| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/12/2013 | US20130234320 Chip stack structure and method for fabricating the same |
| 09/12/2013 | US20130234319 Semiconductor constructions |
| 09/12/2013 | US20130234318 Semiconductor Device and Method of Forming Non-Linear Interconnect Layer with Extended Length for Joint Reliability |
| 09/12/2013 | US20130234316 Self-aligned polymer passivation/aluminum pad |
| 09/12/2013 | US20130234315 Structures and methods for detecting solder wetting of pedestal sidewalls |
| 09/12/2013 | US20130234314 Flexible micro-system and fabrication method thereof |
| 09/12/2013 | US20130234313 Grown carbon nanotube die attach structures, articles, devices, and processes for making them |
| 09/12/2013 | US20130234312 Semiconductor device and manufacturing method thereof |
| 09/12/2013 | US20130234311 Semiconductor component that includes a protective structure |
| 09/12/2013 | US20130234310 Flip chip package and method of manufacturing the same |
| 09/12/2013 | US20130234309 Semiconductor device |
| 09/12/2013 | US20130234308 Method of manufacturing semiconductor device, semiconductor integrated device and method of manufacturing the same |
| 09/12/2013 | US20130234307 Lead frame land grid array |
| 09/12/2013 | US20130234306 Lead frame for assembling semiconductor device |
| 09/12/2013 | US20130234305 3d transmission lines for semiconductors |
| 09/12/2013 | US20130234304 Semiconductor device |
| 09/12/2013 | US20130234303 Metal shield for integrated circuits |
| 09/12/2013 | US20130234300 Semiconductor device including a stress buffer material formed above a low-k metallization system |
| 09/12/2013 | US20130234298 Semiconductor device and method for manufacturing same |
| 09/12/2013 | US20130234296 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods |
| 09/12/2013 | US20130234295 Semiconductor device and method of manufacturing same, wiring board and method of manufacturing same, semiconductor package, and electronic device |
| 09/12/2013 | US20130234286 Semiconductor device having high-frequency interconnect |
| 09/12/2013 | US20130234284 Fuse and Integrated Conductor |
| 09/12/2013 | US20130234283 Semiconductor Packages and Methods of Forming The Same |
| 09/12/2013 | US20130234275 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor |
| 09/12/2013 | US20130234260 Interconnect structure for improved time dependent dielectric breakdown |
| 09/12/2013 | US20130234259 Semiconductor device and method of manufacturing the same |
| 09/12/2013 | US20130234199 ESD Protection Circuit |
| 09/12/2013 | US20130234193 Etched trenches in bond materials for die singulation, and associated systems and methods |
| 09/12/2013 | US20130234139 Semiconductor integrated circuit |
| 09/12/2013 | US20130234138 Electrical test structure for determining loss of high-k dielectric material and/or metal gate material |
| 09/12/2013 | US20130233594 Composite wire of silver-gold-palladium alloy coated with metal thin film and method thereof |
| 09/12/2013 | US20130233473 Room temperature metal direct bonding |
| 09/12/2013 | US20130233383 Electronic Device Module Comprising Film of Homogeneous Polyolefin Copolymer and Grafted Silane |
| 09/12/2013 | DE102013204031A1 Schema zum bereichsübergreifenden ESD-Schutz Scheme for cross-sectoral ESD protection |
| 09/12/2013 | DE102013203561A1 Halbleitervorrichtung und herstellungsverfahren hierfür A semiconductor device and manufacturing method thereof |
| 09/12/2013 | DE102013102230A1 Halbleiterpackages und Verfahren zu deren Ausbildung Semiconductor packages and methods of training |
| 09/12/2013 | DE102013102136A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same |
| 09/12/2013 | DE102012224354A1 Halbleitervorrichtung Semiconductor device |
| 09/12/2013 | DE102012222867A1 Defektuntersuchungsverfahren Defect inspection method |
| 09/12/2013 | DE102012203699A1 Semiconductor component e.g. micro-electromechanical component, for use as e.g. mechanical structure, has connection structure whose element is received between connectors such that linkage is formed between component and substrate |
| 09/12/2013 | DE102012203623A1 Verbundsystem zur Verkapselung elektronischer Anordnungen Composite system for encapsulating electronic devices |
| 09/12/2013 | DE102012107756A1 FinFET-basierte ESD-Einheiten und Verfahren zu deren Herstellung FinFET-based ESD units and methods for their preparation |
| 09/12/2013 | DE102012101970A1 Lead frame unit for e.g. LED chip, has contact carrier element formed with halt bar and comprising notches bordering on halt bar, where notches project from halt bar out into contact carrier element |
| 09/12/2013 | DE102007057370B4 Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements mit einem Leiterrahmen An electronic device and method for producing an electronic component with a lead frame |
| 09/11/2013 | EP2637302A1 Microwave semiconductor amplifier |
| 09/11/2013 | EP2637204A1 Package for storing electronic component elements |
| 09/11/2013 | EP2637203A1 Method for forming isolation structure |
| 09/11/2013 | EP2637202A2 Flip chip interconnection with etched posts on a microelectronic element joined to etched posts on a substrate by a fusible metal and corresponding manufacturing method |
| 09/11/2013 | EP2636712A1 Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor device |
| 09/11/2013 | EP2636287A1 Chip-integrated through-plating of multilayer substrates |
| 09/11/2013 | EP2636108A1 High-voltage switch with cooling device |
| 09/11/2013 | EP2636064A1 Connecting elements for producing hybrid electronic circuits |
| 09/11/2013 | EP2636063A2 Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package |
| 09/11/2013 | EP2636062A2 Power semiconductor module and method for producing a sintered power semiconductor module having a temperature sensor |
| 09/11/2013 | EP2636061A1 Laminate comprising an integrated electronic component |
| 09/11/2013 | EP2636058A1 Integrated circuit chip customization using backside access |
| 09/11/2013 | EP2492957B1 Switching assembly |
| 09/11/2013 | DE202013007763U1 Kühlstruktur und tragbares elektronisches Gerät mit dieser Kühlstruktur And cooling structure of portable electronic device with this cooling structure |
| 09/11/2013 | CN203194082U Micro piezoelectric heat dissipation device |
| 09/11/2013 | CN203192859U Heat-dissipating lead frame structure |
| 09/11/2013 | CN203192793U Multi-way valve-driving VMOS mixed membrane integrated chip |
| 09/11/2013 | CN203192792U MOM capacitor with local interconnection metal plates |
| 09/11/2013 | CN203192791U Semiconductor device and communication system comprising same |
| 09/11/2013 | CN203192790U Integrated circuit package |
| 09/11/2013 | CN203192789U Bonding wire used for semiconductor |
| 09/11/2013 | CN203192788U Semiconductor wafer level packaging structure |
| 09/11/2013 | CN203192787U Silicon controlled cooling device used for intermediate frequency furnace |
| 09/11/2013 | CN203192786U Thyristor heat radiation system with independent air channels |
| 09/11/2013 | CN203192785U Thyristor positioning device |
| 09/11/2013 | CN203192784U Enhanced high-thermal-conductivity graphite film structure in electronic terminal |
| 09/11/2013 | CN203192783U Eccentric radiator |
| 09/11/2013 | CN203192782U Main chip installing assembly for linear cutting machine tool stepping motor single-phase driver circuit |
| 09/11/2013 | CN203192781U A packaging substrate strip structure |
| 09/11/2013 | CN203191661U Display screen body with electrostatic protecting structures |
| 09/11/2013 | CN103299723A Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices |
| 09/11/2013 | CN103299721A Method of making an electronic device having a liquid crystal polymer solder mask and related devices |
| 09/11/2013 | CN103299442A Light source mount |
| 09/11/2013 | CN103299421A Semiconductor device and method for producing a semiconductor device |
| 09/11/2013 | CN103299420A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/11/2013 | CN103299419A Conductive pads defined by embedded traces |
| 09/11/2013 | CN103299418A Diamond particle mololayer heat spreaders and associated methods |
| 09/11/2013 | CN103299417A Resin sealed module |
| 09/11/2013 | CN103299410A Electronic component module and electronic component element |
| 09/11/2013 | CN103299408A Manufacturing method for electronic component module, and electronic component module |
| 09/11/2013 | CN103299142A Cooling device for a super conductor and super conducting synchronous machine |
| 09/11/2013 | CN103299128A Cooling system and method for electronic components |
| 09/11/2013 | CN103298855A Polyimide resin composition and laminate including same |
| 09/11/2013 | CN103298612A Insulating substrate, metal-clad laminate, printed wiring board, and semiconductor device |
| 09/11/2013 | CN103298317A 冷却器以及冷却装置 Coolers and cooling devices |
| 09/11/2013 | CN103296866A Semiconductor module with switching elements |
| 09/11/2013 | CN103296115A Metal rack for packaging photovoltaic cell protection module |
| 09/11/2013 | CN103296074A High-power silicon controlled rectifier |
| 09/11/2013 | CN103296037A Contact pad, panel image detector and manufacturing method of panel image detector |
| 09/11/2013 | CN103296019A Semiconductor device and method for manufacturing semiconductor device |
| 09/11/2013 | CN103296016A 半导体模块 Semiconductor Modules |
| 09/11/2013 | CN103296015A Die stacking system and method |
| 09/11/2013 | CN103296014A Fan-out wafer level semiconductor chip three-dimensional stacking packaging structure and technology |
| 09/11/2013 | CN103296013A Formation method of radio frequency components |
| 09/11/2013 | CN103296012A ESD protective system and X-ray flat panel detector |