| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/1995 | EP0647357A1 Semiconductor chip encapsulation method, device produced by this method and its application to three dimensional chip interconnection |
| 04/12/1995 | EP0570424A4 Carrier ring for semiconductor packages. |
| 04/12/1995 | EP0551512B1 Tape for tab |
| 04/12/1995 | CN2194547Y Integral semi-conductor rectification bridge block |
| 04/12/1995 | CN1101367A Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same |
| 04/12/1995 | CN1028195C Radiator assembly for substrate |
| 04/11/1995 | US5406630 Tamperproof arrangement for an integrated circuit device |
| 04/11/1995 | US5406125 Semiconductor device having a metalized via hole |
| 04/11/1995 | US5406122 Microelectronic circuit structure including conductor bridges encapsulated in inorganic dielectric passivation layer |
| 04/11/1995 | US5406121 Semiconductor device having improved interconnection wiring structure |
| 04/11/1995 | US5406120 Hermetically sealed semiconductor ceramic package |
| 04/11/1995 | US5406119 Lead frame |
| 04/11/1995 | US5406118 For performing logic operations |
| 04/11/1995 | US5406117 Radiation shielding for integrated circuit devices using reconstructed plastic packages |
| 04/11/1995 | US5406116 Semiconductor device |
| 04/11/1995 | US5406114 Bipolar high-frequency transistor |
| 04/11/1995 | US5406107 Static semiconductor memory device having capacitors for increased soft error immunity |
| 04/11/1995 | US5406100 Semiconductor integrated circuit device having multi-contact wiring structure |
| 04/11/1995 | US5406028 Packaged semiconductor device having stress absorbing film |
| 04/11/1995 | US5406025 VLSI-chips package with floatingly mounted chip means |
| 04/11/1995 | US5405810 Alignment method and apparatus |
| 04/11/1995 | US5405808 Disipation heat from silicon chip packages |
| 04/11/1995 | US5405804 Method of manufacturing a semiconductor device by laser annealing a metal layer through an insulator |
| 04/11/1995 | US5405562 Process of making a coated substrate having closed porosity |
| 04/06/1995 | WO1995009521A1 Local hardening method of a semiconductor integrated circuit |
| 04/06/1995 | WO1995009459A1 Tab testing of area array interconnected chips |
| 04/06/1995 | WO1995009438A1 Three-dimensional processor using transferred thin film circuits |
| 04/06/1995 | WO1995009437A1 Method for assembling an electronic package |
| 04/06/1995 | WO1995009436A1 Patterned array of uniform metal microbeads |
| 04/06/1995 | WO1995009367A1 Built-in electronic sensor for the characterization of physical quantities and method of production |
| 04/06/1995 | WO1995009339A1 Package clip on heat sink |
| 04/06/1995 | DE4333905A1 Integrated CMOS circuit with redundant conductor routing |
| 04/06/1995 | CA2173123A1 Three-dimensional processor using transferred thin film circuits |
| 04/06/1995 | CA2171190A1 Patterned array of uniform metal microbeads |
| 04/05/1995 | EP0646966A1 Programmable semiconductor device and programmable semiconductor memory comprising such a semiconductor device |
| 04/05/1995 | EP0646963A1 Multi-chip module and manufacturing method thereof |
| 04/05/1995 | EP0646961A2 A lead frame structure and a method for manufacturing a semiconductor package device using the lead frame structure |
| 04/05/1995 | EP0646960A1 Semiconductor device with a semiconductor element provided in a mesa structure |
| 04/05/1995 | EP0646959A1 Metallization and bonding process for manufacturing power semiconductor devices |
| 04/05/1995 | EP0646958A2 Semiconductor package and module and method for fabricating |
| 04/05/1995 | EP0646955A2 Apparatus for encapsulating a semiconductor element mounted on a heat sink with plastic |
| 04/05/1995 | EP0646954A2 Low-defect one-step etching process |
| 04/05/1995 | EP0646287A1 Electronic apparatus with improved thermal expansion match |
| 04/05/1995 | EP0646048A1 Electrically conductive compositions and methods for the preparation and use thereof |
| 04/04/1995 | US5404581 Microwave . millimeter wave transmitting and receiving module |
| 04/04/1995 | US5404402 Clock frequency modulation for secure microprocessors |
| 04/04/1995 | US5404368 Semiconductor optical apparatus having an improved precision for the optical beam position |
| 04/04/1995 | US5404273 Semiconductor-device package and semiconductor device |
| 04/04/1995 | US5404265 Interconnect capacitors |
| 04/04/1995 | US5404239 Liquid crystal display with flexible circuit holding driver circuit having notches for engaging curable member |
| 04/04/1995 | US5404047 Semiconductor die having a high density array of composite bond pads |
| 04/04/1995 | US5404046 Flat semiconductor wiring layers |
| 04/04/1995 | US5404045 Semiconductor device with an electrode pad having increased mechanical strength |
| 04/04/1995 | US5404044 Parallel process interposer (PPI) |
| 04/04/1995 | US5404029 Electrically programmable antifuse element |
| 04/04/1995 | US5403975 Anodized aluminum electronic package components |
| 04/04/1995 | US5403785 Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby |
| 04/04/1995 | US5403784 Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template |
| 04/04/1995 | US5403783 Integrated circuit substrate with cooling accelerator substrate |
| 04/04/1995 | US5403782 Surface mountable integrated circuit package with integrated battery mount |
| 04/04/1995 | US5403779 Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD |
| 04/04/1995 | US5403778 Semiconductors |
| 04/04/1995 | US5403777 Semiconductor bond pad structure and method |
| 04/04/1995 | US5403776 Process of using a jig to align and mount terminal conductors to a semiconductor plastic package |
| 04/04/1995 | US5403769 Process for producing a semiconductor device |
| 04/04/1995 | US5403753 Method of forming implant indicators for implant verification |
| 04/04/1995 | US5403729 Fabricating a semiconductor with an insulative coating |
| 04/04/1995 | US5403700 Method of making a thin film electrical component |
| 04/04/1995 | US5403650 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
| 04/04/1995 | US5403466 Patterning resist layer on sheet, plating, patterning second resist layer, etching |
| 04/04/1995 | US5403400 Heat sink method of manufacturing the same and device of manufacturing the same |
| 04/04/1995 | US5403389 Silver flakes, glass frit and liquid organic vehicle consists of mixture of solvents having high intrinsic viscosity and good wetability, including higher alcohol, ester, polyglycols, lower siloxane oligomers and higher glcols |
| 03/30/1995 | WO1995008856A1 Method of forming interface between die and chip carrier |
| 03/30/1995 | WO1995008844A1 Cooling device for a power semiconductor module |
| 03/30/1995 | WO1995008842A1 Integrated circuit package having a lid that is specially adapted for attachment by a laser |
| 03/30/1995 | WO1995008841A1 Process for making multilevel interconnections of electronic components |
| 03/30/1995 | WO1995008839A1 Barrier enhancement at the sialicide layer |
| 03/30/1995 | DE4434105A1 Semiconductor device with improved immunity to short-circuiting on a power supply line and method of repairing a semiconductor device |
| 03/30/1995 | DE4433521A1 Optical semiconductor device |
| 03/30/1995 | DE4430022A1 Electronic component in a synthetic resin casing |
| 03/30/1995 | DE4332783A1 Configurable electronic component for surface mounting |
| 03/30/1995 | DE4332639A1 Method for mounting a thin semiconductor die on a sheet-type substrate |
| 03/29/1995 | EP0645953A1 Method of producing a two or multilayer wiring structure and two or multilayer structure made thereof |
| 03/29/1995 | EP0645952A1 Method of manufacturing a multilayer circuit |
| 03/29/1995 | EP0645827A2 Optocoupler and process of manufacturing the same |
| 03/29/1995 | EP0645823A1 Four layer overvoltage protection diode |
| 03/29/1995 | EP0645819A2 Semiconductor device capable of high speed operation and being integrated with high density |
| 03/29/1995 | EP0645816A1 Semiconductor device comprising a plurality of semiconductor elements |
| 03/29/1995 | EP0645815A2 High power semiconductor switch module |
| 03/29/1995 | EP0645814A2 Semiconductor power switching device module |
| 03/29/1995 | EP0645813A2 A method for applying adhesive to microelectronic chips |
| 03/29/1995 | EP0645812A1 Resin-sealed semiconductor device |
| 03/29/1995 | EP0645811A2 Semiconductor device having semiconductor chip with backside electrode |
| 03/29/1995 | EP0645810A1 Package for semiconductor chip |
| 03/29/1995 | EP0645807A1 Semiconductor device |
| 03/29/1995 | EP0645806A1 Semiconductor device |
| 03/29/1995 | EP0645805A2 Method for mounting a semiconductor device on a circuit board, and a circuit board with a semiconductor device mounted thereon |
| 03/29/1995 | EP0645804A2 Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient similar to that of semiconductor and method for manufacturing the same |
| 03/29/1995 | EP0645471A1 Stacked thin film assembly and method of forming same |
| 03/29/1995 | EP0644914A1 Inorganic fillers and organic matrix materials whose refractive index is adapted |