| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/07/1995 | US5387554 Apparatus and method for thermally coupling a heat sink to a lead frame |
| 02/07/1995 | US5387495 Coating top surface of substrate with insulating layer of tetrafluoroethylene, depositing conductive seed layer, lines, patterned layer of posts, removing portions of seed layer, depositing liquid fluorinated hydrocarbon dielectric |
| 02/07/1995 | US5387481 Method of preparing a switchable shield |
| 02/07/1995 | US5387480 High dielectric constant coatings |
| 02/07/1995 | US5387311 Depositing oxide layer on conductive substrate, providing via holes, depositing anti-fuse material over oxide layer and within holes, depositing spacer material, etching, masking, etching |
| 02/07/1995 | US5387118 Socket for IC package |
| 02/07/1995 | US5386870 High thermal conductivity connector having high electrical isolation |
| 02/07/1995 | US5386627 Method of fabricating a multi-layer integrated circuit chip interposer |
| 02/07/1995 | US5386625 Tab type IC assembling method and an IC assembled thereby |
| 02/07/1995 | US5386623 Process for manufacturing a multi-chip module |
| 02/07/1995 | US5386620 Punching and shaping machine tool with cam gear |
| 02/07/1995 | CA2001982C Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same |
| 02/07/1995 | CA1334245C Method and apparatus for coating semiconductor components on a dielectric film |
| 02/02/1995 | WO1995003627A1 Tamper resistant integrated circuit structure |
| 02/02/1995 | WO1995003626A1 Structures for preventing reverse engineering of integrated circuits |
| 02/02/1995 | WO1995003624A1 Coated bonding wires in high lead count packages |
| 02/02/1995 | WO1995003152A1 Shaped lead structure and method |
| 02/02/1995 | DE4418611A1 Halbleiterelementkühlvorrichtung Semiconductor element cooling device |
| 02/02/1995 | DE4325712A1 Method for encapsulating electrical or electronic components or modules, and encapsulation of electrical or electronic components or modules |
| 02/01/1995 | EP0637196A1 Process for manufacturing integrated microcircuits |
| 02/01/1995 | EP0637083A1 Semiconductor device having a reduced wiring area in and out of data path zone |
| 02/01/1995 | EP0637082A1 Integrated circuit devices with solderable lead frame |
| 02/01/1995 | EP0637081A2 Micro sensor with plug connections |
| 02/01/1995 | EP0637080A1 Pressure contact type semiconductor device and assembly method therefor |
| 02/01/1995 | EP0637079A1 Upgradable multi-chip module |
| 02/01/1995 | EP0637078A1 A semiconductor device with improved heat dissipation |
| 02/01/1995 | EP0637077A1 Method for making a substrate structure with improved heat dissipation |
| 02/01/1995 | EP0637076A2 Electronic circuit assembly with improved heatsinking |
| 02/01/1995 | EP0637075A1 Semiconductor device sealed with molded resin |
| 02/01/1995 | EP0637072A2 Spin-on conductor process for integrated circuits |
| 02/01/1995 | EP0637070A1 Perimeter independent precision locating member for a semiconductor chip and method of making said member |
| 02/01/1995 | EP0637069A1 Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
| 02/01/1995 | EP0637060A2 Method for forming isolated intrapolycrystalline silicon structures |
| 02/01/1995 | EP0637032A2 Parallel processor structure and package |
| 02/01/1995 | EP0637031A2 Parallel processor and method of fabrication |
| 02/01/1995 | EP0637030A2 Solder bonded parallel package structure and method of solder bonding |
| 02/01/1995 | EP0636277A1 Reaction resins for potting pressure-sensitive electronic components |
| 02/01/1995 | CN1098226A Known good die array and a manufacturing method thereof |
| 01/31/1995 | US5386430 Excimer laser processing method and apparatus |
| 01/31/1995 | US5386382 Semiconductor memory device and a manufacturing method thereof |
| 01/31/1995 | US5386342 Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device |
| 01/31/1995 | US5386341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape |
| 01/31/1995 | US5386339 Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink |
| 01/31/1995 | US5386338 Heat sink attachment assembly |
| 01/31/1995 | US5386144 Snap on heat sink attachment |
| 01/31/1995 | US5386143 High performance substrate, electronic package and integrated circuit cooling process |
| 01/31/1995 | US5386141 Leadframe having one or more power/ground planes without vias |
| 01/31/1995 | US5386129 Power supply system of semiconductor chip for optimizing impedances of power supply sub-systems associated with outside and inside function blocks |
| 01/31/1995 | US5386088 Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias |
| 01/31/1995 | US5386000 A curable adhesives is a reaction product of cyanate ester with at least one polymer selected from the group consisting of additional polymer, epoxy resins, polyesters, polyurethanes , polyureas, polyethers; coldsetting resins; high strength |
| 01/31/1995 | US5385869 Semiconductor chip bonded to a substrate and method of making |
| 01/31/1995 | US5385868 Upward plug process for metal via holes |
| 01/31/1995 | US5385867 Method for forming a multi-layer metallic wiring structure |
| 01/31/1995 | US5385634 Forming contact window to source/drain electrode which is near gate electrode of integrated circuit, for improved step coverage |
| 01/31/1995 | US5385022 Apparatus and method for deep thermoelectric refrigeration |
| 01/31/1995 | US5384955 Method for replacing IC chip package interposer |
| 01/31/1995 | US5384953 Structure and a method for repairing electrical lines |
| 01/31/1995 | US5384952 Method of connecting an integrated circuit chip to a substrate |
| 01/31/1995 | US5384940 Self-locking heat sinks for surface mount devices |
| 01/31/1995 | CA1334158C Metallization for semiconductor devices |
| 01/26/1995 | WO1995002902A1 Electronic element sealing body |
| 01/26/1995 | WO1995002901A1 Top level via structure for programming prefabricated multi-level interconnect |
| 01/26/1995 | WO1995002563A1 Aluminum nitride sintered body with high thermal conductivity and its preparation |
| 01/26/1995 | WO1995002505A1 Conformal thermally conductive interface material |
| 01/26/1995 | DE4426121A1 Semiconductor device and method for production thereof |
| 01/26/1995 | DE4425550A1 Arrangement with an electrical socket and a covering device |
| 01/26/1995 | DE4420052A1 Method for producing a gate in a semiconductor device |
| 01/26/1995 | DE4324732A1 Insulating cooling casing employing industrial water |
| 01/26/1995 | DE4324214A1 Electrical appliance |
| 01/26/1995 | CA2171548A1 Aluminum nitride sintered body with high thermal conductivity and its preparation |
| 01/25/1995 | EP0635885A1 High density circuit assembly and method of forming the same |
| 01/25/1995 | EP0635871A2 High heat conductive insulated substrate and method of manufacturing the same |
| 01/25/1995 | EP0546172B1 Circuit card assembly conduction converter and method |
| 01/25/1995 | EP0530185B1 Electronics system with direct write engineering change capability |
| 01/25/1995 | EP0416133B1 Resin-coated bonding wire, method of producing the same and semiconductor device |
| 01/24/1995 | US5384731 Semiconductor memory device |
| 01/24/1995 | US5384691 High density interconnect multi-chip modules including embedded distributed power supply elements |
| 01/24/1995 | US5384689 Integrated circuit chip including superimposed upper and lower printed circuit boards |
| 01/24/1995 | US5384687 Cooling structure for electronic circuit package |
| 01/24/1995 | US5384683 Intelligent power device module |
| 01/24/1995 | US5384555 Combined RF and digital/DC signalling interconnect laminate |
| 01/24/1995 | US5384488 Configuration and method for positioning semiconductor device bond pads using additional process layers |
| 01/24/1995 | US5384487 Semiconductor device |
| 01/24/1995 | US5384486 Integrated circuit device having signal wiring structure of ultrahigh-speed performance |
| 01/24/1995 | US5384485 Contact structure for connecting an electrode to a semiconductor |
| 01/24/1995 | US5384483 Planarizing glass layer spaced from via holes |
| 01/24/1995 | US5384481 Multilayer insulating layer, refractories, thin silicon layera and refractory metals |
| 01/24/1995 | US5384480 Surface with shield film, receiver, passivation film, transparent resin and ion blocking layer |
| 01/24/1995 | US5384476 Short channel MOSFET with buried anti-punch through region |
| 01/24/1995 | US5384475 Semiconductor device and method of manufacturing the same |
| 01/24/1995 | US5384434 Multilayer ceramic circuit board |
| 01/24/1995 | US5384288 Method of forming a planarized insulation layer |
| 01/24/1995 | US5384287 Method of forming a semiconductor device having self-aligned contact holes |
| 01/24/1995 | US5384286 Positioning heat sinking frame and lead frame on lower mold, covering with upper mold, injecting resin |
| 01/24/1995 | US5384284 Bonding to a pad a conductive layer and adhesion on layers |
| 01/24/1995 | US5384283 Resist protection of ball limiting metal during etch process |
| 01/24/1995 | US5384270 Method of producing silicon carbide MOSFET |
| 01/24/1995 | US5384204 Tape automated bonding in semiconductor technique |
| 01/24/1995 | US5384181 Fluoropolymer with ceramic fillers and silane coatings |
| 01/24/1995 | US5384155 Silver spot/palladium plate lead frame finish |