995DE4333359A1 Monolithic integrated power output stage
01/04/1995EP0632686A1 A device for shielding and/or cooling electronic components
01/04/1995EP0632685A2 Flexible circuit board assembly with common heat spreader and method of manufacture
01/04/1995EP0632684A2 Process for manufacturing metal-ceramic substrate
01/04/1995EP0632682A1 Compliant lead for surface mounting a chip package to a substrate
01/04/1995EP0632681A2 Metal-coated substrate
01/04/1995EP0632501A1 A semiconductor device including protection means
01/04/1995EP0632500A1 Heat sink fan
01/04/1995EP0632499A2 Substrate for semiconductor device
01/04/1995EP0632498A1 Pin-fin heat sink
01/04/1995EP0632497A2 Multichip module substrate structure
01/04/1995EP0632493A1 Semiconductor device with twice-bonded wire and method for manufacturing
01/04/1995EP0632465A1 Low capacity read only memory
01/04/1995EP0631692A1 Three dimensional integrated circuit and method of fabricating same
01/04/1995EP0631691A1 Ic chip package and method of making same
01/03/1995US5379250 Integrated circuit
01/03/1995US5379233 Circuit chip
01/03/1995US5379193 Parallel processor structure and package
01/03/1995US5379191 Compact adapter package providing peripheral to area translation for an integrated circuit chip
01/03/1995US5379188 Arrangement for mounting an integrated circuit chip carrier on a printed circuit board
01/03/1995US5379187 Design for encapsulation of thermally enhanced integrated circuits
01/03/1995US5379186 Encapsulated electronic component having a heat diffusing layer
01/03/1995US5379185 Leadless surface mountable assembly
01/03/1995US5378981 Method for testing a semiconductor device on a universal test circuit substrate
01/03/1995US5378928 Plastic encapsulated microelectronic device and method
01/03/1995US5378927 Thin-film wiring layout for a non-planar thin-film structure
01/03/1995US5378926 Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes
01/03/1995US5378924 Apparatus for thermally coupling a heat sink to a lead frame
01/03/1995US5378869 Method for forming an integrated circuit package with via interconnection