| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/10/2015 | US8952518 Semiconductor device housing package, and semiconductor apparatus and electronic apparatus including the same |
| 02/10/2015 | US8952517 Package-on-package device and method of fabricating the same |
| 02/10/2015 | US8952516 Multiple die stacking for two or more die |
| 02/10/2015 | US8952515 Signal shifting to allow independent control of identical stacked memory modules |
| 02/10/2015 | US8952514 Semiconductor package |
| 02/10/2015 | US8952513 Stack type semiconductor package and method of fabricating the same |
| 02/10/2015 | US8952512 Wafer-level package structure of light emitting diode and manufacturing method thereof |
| 02/10/2015 | US8952511 Integrated circuit package having bottom-side stiffener |
| 02/10/2015 | US8952510 Semiconductor chip and film and tab package comprising the chip and film |
| 02/10/2015 | US8952509 Stacked multi-chip bottom source semiconductor device and preparation method thereof |
| 02/10/2015 | US8952508 Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
| 02/10/2015 | US8952507 Wiring board and method for manufacturing wiring board |
| 02/10/2015 | US8952506 Through silicon via structure |
| 02/10/2015 | US8952505 Semiconductor device |
| 02/10/2015 | US8952504 Small form factor magnetic shield for magnetorestrictive random access memory (MRAM) |
| 02/10/2015 | US8952503 Organic module EMI shielding structures and methods |
| 02/10/2015 | US8952502 Semiconductor patterning |
| 02/10/2015 | US8952501 Chip package and method for forming the same |
| 02/10/2015 | US8952500 Semiconductor device |
| 02/10/2015 | US8952499 Integrated circuit |
| 02/10/2015 | US8952498 Semiconductor device having plural stacked chips |
| 02/10/2015 | US8952497 Scribe lines in wafers |
| 02/10/2015 | US8952489 Semiconductor package and method for fabricating the same |
| 02/10/2015 | US8952488 Low cost anti-fuse structure |
| 02/10/2015 | US8952487 Electronic circuit arrangement |
| 02/10/2015 | US8952486 Electrical fuse and method of making the same |
| 02/10/2015 | US8952480 Electronic device including thermal sensor and peltier cooler and related methods |
| 02/10/2015 | US8952474 Method of fabricating backside-illuminated image sensor |
| 02/10/2015 | US8952461 Semiconductor device, designing method therefor, and manufacturing method therefor |
| 02/10/2015 | US8952457 Electrostatic discharge protection circuit |
| 02/10/2015 | US8952456 Electrostatic discharge circuit using inductor-triggered silicon-controlled rectifier |
| 02/10/2015 | US8952454 SOI wafer and method of manufacturing the same |
| 02/10/2015 | US8952436 Integrated DRAM memory device |
| 02/10/2015 | US8952424 RF CMOS transistor design |
| 02/10/2015 | US8952383 Test carrier |
| 02/10/2015 | US8952373 Hardmask composition and method of forming patterns and semiconductor integrated circuit device including the patterns |
| 02/10/2015 | US8952288 Method of bonding a member to a support by addition of material, and device for arranging two elements, one on the other |
| 02/10/2015 | US8952271 Circuit board, semiconductor device, and method of manufacturing semiconductor device |
| 02/10/2015 | US8952270 Multilayer wiring board having lands with tapered side surfaces |
| 02/10/2015 | US8952267 Electric connecting structure comprising preferred oriented Cu6Sn5 grains and method for fabricating the same |
| 02/10/2015 | US8952265 Electromagnetic interference noise reduction package board |
| 02/10/2015 | US8952262 Component-incorporated wiring substrate and method of manufacturing the same |
| 02/10/2015 | US8952261 Interconnect-use electronic component and method for producing same |
| 02/10/2015 | US8952108 Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor |
| 02/10/2015 | US8951920 Contact landing pads for a semiconductor device and methods of making same |
| 02/10/2015 | US8951910 Methods for fabricating and forming semiconductor device structures including damascene structures |
| 02/10/2015 | US8951909 Integrated circuit structure and formation |
| 02/10/2015 | US8951908 Method for manufacturing semiconductor device |
| 02/10/2015 | US8951907 Semiconductor devices having through-contacts and related fabrication methods |
| 02/10/2015 | US8951906 Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via |
| 02/10/2015 | US8951905 Semiconductor device and production method thereof |
| 02/10/2015 | US8951904 Integrated circuit package system with post-passivation interconnection and integration |
| 02/10/2015 | US8951891 Deposition substrate of deposition apparatus, method of forming layer using the same, and method of manufacturing organic light emitting diode display device |
| 02/10/2015 | US8951890 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition |
| 02/10/2015 | US8951861 Methods of making a high-density nonvolatile memory |
| 02/10/2015 | US8951848 Circuit substrate for mounting chip, method for manufacturing same and chip package having same |
| 02/10/2015 | US8951846 Controlling thermal interface material bleed out |
| 02/10/2015 | US8951843 Laminated sheet and method of manufacturing semiconductor device using the laminated sheet |
| 02/10/2015 | US8951842 Semiconductor growth substrates and associated systems and methods for die singulation |
| 02/10/2015 | US8951841 Clip frame semiconductor packages and methods of formation thereof |
| 02/10/2015 | US8951839 Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP |
| 02/10/2015 | US8951838 Low cost and ultra-thin chip on wafer on substrate (CoWoS) formation |
| 02/10/2015 | US8951836 Chip package and method for forming the same |
| 02/10/2015 | US8951835 Method of fabricating a package substrate |
| 02/10/2015 | US8951834 Methods of forming solder balls in semiconductor packages |
| 02/10/2015 | US8951833 Defect free deep trench method for semiconductor chip |
| 02/10/2015 | US8951817 Light emitting device chip scale package |
| 02/10/2015 | US8951814 Method of fabricating a flip chip semiconductor die with internal signal access |
| 02/10/2015 | US8951812 Vertically oriented semiconductor device and shielding structure thereof |
| 02/10/2015 | US8951810 Methods for forming interconnection line using screen printing technique |
| 02/10/2015 | US8951445 Bridging arrangement and method for manufacturing a bridging arrangement |
| 02/10/2015 | US8951379 Tape attaching device and tape attaching method |
| 02/10/2015 | US8950653 Metal paste with co-precursors |
| 02/10/2015 | US8950652 Metal paste with oxidizing agents |
| 02/10/2015 | US8950067 Method for manufacturing electronic component device with a Ni—Bi alloy sealing frame |
| 02/05/2015 | WO2015017153A1 Inductive device that includes conductive via and metal layer |
| 02/05/2015 | WO2015016289A1 Wiring base plate and electronic device |
| 02/05/2015 | WO2015016221A1 Elastomer molded article and method for producing same |
| 02/05/2015 | WO2015016173A1 Wiring substrate, wiring substrate with lead, and electronic device |
| 02/05/2015 | WO2015016064A1 Protective film formation-use composite sheet |
| 02/05/2015 | WO2015016053A1 Composite sheet for forming protective film, chip having protective film, and production method for chip having protective film |
| 02/05/2015 | WO2015016017A1 Semiconductor device |
| 02/05/2015 | WO2015016001A1 Curable resin composition and semiconductor device using same |
| 02/05/2015 | WO2015016000A1 Curable resin composition and semiconductor device obtained using same |
| 02/05/2015 | WO2015015982A1 Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing |
| 02/05/2015 | WO2015015980A1 Production method for semiconductor device |
| 02/05/2015 | WO2015015979A1 Production method for semiconductor device, and sealing sheet |
| 02/05/2015 | WO2015015850A1 Module and method for manufacturing same |
| 02/05/2015 | WO2015015746A1 Wiring substrate and method for producing same |
| 02/05/2015 | WO2015015700A1 Semiconductor device for radiation detection |
| 02/05/2015 | WO2015015319A2 Architecture of spare wiring structures for improved engineering change orders |
| 02/05/2015 | WO2015015221A1 Getter composition |
| 02/05/2015 | WO2015014929A1 Evaporator with simplified assembly for diphasic loop |
| 02/05/2015 | WO2015014890A1 Silicone resin composition for optical semiconductors |
| 02/05/2015 | WO2015014799A1 Polyorganosiloxane preparation for optical semiconductors |
| 02/05/2015 | WO2015014563A1 Electronic module |
| 02/05/2015 | WO2015014509A1 Multi-stage sealing system for use in a motor vehicle control unit |
| 02/05/2015 | WO2015014080A1 Array substrate and display device |
| 02/05/2015 | US20150037977 Mask and pattern forming method |
| 02/05/2015 | US20150037971 Chip connection structure and method of forming |