| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/24/1995 | US5384090 Fine wire for forming bump electrodes using a wire bonder |
| 01/24/1995 | US5383787 Integrated circuit package with direct access to internal signals |
| 01/24/1995 | US5383340 Two-phase cooling system for laptop computers |
| 01/19/1995 | WO1995002313A1 Heat dissipating sheet |
| 01/19/1995 | DE4424549A1 Verfahren zum Gehäusen eines Leistungshalbleiterbauelements und durch dieses Verfahren hergestelltes Gehäuse A method of housings of a power semiconductor device manufactured by this method and housing |
| 01/19/1995 | DE4338277A1 Liquid-cooled convertor module having circuitry components for power semiconductors which can be turned off |
| 01/19/1995 | DE4322932A1 Liquid cooling body with insulating discs, electrical contact plates and an insulation ring |
| 01/18/1995 | EP0634890A1 Packaging structure for microwave circuit |
| 01/18/1995 | EP0634794A2 Heat-conductive composite material |
| 01/18/1995 | EP0634793A1 A low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die |
| 01/18/1995 | EP0634792A2 Resin-sealed semiconductor device containing porous fluororesin |
| 01/18/1995 | EP0634788A2 Method of manufacturing semiconductor device utilizing selective CVD method |
| 01/18/1995 | EP0634053A1 METHOD AND STRUCTURE FOR SUPPRESSING CHARGE LOSS IN EEPROMs/EPROMs AND INSTABILITIES IN SRAM LOAD RESISTORS |
| 01/17/1995 | US5383136 Electrical test structure and method for measuring the relative locations of conducting features on an insulating substrate |
| 01/17/1995 | US5383094 Connection lead stucture for surface mountable printed circuit board components |
| 01/17/1995 | US5383093 Hybrid integrated circuit apparatus |
| 01/17/1995 | US5383092 Device for mounting a plurality of transistors |
| 01/17/1995 | US5383018 Apparatus and method for calibration of patterned wafer scanners |
| 01/17/1995 | US5382832 Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding |
| 01/17/1995 | US5382831 Integrated circuit metal film interconnect having enhanced resistance to electromigration |
| 01/17/1995 | US5382830 Semiconductor module with multi-plane conductive path |
| 01/17/1995 | US5382829 Packaged microwave semiconductor device |
| 01/17/1995 | US5382827 Functional substrates for packaging semiconductor chips |
| 01/17/1995 | US5382826 Stacked high voltage transistor unit |
| 01/17/1995 | US5382759 Massive parallel interconnection attachment using flexible circuit |
| 01/17/1995 | US5382758 Diamond substrates having metallized vias |
| 01/17/1995 | US5382546 Semiconductor device and method of fabricating same, as well as lead frame used therein and method of fabricating same |
| 01/17/1995 | US5382545 Interconnection process with self-aligned via plug |
| 01/17/1995 | US5382315 Direct-write deposition, semiconductors |
| 01/17/1995 | US5382310 Packaging medical image sensors |
| 01/17/1995 | US5381946 Method of forming differing volume solder bumps |
| 01/17/1995 | US5381944 Low temperature reactive bonding |
| 01/17/1995 | US5381859 Heat sink and the producing method thereof |
| 01/17/1995 | US5381848 Casting of raised bump contacts on a substrate |
| 01/17/1995 | US5381641 BGA funnel |
| 01/17/1995 | US5381599 Polyesters |
| 01/12/1995 | WO1995001651A1 Moisture barrier for plastic package with heat spreader |
| 01/12/1995 | DE4322933A1 Liquid-cooling body with hydraulic coolant connection |
| 01/12/1995 | DE4322715A1 Component unit with a solder joint having a low amount of bubbles |
| 01/12/1995 | DE4322647A1 Radiator (chiller) |
| 01/11/1995 | EP0633609A2 Composite board, and method of fabricating a composite board |
| 01/11/1995 | EP0633608A1 Pin-finned heat sink and process for producing the same |
| 01/11/1995 | EP0633579A2 Improved pinless connector |
| 01/10/1995 | US5381344 Apparatus and method for obtaining a list of numbers of wafers for integrated circuit testing |
| 01/10/1995 | US5381316 Electronic part assembly using a shape memory alloy element |
| 01/10/1995 | US5381305 Clip for clamping heat sink module to electronic module |
| 01/10/1995 | US5381047 Semiconductor integrated circuit having multiple silicon chips |
| 01/10/1995 | US5381046 Static random access memories |
| 01/10/1995 | US5381042 Packaged integrated circuit including heat slug having an exposed surface |
| 01/10/1995 | US5381041 Self clamping heat sink |
| 01/10/1995 | US5381039 Hermetic semiconductor device having jumper leads |
| 01/10/1995 | US5381038 Semiconductor device having passivation protrusions defining electrical bonding area |
| 01/10/1995 | US5381037 Lead frame with selected inner leads coupled to an inner frame member for an integrated circuit package assemblies |
| 01/10/1995 | US5381036 Lead-on chip semiconductor device having peripheral bond pads |
| 01/10/1995 | US5381035 Predictable programming voltage, integrated circuits, multilayer |
| 01/10/1995 | US5381034 Integrated circuit |
| 01/10/1995 | US5381031 Semiconductor device with reduced high voltage termination area and high breakdown voltage |
| 01/10/1995 | US5381030 Semiconductor memory device with improved step protection and manufacturing method thereof |
| 01/10/1995 | US5380956 Multi-chip cooling module and method |
| 01/10/1995 | US5380952 Integrated circuit package with stabilizer bar |
| 01/10/1995 | US5380681 Three-dimensional multichip package and methods of fabricating |
| 01/10/1995 | US5380680 Method for forming a metal contact of a semiconductor device |
| 01/10/1995 | US5380567 Coating electronic device with hydrogen silsesquioxane resin solution, evaporating solvent to deposit preceramic coating, heating to 500-800 degrees C. in inert gas atmosphere |
| 01/10/1995 | US5380210 High density area array modular connector |
| 01/10/1995 | US5379942 Method for producing a semiconductor modular structure |
| 01/10/1995 | US5379830 Heat pipe and radiating device |
| 01/05/1995 | WO1995001087A1 Method and apparatus for non-conductively interconnecting integrated circuits |
| 01/05/1995 | WO1995000973A1 Electrically and thermally enhanced package using a separate silicon substrate |
| 01/05/1995 | WO1995000972A1 Multilayer ltcc tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
| 01/05/1995 | DE4422216A1 Multilayer metallic printed circuit board and a cast component |
| 01/05/1995 | DE4421077A1 Semiconductor housing and method for the production thereof |
| 01/05/1995 | DE4333359A1 Monolithic integrated power output stage |
| 01/04/1995 | EP0632686A1 A device for shielding and/or cooling electronic components |
| 01/04/1995 | EP0632685A2 Flexible circuit board assembly with common heat spreader and method of manufacture |
| 01/04/1995 | EP0632684A2 Process for manufacturing metal-ceramic substrate |
| 01/04/1995 | EP0632682A1 Compliant lead for surface mounting a chip package to a substrate |
| 01/04/1995 | EP0632681A2 Metal-coated substrate |
| 01/04/1995 | EP0632501A1 A semiconductor device including protection means |
| 01/04/1995 | EP0632500A1 Heat sink fan |
| 01/04/1995 | EP0632499A2 Substrate for semiconductor device |
| 01/04/1995 | EP0632498A1 Pin-fin heat sink |
| 01/04/1995 | EP0632497A2 Multichip module substrate structure |
| 01/04/1995 | EP0632493A1 Semiconductor device with twice-bonded wire and method for manufacturing |
| 01/04/1995 | EP0632465A1 Low capacity read only memory |
| 01/04/1995 | EP0631692A1 Three dimensional integrated circuit and method of fabricating same |
| 01/04/1995 | EP0631691A1 Ic chip package and method of making same |
| 01/03/1995 | US5379250 Integrated circuit |
| 01/03/1995 | US5379233 Circuit chip |
| 01/03/1995 | US5379193 Parallel processor structure and package |
| 01/03/1995 | US5379191 Compact adapter package providing peripheral to area translation for an integrated circuit chip |
| 01/03/1995 | US5379188 Arrangement for mounting an integrated circuit chip carrier on a printed circuit board |
| 01/03/1995 | US5379187 Design for encapsulation of thermally enhanced integrated circuits |
| 01/03/1995 | US5379186 Encapsulated electronic component having a heat diffusing layer |
| 01/03/1995 | US5379185 Leadless surface mountable assembly |
| 01/03/1995 | US5378981 Method for testing a semiconductor device on a universal test circuit substrate |
| 01/03/1995 | US5378928 Plastic encapsulated microelectronic device and method |
| 01/03/1995 | US5378927 Thin-film wiring layout for a non-planar thin-film structure |
| 01/03/1995 | US5378926 Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal nitride barrier layer to block migration of tin through via holes |
| 01/03/1995 | US5378924 Apparatus for thermally coupling a heat sink to a lead frame |
| 01/03/1995 | US5378869 Method for forming an integrated circuit package with via interconnection |