| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/23/1995 | DE4328353A1 Multilayer substrate |
| 02/23/1995 | DE4327895A1 Power converter module |
| 02/22/1995 | EP0639859A2 Vertical chip mount memory package and method |
| 02/22/1995 | EP0639541A1 Microwave dielectric ceramic composition and preparing method thereof |
| 02/22/1995 | EP0639293A1 Device for indexing magazine compartments and wafer-shaped objects in the compartments |
| 02/22/1995 | EP0582705A4 Molded ring integrated circuit package. |
| 02/22/1995 | CN1099191A Thin film electrical component |
| 02/21/1995 | US5391931 Protection of integrated circuit devices |
| 02/21/1995 | US5391924 Element encapsulated with an epoxy resin composition |
| 02/21/1995 | US5391923 Tape carrier including leads on both sides and resin-encapsulated semiconductor device incorporating the tape carrier |
| 02/21/1995 | US5391921 Semiconductor device having multi-level wiring |
| 02/21/1995 | US5391920 Semiconductor device having peripheral metal wiring |
| 02/21/1995 | US5391919 Semiconductor power module with identical mounting frames |
| 02/21/1995 | US5391918 Semiconductor device |
| 02/21/1995 | US5391917 For providing processing operations in a computer system |
| 02/21/1995 | US5391916 Resin sealed type semiconductor device |
| 02/21/1995 | US5391915 Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate |
| 02/21/1995 | US5391914 Diamond multilayer multichip module substrate |
| 02/21/1995 | US5391902 Semiconductor device and production method thereof |
| 02/21/1995 | US5391900 Integrated circuit having power trunk line and method for layout of power trunk line |
| 02/21/1995 | US5391841 Laser processed coatings on electronic circuit substrates |
| 02/21/1995 | US5391520 Method for forming local interconnect for integrated circuits |
| 02/21/1995 | US5391517 Metal interface; prevention diffusion of copper into dielectric |
| 02/21/1995 | US5391513 Wet/dry anti-fuse via etch |
| 02/21/1995 | US5391439 Leadframe adapted to support semiconductor elements |
| 02/21/1995 | US5391394 Forming optically opaque refractory metal layer on exposed silicon regions of wafer, heating in chemical vapor deposition chamber while supplying reducing and metal-containing gases to form barrier layer, annealing to form silicide at interface |
| 02/21/1995 | US5390734 Heat sink |
| 02/16/1995 | WO1995005005A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
| 02/16/1995 | DE4428158A1 Optoelectronic interface module and method for the production thereof |
| 02/16/1995 | DE4327335A1 Mounting construction for a cooling device |
| 02/16/1995 | DE4327104A1 Device for connecting and holding a chip structure |
| 02/16/1995 | DE4326663A1 Arrangement for cooling electronic components |
| 02/15/1995 | EP0748261A4 Layered chip structure |
| 02/15/1995 | EP0639044A2 Heat conducting foil |
| 02/15/1995 | EP0638936A1 Gate array LSI |
| 02/15/1995 | EP0638932A2 Semiconductor circuit device capable of reducing influence of a parasitic capacitor |
| 02/15/1995 | EP0638931A2 Multi-chip module |
| 02/15/1995 | EP0638930A1 Novel TiSi2/TiN clad interconnect technology |
| 02/15/1995 | EP0638929A1 Heat sink for plastic package |
| 02/15/1995 | EP0638928A1 Power semiconductor device with pressure contact |
| 02/15/1995 | EP0638926A1 Process of fabricating semiconductor unit employing bumps to bond two components |
| 02/15/1995 | EP0638925A1 Method for making a semiconductor device package |
| 02/15/1995 | EP0638924A1 Process for fabricating TAB tape carriers |
| 02/15/1995 | CN1098844A Electronic circuit assembly with improved heatsinking |
| 02/15/1995 | CN1098822A Packaged electronic device having outer leads fixedly supported by insulator and method of fabricating same |
| 02/15/1995 | CN1098733A Composition and method for encapsulating a solar cell which minimizes thermal discoloration |
| 02/14/1995 | US5390082 Chip carrier with protective coating for circuitized surface |
| 02/14/1995 | US5390079 Tape carrier package |
| 02/14/1995 | US5390077 Integrated circuit cooling device having internal baffle |
| 02/14/1995 | US5390076 Cooling structure for integrated circuits |
| 02/14/1995 | US5389904 Surface-mountable, frequency selective microwave IC package |
| 02/14/1995 | US5389820 IC carrier |
| 02/14/1995 | US5389819 Socket for an IC carrier having a flexible wiring sheet superimposed over an IC body and an elastic backup member elastically pressing the flexible wiring sheet into contact with the IC body |
| 02/14/1995 | US5389818 Lead frame |
| 02/14/1995 | US5389817 Semiconductor device having a flat jumper lead |
| 02/14/1995 | US5389816 Multi-layer lead frame using a metal-core substrate |
| 02/14/1995 | US5389814 Electrically blowable fuse structure for organic insulators |
| 02/14/1995 | US5389739 Electronic device packaging assembly |
| 02/14/1995 | US5389738 Tamperproof arrangement for an integrated circuit device |
| 02/14/1995 | US5389577 Leadframe for integrated circuits |
| 02/14/1995 | US5389576 Method of processing a polycide structure |
| 02/14/1995 | US5389570 Thermal deposition of higher order silane gas and diborane gas |
| 02/14/1995 | US5389403 Applying aqueous composition of water soluble thermoplastic resin, water insoluble polymer dispersion, glycol drying retarder, conductive particles to substrate, thermally curing |
| 02/14/1995 | US5389400 Densifying preform of interwoven vapor grown carbon fibers by depositing pyrolytic carbon in interstices, depositing polycrystalline diamond film on carbon/carbon composite |
| 02/14/1995 | US5389191 Mounting apparatus for deploying an electronic component mounts formed on a tape carrier |
| 02/14/1995 | US5388635 Compliant fluidic coolant hat |
| 02/14/1995 | US5388577 Electrode array microchip |
| 02/14/1995 | CA2080601C Electronics system with direct engineering change capability |
| 02/14/1995 | CA2076774C Pin-fin heat sink including flow enhancement |
| 02/09/1995 | WO1995004448A1 Low impedance interconnection for power devices |
| 02/09/1995 | WO1995004165A1 High thermal conductivity, matched cte, low density composite |
| 02/09/1995 | DE4427994A1 Metallbasisplatine und elektronische Einrichtung, die diese verwendet Metal base circuit board, and electronic device that uses this |
| 02/09/1995 | DE4426449A1 Semiconductor assembly |
| 02/09/1995 | DE4417586A1 Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern Family of removable hybrid arrays of different sizes with microwave bandwidth connectors |
| 02/09/1995 | DE4325458A1 Support element for an IC module |
| 02/08/1995 | EP0637846A2 Metal crossover in high voltage IC with graduated doping control |
| 02/08/1995 | EP0637841A2 Thin film semiconductor device and fabrication method |
| 02/08/1995 | EP0637840A1 Integrated circuit with active devices under bond pads |
| 02/08/1995 | EP0637839A2 Chip carrier with protective coating for circuitized surface |
| 02/08/1995 | EP0637828A2 Multilayer electronic component, method of manufacturing the same and method of measuring characteristics of the same |
| 02/08/1995 | EP0637752A2 Socket apparatus |
| 02/08/1995 | CN1098588A Multilayered metallic printed board and molded module |
| 02/08/1995 | CN1098558A Flagless semiconductor device and method for making the same |
| 02/08/1995 | CN1098557A Semiconductor device having X-shaped die support member and method for making the same |
| 02/08/1995 | CN1098545A Semiconductor memery equipment |
| 02/08/1995 | CN1027610C Refractory metal capped low resistivity metal conductor lines and vias |
| 02/07/1995 | US5388055 Semiconductor integrated circuit having polycell structure and method of designing the same |
| 02/07/1995 | US5388029 Semiconductor chip carrier capable of stably mounting a semiconductor chip |
| 02/07/1995 | US5388028 Low impedance interconnection assembly for high frequency switching power semiconductor devices and low inductance modular capacitor |
| 02/07/1995 | US5388027 Electronic circuit assembly with improved heatsinking |
| 02/07/1995 | US5387888 High frequency ceramic multi-layer substrate |
| 02/07/1995 | US5387830 Semiconductor device with excess current prevention circuit |
| 02/07/1995 | US5387817 Semiconductor device |
| 02/07/1995 | US5387816 Hybrid integrated circuit device |
| 02/07/1995 | US5387815 Semiconductor chip module |
| 02/07/1995 | US5387814 Integrated circuit with supports for mounting an electrical component |
| 02/07/1995 | US5387812 Electrically programmable antifuse having a metal to metal structure |
| 02/07/1995 | US5387776 Method of separation of pieces from super hard material by partial laser cut and pressure cleavage |
| 02/07/1995 | US5387762 Resin-packaged electronic component having bent lead terminals |
| 02/07/1995 | US5387560 Glasses for substrates intended for electronics and resultant products |