Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1995
03/14/1995US5397915 Semiconductor element mounting die pad including a plurality of extending portions
03/14/1995US5397910 Semiconductor integrated circuit device with wiring microstructure formed on gates and method of manufacturing the same
03/14/1995US5397864 Wiring board and a method for producing the same
03/14/1995US5397862 Horizontally twisted-pair planar conductor line structure
03/14/1995US5397747 Vertical chip mount memory package and method
03/14/1995US5397746 Quad flat package heat slug composition
03/14/1995US5397745 Method of making electronic power device realized by a series of elementary semiconductor components connected in parallel
03/14/1995US5397743 Method of making a semiconductor device
03/14/1995US5397741 Polysilsesquioxane overcoating, improved chemical mechanical polishing results
03/14/1995US5397735 Process for hardening active electronic components against ionizing radiations, and hardened components of large dimensions
03/14/1995US5397598 Electronics
03/14/1995US5396947 Radiating device
03/14/1995US5396702 Method for forming solder bumps on a substrate using an electrodeposition technique
03/14/1995US5396701 Method for packaging an integrated circuit
03/09/1995WO1995006957A1 Radiating plate and cooling method using same
03/09/1995WO1995006955A1 A twisted-pair planar conductor line off-set structure
03/09/1995WO1995006946A1 A horizontally twisted-pair planar conductor line structure
03/09/1995WO1995006839A1 Heat insulating plate and heat insulating method using same
03/09/1995DE4338107C1 Semiconductor module
03/09/1995DE4329936A1 Plug-in multichip module with integrated cooling system
03/08/1995EP0642166A2 On circuit board mounted multichip module
03/08/1995EP0642165A2 Hybrid frame
03/08/1995EP0642164A2 Stackable vertical thin package/plastic molded lead-on-chip memory cube
03/08/1995EP0642163A1 Three dimensional electronic components assembly method by means of microwire loops and solder elements
03/08/1995EP0642161A1 Semiconductor apparatus having wiring structure of an integrated circuit in which a plurality of logic circuits of the same structure are arranged in the same direction
03/08/1995EP0642160A1 Semiconductor device with improved support means
03/08/1995EP0642156A2 Improved encapsulated semiconductor chip module and method of forming the same
03/08/1995EP0641485A1 Membrane dielectric isolation ic fabrication
03/08/1995EP0549627B1 Sealing and adhesive compounds with special plasticizers
03/07/1995US5396451 DRAM device having cells staggered along adjacent rows and sources and drains aligned in a column direction
03/07/1995US5396404 Heat sinking assembly for electrical components
03/07/1995US5396403 Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
03/07/1995US5396402 Appliance for attaching heat sink to pin grid array and socket
03/07/1995US5396397 Field control and stability enhancement in multi-layer, 3-dimensional structures
03/07/1995US5396198 Electronic circuit device having a series connection of resistor and capacitance as a noise reducing circuit connected to a power source wiring
03/07/1995US5396104 Resin coated bonding wire, method of manufacturing the same, and semiconductor device
03/07/1995US5396102 Semiconductor device
03/07/1995US5396101 Inductance element
03/07/1995US5396034 Thin film ceramic multilayer wiring hybrid board
03/07/1995US5396032 Method and apparatus for providing electrical access to devices in a multi-chip module
03/07/1995US5395800 Method for assembling semiconductor devices with lead frame containing common lead arrangement
03/07/1995US5395798 Refractory metal silicide deposition process
03/07/1995US5395797 Antifuse structure and method of fabrication
03/07/1995US5395795 Method for fabricating a semiconductor device
03/07/1995US5395783 Electronic device and process achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10
03/07/1995US5395679 Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
03/07/1995US5395269 Method of sealing electrical connectors using a broad spectrum light and heat curable composition
03/07/1995US5395260 IC socket
03/07/1995US5395255 IC socket
03/07/1995US5395254 IC socket
03/07/1995US5395037 Method and apparatus for performing wire bonding by using solder wire
03/07/1995US5394936 High efficiency heat removal system for electric devices and the like
03/07/1995US5394751 Method of producing semiconductor pressure sensor
03/07/1995US5394675 Method for mounting a semiconductor chip
03/07/1995US5394607 Method of providing low cost heat sink
03/02/1995WO1995006329A1 Semiconductor device and its manufacture
03/02/1995WO1995006085A1 Semiconductor device
03/02/1995DE4429922A1 Polarised electronic component for surface mounting
03/02/1995DE4427357A1 Electronic distributor-like ignition device
03/02/1995DE4328474A1 Structure for connecting a plurality of layers of a semiconductor device
03/01/1995EP0641046A1 Apparatus for modifying an electrical signal
03/01/1995EP0641034A2 Interconnection structure for crosstalk reduction to improve off-chip selectivity
03/01/1995EP0641023A1 Convertible cooling module for air or water cooling of electronic circuit components
03/01/1995EP0641019A2 A flexible printed polymer lead-frame
03/01/1995EP0640245A1 Bumpless bonding process having multilayer metallization
03/01/1995EP0640151A1 Solder bumping of integrated circuit die.
03/01/1995EP0609432A4 Power semiconductor packaging.
03/01/1995EP0532543B1 Sog with moisture resistant protective capping layer
03/01/1995EP0518908B1 Method for polymerization of epoxide compounds
03/01/1995EP0448686B1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact
03/01/1995EP0364566B1 Low stress liquid cooling assembly
03/01/1995CN2190824Y Wide view angle light emitting diode with reflective cup
03/01/1995CN1099520A Package for a skmiconductor device
03/01/1995CN1099518A Heat-resistant adhesive
02/1995
02/28/1995US5394303 Semiconductor device
02/28/1995US5394301 Arrangement for dissipating heat from power components assembled on a printed-circuit board
02/28/1995US5394299 Topology matched conduction cooling module
02/28/1995US5394298 Semiconductor devices
02/28/1995US5394101 Method for detecting mobile ions in a semiconductor device
02/28/1995US5394032 Programming details of a programmable circuit
02/28/1995US5394014 Semiconductor device improved in light shielding property and light shielding package
02/28/1995US5394013 Semiconductor device with an elevated bonding pad
02/28/1995US5394012 Semiconductor device and manufacturing method of the same
02/28/1995US5394011 Package structure for semiconductor devices and method of manufacturing the same
02/28/1995US5394010 Semiconductor assembly having laminated semiconductor devices
02/28/1995US5394009 Tab semiconductor package with cushioned land grid array outer lead bumps
02/28/1995US5394008 Semiconductor integrated circuit device
02/28/1995US5393715 Aluminum nitride sintered body and method of preparing the same
02/28/1995US5393705 Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof
02/28/1995US5393703 Using electroconductive alloy containing aluminum with controlled low concentrations of nickel and chromium (silicon-free) as connector
02/28/1995US5393701 Layout design to eliminate process antenna effect
02/28/1995US5393700 Forming three metal layers and highly reflective layer on semiconductor substrate above intermetal dielectric and metal interconnect layer, patterning, forming passivation layer, etching to expose reflector plate
02/28/1995US5393699 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride
02/28/1995US5393697 Composite bump structure and methods of fabrication
02/28/1995US5393696 Method for forming multilayer indium bump contacts
02/28/1995US5393489 High temperature, lead-free, tin based solder composition
02/28/1995US5392980 Method and apparatus for reworking ball grid array packages to allow reuse of functional devices
02/23/1995WO1995005678A1 Methods for fabrication of thin film inductors, inductor networks and integration with other passive and active devices, and the resultant devices
02/23/1995WO1995005675A1 Method of forming electrically conductive polymer interconnects on electrical substrates
02/23/1995DE4428170A1 Anordnung aus Federklemme und Kühlkörper Arrangement of spring clamp and heat sink
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