Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1995
03/29/1995EP0644909A1 Process for coating a substrate with a silicon and zirconium based lacquer
03/29/1995EP0644806A1 Multipin structures
03/29/1995EP0644803A1 Flame retardant epoxy molding compound
03/28/1995USRE34887 Ceramic multilayer circuit board and semiconductor module
03/28/1995US5402318 Semiconductor integrated circuit device
03/28/1995US5402313 Electronic component heat sink attachment using a canted coil spring
03/28/1995US5402255 Liquid crystal panel module and tape carrier package for liquid crystal driver IC
03/28/1995US5402006 Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
03/28/1995US5402005 Semiconductor device having a multilayered wiring structure
03/28/1995US5402004 Heat transfer module for ultra high density and silicon on silicon packaging applications
03/28/1995US5402003 Low dielectric constant interconnect for multichip modules
03/28/1995US5401913 Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
03/28/1995US5401912 Microwave surface mount package
03/28/1995US5401910 Electronic component
03/28/1995US5401909 Printed circuit board with locally enhanced wiring density
03/28/1995US5401691 Method of fabrication an inverse open frame alignment mark
03/28/1995US5401689 Method for forming a semiconductor chip carrier
03/28/1995US5401688 Semiconductor device of multichip module-type
03/28/1995US5401687 Packaging
03/28/1995US5401672 Process of bonding semiconductor wafers having conductive semiconductor material extending through each wafer at the bond areas
03/28/1995US5401536 Method of providing moisture-free enclosure for electronic device
03/23/1995WO1995008189A1 Multi-chip module
03/23/1995WO1995008188A1 Flip chip in metal electronic packages
03/23/1995DE4433695A1 Dynamic semiconductor memory device
03/23/1995DE4433503A1 Semiconductor component with semiconductor chip and method for its production
03/23/1995DE4425351A1 Method for producing a high-melting metal silicide in a semiconductor component
03/23/1995DE4400532C1 Method for producing liquid contacts in contact holes
03/23/1995DE4332115A1 Arrangement for extracting heat from a printed circuit board which has at least one heat sink
03/22/1995EP0644611A1 Socket with improved contact element
03/22/1995EP0644596A1 Method for multi-layer printed wiring board design
03/22/1995EP0644595A1 Semiconductor device with noise suppression
03/22/1995EP0644594A1 Power supply wiring for semiconductor device
03/22/1995EP0644593A2 Semiconductor module
03/22/1995EP0644592A1 Microelectronic device package containing a liquid and method
03/22/1995EP0644587A1 Semiconductor package and fabrication method
03/22/1995EP0644579A2 Semiconductor device burn-in apparatus
03/22/1995EP0644507A1 Manufacturing method and device for a chip-card module, chip-card modules and chip-card
03/22/1995EP0644216A1 Naphthalene-ring resin, resin composition, and cured product thereof
03/22/1995EP0643883A1 Sub-nanoscale electronic systems, devices and processes
03/22/1995EP0630521A4 Three dimensional, multi-chip module.
03/22/1995EP0619935A4 Multi-layer circuit construction methods and structures with customization features and components for use therein.
03/22/1995EP0593529A4 Programmable interconnect structures and programmable integrated circuits.
03/21/1995US5400344 Semiconductor device with function of testing insulation defect between bit lines and testing method therefor
03/21/1995US5400262 Universal interconnect matrix array
03/21/1995US5400219 Tape automated bonding for electrically connecting semiconductor chips to substrates
03/21/1995US5400210 Multilayer dielectric with insulator of silicon nitride and silicon carbide ceramic
03/21/1995US5400003 Inherently impedance matched integrated circuit module
03/21/1995US5399907 Semiconductor with flexible polymer substrate
03/21/1995US5399906 High-frequency hybrid semiconductor integrated circuit structure including multiple coupling substrate and thermal dissipator
03/21/1995US5399905 Resin sealed semiconductor device including multiple current detecting resistors
03/21/1995US5399904 Array type semiconductor device having insulating circuit board
03/21/1995US5399903 Semiconductor device having an universal die size inner lead layout
03/21/1995US5399902 Semiconductor chip packaging structure including a ground plane
03/21/1995US5399898 Multi-chip semiconductor arrangements using flip chip dies
03/21/1995US5399888 Photo-shield structure of charge-coupled device
03/21/1995US5399847 Card comprising at least one electronic element
03/21/1995US5399809 Multi-layer lead frame for a semiconductor device
03/21/1995US5399805 Metal electronic package with reduced seal width
03/21/1995US5399804 Semiconductor device and method of producing the same
03/21/1995US5399648 High-purity silicone ladder polymer and process producing the same
03/21/1995US5399532 Integrated circuit window etch and planarization
03/21/1995US5399530 Method of forming interconnection structure to prevent outgassing
03/21/1995US5399529 Multilevel interconnect
03/21/1995US5399528 Multi-layer fabrication in integrated circuit systems
03/21/1995US5399527 Method of forming multilayer aluminum wiring in semiconductor IC
03/21/1995US5399526 Method of manufacturing semiconductor device by forming barrier metal layer between substrate and wiring layer
03/21/1995US5399441 Method of applying opaque coatings
03/21/1995US5399416 Heat-conductive adhesive films, laminates with heat-conductive adhesive layer and the use thereof
03/21/1995US5399235 Method of manufacturing a semiconductor device in which a surface of a semiconductor body is provided with mutually-insulated aluminum tracks
03/21/1995US5399230 Method and apparatus for etching compound semiconductor
03/21/1995US5398863 Shaped lead structure and method
03/21/1995US5398748 Heat pipe connector and electronic apparatus and radiating fins having such connector
03/16/1995WO1995007547A1 Two-phase component cooler
03/16/1995WO1995007441A1 Apparatus and method for deep thermoelectric refrigeration
03/15/1995EP0643421A2 Semiconductor device and associated fabrication method
03/15/1995EP0643404A2 Inductive structures for semiconductor integrated circuits
03/15/1995EP0643403A2 Inductive structures for semiconductor integrated circuits
03/15/1995EP0643402A2 Inductive structures for semiconductor integrated circuits
03/15/1995EP0643396A2 Pastes for coating substrates, process for their manufacture and application
03/15/1995EP0643366A2 Electronic modul for cards and production of such module
03/15/1995EP0642919A1 Laminate and multilayer printed circuit board
03/15/1995EP0642703A1 Electric machine with semiconductor valves.
03/15/1995EP0642699A1 Process for the manufacture of a solid-state device including at least one chip, and corresponding device
03/15/1995EP0642698A1 Fluid-cooled power transistor arrangement.
03/15/1995EP0634053A4 METHOD AND STRUCTURE FOR SUPPRESSING CHARGE LOSS IN EEPROMs/EPROMs AND INSTABILITIES IN SRAM LOAD RESISTORS.
03/15/1995EP0500750B1 A method for housing a tape-bonded electronic device and the package employed
03/15/1995CN1100013A A process and an apparatus for forming a profiled element
03/15/1995CN1027946C Electrode for semiconductor element and semiconductor device having electrode and process for producing same
03/15/1995CN1027945C Electronic detail mounting module
03/14/1995US5398166 Electronic component and mounting structure thereof
03/14/1995US5398165 Electronic circuit component and mounting method therefor
03/14/1995US5398160 Compact power module with a heat spreader
03/14/1995US5398128 Resin coating retains flexibility after cure
03/14/1995US5397939 Programming of antifuses
03/14/1995US5397933 Laser diode driving circuit having a temperature compensation circuit
03/14/1995US5397921 Package for a semiconductor die
03/14/1995US5397919 Heat sink assembly for solid state devices
03/14/1995US5397918 Ceramic package for housing a semiconductor device
03/14/1995US5397917 Semiconductor package capable of spreading heat
03/14/1995US5397916 Semiconductor device including stacked die
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